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windows下的ffmpeg、MFC制作的播放器
需要下载分,是希望大家能够更好的分享和使用本资源,毕竟上传也不容易。希望得到理解。其中包含了VS2010解决方案,使用其他版本VS的朋友可以修改工程文件。相关说明见原文:http://blog.csdn.net/luofl1992/article/details/8293405
- 2020-12-05下载
- 积分:1
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索尼 imx274 datesheet
imx274 datesheet,可以对接Hi3519V101,4K,分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
- 2020-12-11下载
- 积分:1
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灰度AGV路径识别matlab程序
灰度AGV路径识别matlab程序,对搞车辆导航的人有帮助
- 2020-12-03下载
- 积分:1
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流形学习的matlab实现代码(mani.m)绝对好用
流行学习的matlab代码,包括各种流形学习方法:MDS/ISOMAP/LLE/HLLE/LE/LTSA…… 图形界面,操作简单。
- 2020-12-12下载
- 积分:1
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qt串口助手源码
之前写的关于qt实现串口助手博客,有人需要源码,由于当初是为项目需要些,里面有很多不必要的控制,现在重新整理了一份较为纯净的代码,和大家交流学习注意目录不要有中文路径名,尽量在顶层目录下编译,,源博客地址:http://blog.csdn.net/mao19931004/article/details/51852573
- 2020-05-28下载
- 积分:1
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2000-2014年东南大学通信920考研初试真题
包含了2000年到2014年东南大学通信考试初试科目真题,920专业基础综合(数字电路、信号与系统),全部电子版,没有回忆的
- 2021-05-07下载
- 积分:1
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专利撰写样例
专利撰写参考样例,可以参考写。机械相关领域的专利,都可以参考。CN201482299U说明书1/2页多功能组合式带式压滤机技术领域[0001]本实用新型涉及一种环保领域水处理系统中,适用于污泥处理的多功能组合式带式压滤机。背景技术[000]环保领域水处聞系统中的污泥处理设备中,带式压滤机是)泛采用的设备。目前带式脱水设备形式很多,但是由于各种使用原因,都存在有污泥分离过程中,混合、絮凝不充分,影响了带式压滤机使用效果,无形中增加了污泥处理的费川实用新型内容[0003]本实用新型要解决的技术问题是提供一种集絮凝、浓缩、布料及脱水于一体的多功能组合式带式压滤机,解决混合、絮凝不充分,滤液中仍含有大量污泥,布料不均匀等缺陷。[000为了解决上述问题,本实用新型提供了一种由絮凝装置、浓缩装置、宽带布料装置、脱水装置组成的多功能组合式带式压滤机。泥浆浓度小于1%时采用絮凝装置、浓缩装置、脱水装冒组合,浓度大于1%时采用絮凝装置、宽带布料装置、脱水装詈组合,絮凝装置安装在脱水装置上部左端;浓缩装置安装在脱水装置上部中间;宽带布料装置安装在脱水装置上部中间。[0005絮凝装置是絮凝筒和裝仼絮凝筒上部的搅拌机组成的装置;所述絮凝装置的搅拌机为螺旋提升式搅拌机。[000]浓缩装置是浓缩装置驱动电机减速机安装在浓缩装置的左端,其右侧安装1~3只浓缩网筒,浓缩装置的右下端安装1~3只小布料器组成的装置。[000宽带布料裝置是分配槽和安装在分配槽上部的布料筒组成的装置[0008脱水装置是重力脱水区位于脱水装置的上端左侧,重力脱水区右侧依次安装上滤带清洗装冒、上调偏装置、脱水裝置驱动电机减速机:主动辊安装在脱水装置的右端,主动辊之间右侧形成剥离区,剥离区左侧的S形区域是S挤压脱水区,S挤压脱水区左侧是上滤带和下滮带形成的楔形脱水区,转向辊安装在脱水设备的左端,下调偏裝置安装在脱水裝置的下部右侧,下滤带清洗装置安装在下调偏装置左侧组成的装置。附图说明[0009下面结合附图和具体实施方式对本实用新型作进一步详细的说明[0010]图1是本实用新型多功能组合式带式压滤机的第一种实施方式的示意图。[0011图2是木实用新型多功能组合式带式压滤机的第二种实施方式的示意图具体实施方式[0012]本实用新型工作情况是这样的:CN201482299U说明书2/2页[0013]如图1所示,经过加药后的原低浓度泥浆由泥浆口20进入絮凝装置23,泥浆在絮凝筒2屮絮凝,通过螺旋提升式的搅拌机1搅拌加速泥浆与药剂的反应,形成较大的絮凝团,然后自流到浓缩装置4中。由浓缩装置驱动电杋减速杋3带动不锈钢浓缩网筒5旋转,泥浆在浓缩网筒5中进行浓缩,浓缩后的泥浆通过配套的小布料器7均匀分布在上滤带19上。