PSASP-IEEE 14-bus 模型

坐标转换：已知n个点在a,b两坐标系中的坐标值，采用优化方法求转换关系（标准的7参数转换关系，x,y,z的移动，x,y,z的旋转，以及缩放系数）ps:附带空间旋转公式。input: points in A and B。 output：transfer relationship （u,v,w: shit of x,y,z。 a,b,g: rotate of x,y,z 。k：zoom）

TMS320C6678开发板历程,内含CCS5.3软件使用入门广州创龙电子刑技有限公司Guangzhou Tron ong Electronic Technology co, LtdTron添加基于的软件中断(有条件触发)例程添加基于的软件中断(有条件触发)例程。添加基于的软件中断(无条件触发)例程基于裸机的输出(灯)例程。基于裸机的输入(按键中断)例程基于裸机的串口査询收发例程添加基于平台库的总线测试例程。添加基于平台库的风扇控制例程。添加基于平台库的按键状态查询例程。添加基于平台库的灯控制例程。添加基于平台库的总线读写例程。添加基于平台库的总线温度传感器例程添加基于平台库的内存读写例程。添加基于平台库的总线测试例程。添加基于平台库的串口查询收发例程。添加不使用操作系统工程模板。添加基于操作系统(是依赖的平台组件)工程模板。广州创龙电子刑技有限公司Guangzhou Tron ong Electronic Technology co, LtdTron目广州创龙电子刑技有限公司Guangzhou Tron ong Electronic Technology co, LtdTron目录基于仿真器的程序加载与烧写查看仿真器是否安装成功设置工程配置文件信息加载文件连接开发板加载程序镜像文件烧写程序到工程新建、编译和导入裸机工程新建新建工程编写程序编详和运行程序工程新建新建平台新建工程工程导入和编译步骤开启多线程编译算法例程演示-有限长单位冲激响应滤波器无限脉冲响应数字滤波器—快速傅甲叶变换逆变换图像离散余弦变换图像转灰度边缘检测灰度图像直方图灰度图像二值化图像旋转广州创龙电子刑技有限公司Guangzhou Tron ong Electronic Technology co, LtdTron图像缩放图像反色直方图均衡化灰度图像线性变换一数学函数库一矩阵运算基于的例程演示时钟任务抢占式多任务一静态创建任务定时器(通用)定时器(专用)定时器(动态创建)硬件中断(设备专用组件)硬件中断(挂钩函数)硬件中断(中断嵌套)硬件中断()硬件中卷(发布软件中断)硬件中断(铀发任务)内存分配软件中断(静态配置)一软件中断()一软件中断(有条件触发软件中断(有条件触发钦件中断(无条件触发)裸机开发例程演示输出(灯)广州创龙电子刑技有限公司Guangzhou Tron ong Electronic Technology co, LtdTron输入(按键中断)串口查询收发基于平台库例程演示总线测试一风扇控制按键状态耷询灯控制总线读写6.6总线温度传感器测试内存读写测试总线测试6.9串口查询收发工程模板7.1不使用操作系统使用 SYSBIO0S操作系统附录广州创龙电子刑技有限公司Guangzhou Tron ong Electronic Technology co, LtdTron备注●如实验无特别说明,默认都是使用作为调试串口●如实验无特别说明,表示广州创龙系列(包含)开发板均攴持对应实验,厂州创龙系列开发板共用此用户手册,由于各个开发板之问的硬件资源在差异,因此有部分实验需要在特定的开发板上完成。基于仿真器的程序加载与烧写11查看仿真器是否安装成功如下的廾发,均以仿真器为例。开发板断电,连接好仿真器和开发板,并将仿真器的口捕进电脑插槽,开发板上电。冇击计算机图标,点击“设备通用串行总线控制器”或者“设备端口”,查看是否有对应的仿真器的选项出现,如有说明仿真器驱动已经正常安装,否则请先正确安装设备管理器文件(操作(A)查看帮(H伞中回国|区回bWSD打印提头程同便携设备围传器磁动器p打印队列满口COM和LPg XDW XDS2xox Uscr CDC Scrial Port(COM15监视人体学输入设备声合。视礼游空制聶邑图广州创龙电子刑技有限公司Guangzhou Tron ong Electronic Technology co, LtdTron集成开发环境自带及系列仿真器驱动。如果仿真器无法正常使用,请检查是否存在驱动冲突,系列仿真器使用芯片,请检查是否与已经安装使用的转串口驱动冲突,如使用仿真器,请检查计算机中是否正确安裝转串口驱动或者尝试重新装计算机主板芯片组驱动12设置工程配置文件信息请先按照相关软件安装文档安装然后打开集成开发环境,点击菜单,如下图所示:File Edit View Mavigate Project Run ScriptsWindow HelpNewAHt+ShH+Np會 CCs Pro ectCluseCurl+W3Suurte FieClose allCtrl+Shift+wh Header FleCSaveCtrl+cOClassT Hile from TemplateSave All匚tr- shift+S9 DS2/BICS V5.x Configuration File盛 RTSC Ccntiguraticn FilcC OtherCtrl-Ne Refresh图在弹出的界面中输入工程配置文件名字,然后点击如下图所示广州创龙电子刑技有限公司Guangzhou Tron ong Electronic Technology co, LtdTronN New Target ConfigurationI arget Configurati。nCreate a new Target Configuration fileFile name: New TargetConfigurationccxml回 Use shared locationLocation: C /Users/asus/ti CCSTargetConfigurations File System. V/crks pace.上Fh[ca图在弹出的对话框的下拉框中选择对应的仿真器类型(如使用仿真器请选择下拉框中选择对应的型号,如下图所示:Advanced SetupThis =action descrihes th= general config ration ah

用于数字图像边缘检测的matlab实现，一种新兴的边缘检测方法

所有开发人员或者技术团队，可以在本框架基础上做各种管理软件开发工作，里面所有相关业务代码都有Demo，大家可以学习着如何更好的使用UniGUI。如有技术上问题，可以下载另外一份《UniGUI集合说明--追月无名.doc》。

手把手教你学DSP--基于TMS320C55x光盘 (包括源代码 电路图PDF,DXP) + 基于TMS320C55x.PDF。比较适合刚入门，是一本DSP入门的好书。

一个用python3的Tkinter模块和pyserial模块写的串口调试助手,想学习上位机串口编程的要参考一下,Tkinter做的界面不够qt炫酷,但也够用

本程序是根据矩阵的形式实现了一维向量的快速傅里叶变换，程序输入为向量f，输出为其傅里叶变换所得序列F

基于51单片机的智能小车程序，可以避障和循迹！

美国大学生数学建模竞赛题解析与研究第1-5辑，对于要参加数学建模的同学还是有一定的帮助滴

imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection