palabos

说明：  数学工具： LU分解法解线性方程组，很好用(Mathematical tools: LU decomposition solution of linear equations, a very good use)

用于最小二乘支持向量机的名为"留一法",可用于支持向量机超参数的确定.(for least squares support vector machine called "a stay", could be used to support vector machine-determined parameters.)

二维脊形光波导的FDTD仿真，能轻易修改波导尺寸和波导介质，，对硅等高折射率的波导求解正确(fdtd simulation of optical waveguide)

fsolve函数求非线性方程组数值解，已经验证其正确性。(fsolve function for the numerical solution of nonlinear equations)

麻省理工大学k.j.bathe 教授开发的adina代码,欢迎大家下载,(adina sources by k.j.bathe MIT please download)

说明：  拓扑优化MMA算法从空间的一个初始设计点出发，沿着某个搜索方向以适当步长的迭代格式 ，实现对设计变量的修改，以获得的值。(Starting from an initial design point in space, the topology optimization MMA algorithm modifies the design variables in an appropriate iterative format along a certain search direction to obtain the optimal value)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

时域有限差分方法程序，网格为非均匀剖分的(FDTD method program, a non-uniform partition of the grid)

四阶龙格库塔法，用C++编写，很有参考价值(Fourth-order Runge-Kutta method, written in C, a good reference)

自己实现的一个简单的计算器，支持大数的加减乘除、开平方等操作，不适用库函数。(Themselves to achieve a simple calculator, to support the addition and subtraction, multiplication and division of large numbers, such as square root operations, library functions do not apply.)