STM32实现交通灯设计

这是一个基于粒子滤波的视频目标跟踪的matlab仿真程序，为了方便大家的使用，还特地在文件中附加了一组从视频中提取的仿真图片，需要注意的是，在tracker.m主程序中，读取图片的路径需要改成你存放图片的路径，只要个路径改对了，其他.m文件文件不用修改就可以运行了。

用MATLAB写的四维数据空间建模源代码，十分简洁明了，如果你想用MATLAB做出四维数据[X,Y,Z,S]的空间立体图，其中X,Y,Z表示三维空间坐标，S是属性值，那么这两种方法一定对你有用！

一款JAVA编写的航空订票系统，功能很全界面漂亮，内含开题报告，任务书，周记完全版，选题简介和选题审批表，java航空订票系统初稿，java航空订票系统终稿打印，源代码及源代码注释，详细设计word文档里附有详细图片说明和使用操作说明，参考该文档学习JAVA网络传输、JAVA应用软件编程，能起到事半功倍作。

本文介绍了数字喷泉码原理，详细讨论了随机线性喷泉码、LT码和RAPTOR码编译码原理及实现方法，针对LT码仿真验证了数字喷泉码在删除信道的性能。

电力系统暂态分析MATLAB仿真程序

这系列教程完全以代码的形式来写的，目标是：读者看代码和注释就可以理解代码的意思。虽然作者力求在每个例子中做到功能尽量少，代码尽量的简洁，但为了演示某个功能，不得不添加了一些额外的内容，如有疑问，请参考：《An Introduction To Tkinter》：这是介绍 Tkinter 我见过最全的一本书了http://docs.python.org/lib/tkinter.html：python 模块中介绍关于 Tkinter 编程的入门级教程http://www.tcl.tk/：Tk 的官方网站，最权威 Tk 资料。就是这本书的章节先后顺序,建议从前至后进行阅读。问题与反馈:如果在练习中有疑问或问题欢迎与我联系,一起讨论学习作者联系方式:傅客电邮于北京年月日初步结果教程之篇第一个例子使用内置位图改变的前景色和肯景色设置宽度与高度使用图像与文本文本的多行显小教程之篇第个例子的外观效果显示文本与图像的焦教程之篇的宽度与高度设置文本在控件上的显示位置改变的前景色与背景色设置的边框设置的外观效果设置状态绑定与变量教程之篇第一个程序与变量绑定设置为只读设冒为密码输入框验证输入的內容教程之篇第例设置的事件处理函数改变的显小文本将变量与绑定设置的状态值教程之第例子为指定组创建两个不同的组使用相同的绑定事件处理函数改变外观效果教程之篇第一个可以选中多个使用支持鼠标移动选中位置使向支持和中添加个删除中的选中或取消中的得到当前中的个数返回指定索引的返回当前选中的的索引判断一个是否被选中与变量绑定与事件绑定教程之篇第一个例子指定创建的参数绑定变量使用事件处理函数打印当前的值控制显示位数设置的标签属性设置取得的值教程之篇第·个例了创建时指定参数。设置的值绑定变量设置的事件处理函数的当前内容册除字符(这是个有问题的程序)在指定位置插入文本教程之篇第一个例子设置的位置使用事件处理函数(不建议这样使用)绑定将的解除绑定解除与的关系教程之篇第例子添加下拉菜单向菜单中添加项向菜单中添加顶向菜单中添加分隔符快捷菜单菜单项的操作方法教程之的常用方法教程之第例了改变的宽度设置宽高比例绑定变量文本对齐属性教程之创建设置的显示值打印的值使用作为的选项教程值向中添加删除指定的在指定位置添加个教程之第向实例中添加添加了的支持教程之创建简单的设置的属性使用自凵制作提示框教程之篇第一个例子向中添加文本仗用索引添加内容使用内置的控制添加位置使用表达式来增强教程之使用来指定文本的属性同时使用两个文本指定同一个属性控制的级别对文本块添加使用自定义对文本块添加使用获得中的内容测试对的影响使用对文本属性的影响教程之篇自定义的两个内置属性在中创建按钮在中创建一个图像未实现绑定与事件使用实现编辑常用功能未实现教程之篇第例了创建一个指定的填充色指定的边框颜色指定边框的宽度画虚线使用画刷填充修改的坐标教程之创建的多个使用同一个通过来访问向其它添加返回其它改变在中的顺序教程之篇移动删除缩放绑定与添加绑定事件绑定新的与现有的教程之绘制弧形设置弧形的样式设置弧形的角度绘制位图绘制图像绘制直线直线的属性绘制椭圆创建多边形修饰图形绘制文本选中文本创建组件教程之篇第一个例子的关系向中添加多个组件固定设置到自由变化如何控制子组件的布局如何控制组件的布局改变组件的排放位置设置组件之间的间隙大小教程之篇使用绝对坐标将组件放到指定的位置使用相对坐标放置组件位置使用同时指定多个组件同时使用相对和绝对坐标使用来指定放置的容器深入用法事件与结合使用教程之篇第一个例子使用和来指定位置为其它组件预定位置将组件放置到预定位置上去将两个或多个组件同一个位置改变列(行)的属性值组件使用多列(多行)设置表格中组件的对齐属性教程之篇第一个字体例子仗用系统已有的字体宇体创建属性优先级得到字体的属性值使用系统指定的字体教程之使用用模态对话框使用模块打开文件对话框保存文件对话框使用颜色对话框使用消息对话框使用缺省焦点教程之测试鼠标点击事件测试鼠标的移动事件测试鼠标的释放事件进入事件教程之篇测试离开事件响应特殊键响应所有的按键事件只处理指定的按键消息使用组合键响应事件改变组件人小事件教程之篇两个事件同时绑定到一个控件为一个绑定一个事件。事件各个级别音传递使用的后果使用绑定教程之篇第一个例子:指定显小的文本初始化创建一个使用编码,到现在为止还没有使用过直接通过“就可以完成的显示,必须含有此语句但是不需要(严格地说是必须不这样使用),否则解释器抱怨进入消息循环控件的显示步骤创建这个控件指定这个空间的,即这个控件属于哪一个告诉有一个控什产生了还有更简单的一个例子:将打印到标题上,也不用创建了再没法儿简化了,就这样吧使用内置位图指定显示的位图初始化创建一个,使用编码,到现在为止还没有使用过百接通过“就可以完成的。上面的代码使用了内置位图

LDA是一个在文本建模中很著名的模型，类似于SVD、PLSA等。这个模型涉及到的数学知识较多，包括Gamma函数、Dirichlet分布、Gibbs Sampling、Variational Inference、贝叶斯文本建模、PLSA建模、LDA文本建模。 【核心代码】

imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection

利用snake蛇形算法进行边缘检测的matlab程序，可对二维图像进行边缘检测。需手动初始化边缘。

人工智能选股框架及经典算法简介华泰人工智能系列之一人工智能和机器学习并不神秘人工智能和机器学习方法并不神秘，其本质是以数理模型为核心工具，结合控制论、认知心理学等其它学科的研究成果，最终由计算机系统模拟人类的感知、推理、学习、决策等功能。理解常用的机器学习算法，有助于澄清对人工智能的种种误解和偏见，帮助我们更清晰地认识人工智能的长处和局限，从而更合理、有效地将人工智能运用于投资领域。