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PCI 3.0 规范,英文原版。PCI Local Bus Specification Revision 3.0PCI LOCAL BUS SPECIFICATION, REV.3.0ContentsPREFACESPECIFICATION.……13INCORPORATION OF ENGINEERING CHANGE NOTICES (ECNS)1查音音鲁垂音音13DOCUMENT CONVENTIONS.………14l. INTRODUCTION…151.1. SPECIFICATION CONTENTS······151.2. MOTIVATION……151.3. PCI LOCAL BUS APPLICATIONS1. 4. PCI LOCAL BUS OVERVIEW171.5. PCI LOCAL BUS FEATURES AND BENEFITS……181. 6. ADMINISTRATION…………………202. SIGNAL DEFINITION m...mn.. 212.1 SIGNAL TYPE DEFINITION222.2. PIN FUNCTIONAL GROUPS..…………222.2.1. System Pins……,…,…,,…,…232.2.2. Address and data pins242.2.3. Interface Control Pins........................252.2.4. Arbitration Pins(Bus Masters Only)272.2.5. Error Reporting Pins....垂看d。普音看鲁D指音着音,。音音自。音音音。音自垂272.2.6. Interrupt Pins( Optional)……282.2.7. Additional signals312.2.8.64- Bit bus extension pins( Optiona)…,,……………………………332.2.9. TAG/Boundary scan Pins(Optional).......342. 10. System Management Bus Interface Pins(Optional)352. 3. SIDEBAND SIGNALS362. 4. CENTRAL RESOURCE FUNCTIONS.····:·····.·············363. BUS OPERATION373.1 BUS COMMANDS373.1. Command definition373. 1.2. Command Usage rules393.2. PCI PROTOCOL FUNDAMENTALS423.2.1. Basic Transfer Control····:············.················433.2.2. Addressing.............143.2.3. Byle lane and Byte enable usage……563.2.4. Bus Driving and Turnaround非音垂垂·非573.2.5. Transaction Ordering and posting….583. 2.6. Combining Merging, and Collapsing。。音垂。音62PCI LOCAL BUS SPECIFICATION, REV.3.03.3. BUS TRANSACTIONS……643.3.1. Read transaction……………653.3.2. Write transaction3.3.3. Transaction termination.………….673.4. ARBItRAtION音垂3.4.1. Arbitration Signaling protoco1..…………………893.4.2. Fast Back-to-Back Transactions. .........................................................93.4.3. Arbitration Parking………………………………………93.5 LATENCY953.5.1. Target Latency…….953.5.2. Master Data latency……….….…….,….….…..……..….,983.5.3. Memory Write Maximum Completion Time limit3.5.4. Arbitration Latency3.6. OTHER BUS OPERATIONS……·。垂,音着垂。着音D。。着。D音着音垂。音着D音非非音垂音非·非1103.6.1. Device selection…....…,103.6.2. Special cycle...........3.6.3. IDSEL Stepping…………,,…,…,,…,,…,,,,,………,…1133.6.4. Interrupt acknowledg3.7. ERROR FUNCTIONS春音·。音垂1153.7.. Parity ger1153.7.2. Parity Checking...........………,163.7.3. Address parity errors…...…,…163.7.4.Error Reporting…17173.7.5. Delayed Transactions and Data Parity Errors.......... 203.7.6. Error Recovery.............,213. 8. 64-BIT BUS EXTENSION1233.8.1. Determining bus Width during System initialization.…….…,1263.9.64- BIT ADDRESSING…..…………………………………………1273.10SPECIAL DESIGN CONSIDERATIONS.1304. ELECTRICAL SPECIFICATION.. m.m.9.1374.1. OVERVIEW…1374.1.1. Transition Road Map……1374.1.2. Dynamic vs Static Drive specificalion…1384.2. COMPONENT SPECIFICATION.……,………………,1…………………1394.2.1. 5V Signaling environment1404.2.2. 33V Signaling environment鲁鲁·垂垂1464.2.3. Timing specification1504.2.4.1determinate Inputs and metastable作,…………1554.2.5. Vendor provided specification..,..…,.…………….………17564.2.6. Pinout recommendation157PCI LOCAL BUS SPECIFICATION. REV.3.04.3. SYSTEM BOARD SPECIFICATION.………1584.3.1. Clock skew,…………………1584.3.2.R··1584.3.3. Pull-ups:····.