索尼 imx274 datesheet
imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
- 2020-12-11下载
- 积分：1
在LabVIEW中自定义控件.pdf
在labview中自定义控件的详细教程：如何是你的labview测试程序，前面板看起来更美观，让用户对使用的流程更清晰，这里教你如何在labview中自定义控件泛华测痉PANSINO控件45控件章布尔确定3,在我们己有的图片库中复制我们想用来作为按钮图片的图片本文中将以这个按钮为图片进行训述。复制好图片至剪贴板中后。在控件编辑窗口中,控件上右键选择从剪贴板导入图片>终P控件45自定义类型白回文牛住编餐E查着项目②操作◎T目目定义类型ipe T布尔确定显示项转换为显示挥件说明和提示替换数据操作高级机械动作释放文本多文本字符串从剪贴板导人图片N假属性真4,此时控件效果如卜图:地址:北京市海淀区中关村东路18号财智国际大夏A座9层电话:(010)82600055传真:(010)62628056http://www.pansinocomcn泛华测痉PANSINOE控件45自定义类型章文件(辆辑E查看y项目操作Q)工具〔州自定义类型、‖13rm布尔确定5,可以更改为自定义模式下,对图片的位置进行修正控件45自定义类型章口回区文件〔編辑查看项目巴操作(Ω)二具团自定义类型·1tahm布尔确定6,同样也可以对文本的位置以及搾件的底板的人小进行修正,修正之后的控件如下图所示地址:北京市海淀区中关村东路18号财智国际大夏A座9层电话:(010)82600055传真:(010)62628056http://www.pansinocomcn泛华测控PANSINO控件45自定义类型巴区P粒件45自定义类型艾件错G查看项目②操作工具文件(编辑查看(项目心操作()工具①[自定义类型[[自定义类型13pt Tahoma相尔布尔确足布尔值为真布尔值为假同样也可以对文本的位置以及控件的底板的大小进行修正,修正之后的控件如下图所示这样制定出来的控件的特点是:1,即使点在图片上,也能更改布尔按钮的状态。2,真假布尔值状态下,该图片不能进行变换。方法二1,打开 LabVIew,创建新式型的布尔按钮,石键选择高级>自定义。为什么要创建新式的控件呢?在本方法的末端会提供P控件45自定义类塞回回区文件G)编锅查看(项目巴作⑨工具红2自定义类型、[13计10确定按钮确定2,打开如上图所示窗∏后,去我们图片斥中,复制图片◎至剪贴板。回到控件的編辑窗∏,控件上右键选择从剪贴板导入图片>>假。地址:北京市海淀区中关村东路18号财智国际大夏A座9层电话:(010)82600055传真:(010)62628056http://www.pansinocomcn泛华测痉PANSINOE控件45自定叟类包叵区件辑查看y项目操作Q工具自定义类型pt Tahoma确定按钮显示项转换为显示控件说明和提示替换数据操作高级机械动作释放文本多文本宇符串从鸥贴板导入图片卜[假属性始终3,将出现如卜图所示效果:P控件45自定义类型喜白回区文件(綱辑但查看φ项目@)嬝作(工具T自义类型·10T确定按钮确定4,同样,在图片库中复制图片至剪贴板中。在控件上右键选择从剪贴板导入图片>真。地址:北京市海淀区中关村东路18号财智国际大夏A座9层电话:(010)82600055传真:(010)62628056http://www.pansinocomcn泛华测痉PANSINO1控件45自定义天型回区文件臼编辑查看y项目P操作(工具红自定义类型13pE T确定按钮显示项转换为显示控件说明和提示替换潋据操作高级机械动作释放文本多文本字符串从翦贴梗导入图片假属性真忙终5,不显小控件的文本。做出来的控件的状态将如下。口控件45自定义类型t巴回应控件15白定义类型包回凶文件编辑查看(项目)操作工具工神(编辑〔查看项目(操作①工目(①[自定火类型·13t[自定义类型13pt Taho门确定按钮确定按钮布尔值为真布尔值为假这种方法做出来的控件的特点是:1,背景透明,但是实际控件大小为所选择的图片的大小。一般是一个规则的下方形或者长方形前文提到为什么要用新式按钮呢?先来说一下按钮的图片项,每个布尔按钮在自定义模式下,是有若干图片项的,而新式按钮与系统型的按钮的图片项是不同的。图片项的查看方式为:将控件窗∏置为自定义状态下,在控件上石键选择图片项即可看到该控件所拥有的图片项地址:北京市海淀区中关村东路18号财智国际大夏A座9层电话:(010)82600055传真:(010)62628056http://www.pansinocomcn泛华测痉PANSINO控件45自定义类回区文件()锎辑)查看{y项目巴操作()工具T小自定义共型1计m布尔复制至前贴板从剪贴板导入图片以相同大小剪贴板导入从文件导以相同大小具文件导入还原原始大小图片项圖888□口下边左图所示是新式按钮的图片项。如果在最开始创建控件时,选择的是系统行按钮,并且同样按照本方法导入不同的图片,最后图片项将显小为为右图所小。其中1,2,3,4与新式的控件的图片项的意义相同,分别为真,假,真到假点击吋,假到貞点击吋。5,6是系统按钮才有的特性。5为当程序运行状态下按钮为假时鼠标移入时的状态,6为当程序运行状态下按钮为真时鼠标移入时的状态56上述制作的方法,如果控件使用系统型,我们可以想象,在程序运行卜,当鼠标移入时,按钮将变得很奇怪,就是因为它的5,6图片项没冇定义。解决方法是直接用新式控件即可。当然如果不怕麻烦可以选中图片项5和6,并导入对应的图片。但是做出来的效果与使用新式控件进行编辑的效果相同。方法三上述方法,要么按钮为真假时不能为同一副图片,要么没有系统的背景框。那么如果希望能做到我之前发送的按钮集中的这种按钮,又该怎么做呢?st artstart这种按钮,并不是我们使用传统的确定按钮进行自定义编辑时就能实现的。需要多个控件进行配合编辑才行。布尔确定按钮确确定地址:北京市海淀区中关村东路18号财智国际大夏A座9层电话:(010)82600055传真:(010)62628056http://www.pansinocomcn泛华测控PANSINO1,首先,创建一个如下图所示按钮。进入自定义模式状态下。布尔2,另外再选择一个系统型的按钮,进入该系统按钮的自定义模式状态下。布尔确定注:如果无法对两个控件同时选中高级≯自定义,先将要编辑的两个控件都另存为自定义类型的控件,再次打开即可。以下均在自定义模式下完成。E控件47.ct1自定义类率回区控件6.ct1口件G编辑G查看项目(操作)工具①窗口y)帮件()編辑(E)查看②项目卫操作(Q工具江窗口)轉团自定义类至-[团自定类型和尔3,在系统型控件上右键选择复制至剪贴板E控件47.ct1自定义类型回冈整件6:1自定义类型文件G编辐侣查看项目操作(二具I霰匚,文件G铜锔E查看(0三①映作工具①宙口(帮助「自定义类刑13tTa布尔复至郭板相司大小贴饭是入相司大小文芒导不原原始大小4,在新式的带LED的布尔按钮上右键选择图片项地址:北京市海淀区中关村东路18号财智国际大夏A座9层电话:(010)82600055传真:(010)62628056http://www.pansinocomcn泛华测控PANSINO控件47.ct1自定叉类塞冈控件46.ctl自定义类型文吽)病辑)查看{顶目巴操作⑨)工具(T匚ci件G编E查看(y项目巴操作(工具二窗口(帮助布尔烹物至邮贴板从剪贴板导入网片以相同大小从剪板号从文件导以相同大小从文件导原始大小5,选择我们需要编辑的图片项,因为之前复制的是系统型控件的假状态的图片,那么在选择新式按钮的图片项时,也应该选择对应的图片项。选择完毕后,选择“以相同大小从剪贴板导入”。控件47.ct1自定义夹型回Xp控件46,tl自定义型仁i)编承E查看△项目P)操作⑨)工具窗口)帮耵文件編辑查着③项目(P操作(工具⑦T窗口(业帮助尔有尔剪贴板子入图片以相同大小从贴椒导人以相问小从义件导图片项6,导入后的结果为控件47.ct1自定叉类想口日风粒件41叶t1自定义关类件)查看心顶目的嫵工貝山唐η弗项日(操工且口自定义类现布尔布尔7,同坦,将系统型按钮置为假吋,将其图片项复制至剪贴板,并导入到新式按钮的对应图片项下导入完成之后如下图所示。地址:北京市海淀区中关村东路18号财智国际大夏A座9层电话:(010)82600055传真:(010)62628056http://www.pansinocomcn
- 2020-12-08下载
- 积分：1