脱水装置驱动电机减速机10带动主动辊11转动,主动辊11带动上滤带19和下滤带16移动。泥浆在上滤带19带动通过重力脱水区6,稳压阀提供恒定压力的转向辊18,转向落到下滤带l6上,然后在楔形脱水区17预挤,最后在S挤压脱水区13挤压脱水,并形成泥饼,泥饼最终在剥离区12分离出脱水装置25。上滤带19通过射沇阀控制的上调偏装置⑨调整滤带的位置。上滤带凊洗装置8对上滤带19进行凊洗。下滤带16通过射流阀控制的下调偏装置14调整滤带的位置。下滤带清洗装置15对下滤带16进行清洗.[0014]如图2示的经过加药后的原低浓度泥浆由泥浆∏20进入絮凝裝置23,泥浆在絮凝筒2中絮凝,通过螺旋提升式的搅拌机1搅拌加速泥浆与药剂的反应,形成较大的絮凝团,然后自流到宽带布料装置24,在布料筒21中混凝,用由分配槽22均匀分布到上滤带19。脱水装置驱动电机减速机10带动主动辊11转动,主动辊11带动上滤带19和下滤带16移动泥浆在上滤带19带动通过重力脱水区6,稳压阀提供恒定压力的转向辊18,转向落到下滤带16上,然后在楔形脱水区17预挤压,最后在S挤压脱水区13挤压脱水,并形成泥饼,泥饼最终在剥离区12分离岀脱水装置25。上滤带19通过射沇阀控制的上调偏装9调整滤带的位萓。上滤带清洗装萓8对上滤带19进行凊洗。下滤带16通过射流阀控制的下调偏装置14调整滤带的位置。下滤带淸洗装置15对下滤带16进行清洗CN201482299U说明书附图1/2页89252310182N相12171613图15CN201482299U说明书附图2/2页252019TIINT18a尺G)12161415EADZARSEADE图6
- 2021-05-06下载
- 积分:1
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STM32驱动12864点阵LCD,多级菜单实例,完整源码
STM32驱动12864点阵LCD,多级菜单实例,完整源码。采用STM32F103,包括12864点阵LCD驱动、KEY按键代码、多级MENU菜单设计,对LCD人机界面设计有很好的参考意义。
- 2020-06-21下载
- 积分:1
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学术会议海报模板
竖版学术海报ppt模板。大小为A0,33.1*46.9英寸,即841mm*1189mm。共10个模板.
- 2020-07-01下载
- 积分:1
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数字控制振荡器_nco_的fpga实现
介绍了NCO 数字控制振荡器的工作原理 详细分析了数控振荡器的性能指标和其在FPGA中的实现方法 最后给出了新设计的数控振荡器在QUARTUS2 中的仿真结果第12卷第11期电子元器件用VoL 12 No. 112010年11月Electronic Component Device ApplicationsNov.20102069n80#顶(101#围100am)20020数篇0291潮0x)萨:日6959173国0国L图1 QUARTUS II下仿真波形图功率谱密度函数信号波形图X:4080-sn(2pi*18e61)Y5014余强信号H正弦信"7彐300>…-÷a是2500300035004C004500500055006000250255260265270275280285290图2输出频率为408ⅥH的信号波形与功率谱密度5结束语参考文献本文通过分析数控振荡器的实现原理和性张欣扩频通信数字基带信号处理算法及其vS实现能,给出了通过FPGA来实现NCO的具体方法[M]北京:科学出版社,2004同时通过 QUARTUSⅡ中的仿真验证了本设计的[2]楼顺天MAT.AB7x程序设计语言[M西安:西安电子科技大学出版社,200正确性。结果证明,用该方法设计的NCO可以输3]汤伟良,等数控振荡器在FPGA中的实现门微型机与出多种频率的信号,同时也可以减少资源消耗。应用,2003,22)X(上接第41页表1分档信息及对应放大/哀减量息,也提高了实时数控AGC电路的动态范围和整档位输入信号功放大衰档位输入信号功放大衰个系统的精度。实验结果表明,该电路能够实现号率范围/dBm减量dB号率范围/dBm诚量/dB实时AGC的电路功能,并有效扩展了动态范围。1「12,20186「-33,-24)3523,12)7参考文献36,3)8[51,4杨小牛,楼才义,徐建良软件无线电原理与应用[Ml4-15,-6)9[-80,-51)北京:电子工业出版社,200151-24,-1526实时放大衰减。同时利用FPGA器件良好的数字2]韩尧秦开宇基于数字补偿的实时自动增益控制技术研究[.电子科技大学学报,2007,36(1):79-81特性实现了数控AGC的设计,从而实现了对信号3陈爽高性能频谱分析仪中频信号处理技术研究U的实时数字增益补偿,有效减少了电路体积。同合肥:合肥工业大学,2007时,采用两级数控增益放大/衰減器级联和根据[4曹鹏,费元春.大动态范囯数字中频ACC系统的设计两路不同增益通道提取的度值来判断档位信门北京理工大学学报,2003,23(5:613-61644电子元器件在用2010.11www.ecda.cn
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