················:·····…1614.3.4Power1634.3.5. System Timing Budget. ...........1644.3.6. Physical requirements............………674.3.7. Connector Pin assignments……/6844. ADD-IN CARD SPECIFICATION1714.4.1.Add- in Card Pin Assignment..,.,.,………………,1714.4.2. Power Requirements….,.,.,.,.,.,.,,.….,764.4.3. Physical requirements.........1785. MECHANICAL SPECIFICATION1815.1. OVERVIEW1812. ADD-IN CARD PHYSICAL DIMENSIONS AND TOLERANCES...........1825.3. CONNECTOR PHYSICAL DESCRIPTION…………………1954. CONNECTOR PHYSICAL REQUIREMENTS. ...............................2055. CONNECTOR PERFORMANCE SPECIFICATION……………,…2066. SYSTEM BOARD IMPLEMENTATION……………2076. CONFIGURATION SPACEb●看●鲁D鲁0e●2136. 1. CONFIGURATION SPACE ORGANIZATION音垂垂D·垂看垂…2136.2. CONFIGURATION SPACE FUNCTIONS .......................2166.2.1. Device ldentification鲁垂垂2166.2.2. Device Control鲁着鲁D垂2176.2.3. Device status2196. 2.4. Miscellaneous registers·······:········:···:·:··:·:······:··············4······:····2216.2.5. Base addresses……………………….22463. PCI EXPANSION ROMS2286.4. VITAL PRODUCT DATA.2296.5. DEVICE DRIVERS2296.6. SYSTEM RESET.…………………………2306.7. CAPABILITIES LIST2308. MESSAGE SIGNALED INTERRUPTS ...................................................................2316.8.1. MSI Capability Structure..............2326.8.2. MSl-X Capability and Table structures……………….……..2386.8.3. MSI and Msi-X Operation2467. 66 MHZ PCI SPECIFICATION2557. 1. INTRODUCTION2557.2. SCOPE7. 3. DEVICE IMPI TION CONSIDERATIONS7.3.1. Configuration space.......2557. 4. AGENT ARCHITECTURE256PCI LOCAL BUS SPECIFICATION, REV.3.07.5. PROTOCOL.……2567.5.1.66 MHZ ENABLE(M66EN) Pin definition.…………,………,,2567.52Latency..-..-.-2577.6. ELECTRICAL SPECIFICATION……………2577.6.. Overview·.·······.··2577.6.2. Transition roadmap to 66 MHz PCI··········.2577.6.3. Signaling Environment.......... 2587.6.4. Timing specification.……2597.6.5. Vendor provided specification. 26.57.6.6. Recommendations·.·························:············:······:········.:··········2657.7. SYSTEM BOARD SPECIFICATION.………,…,……………2667.7.1. Clock Uncertainty ......2667.7.2. Reset2677.7.3. Pullups..2677.7.4. Power..······.·.·::·····布鲁····音D鲁番。是。音垂看····非D∴2677.7.5. System Timing Budget7.7.6. Physical requirements2687.7.7. Connector Pin assi! nments…..,.,.,..,.,.,..,.,.,2697.8. ADD-IN CARD SPECIFICATIONS春音·。音垂2698. SYSTEM SUPPORT FOR SMBUSn2718. 1. SMBUS SYSTEM REQUIREMENTS2718.1.1. Power………278. 2. Physical and Logical sMBi27l8.1.3. Bus connectivit2728.1.4. Master and slave support....….….…..…..…..,2738.1.5. Addressing and Configuration2738.1.6.Ele2748.1.7. SMBus behavior on Pcl reset.........................2748.2.ADD- IN CARD SMBUS REQUIREMENTS…………2758.2.7Connection2758.2.2. Master and Slave Support...,.…..…….…,...….,2758.2.3. Addressing and Configuration……,…,…,……,…,…,…,….….…..….,2758. 2. 4. Power2758. 2.5. Electrical.········.····························275A. SPECIAL CYCLE MESSAGES●鲁●e鲁277A 1. MESSAGE ENCODINGS277A,2. USE OF SPECIFIC ENCODINGS ................................................277B. STATE MACHINES279B. 1. TARGET LOCK MACHINE·;.···.:..···:...···:··.·:····281B.2. MASTER SEQUENCER MACHINE283B 3. MASTER6PCI LOCAL BUS SPECIFICATION. REV.3.0C. OPERATING RULES289C 1. WHEN SIGNALS ARE STABLE..·····.:·.·.::···:·;289C.2. MASTER SIGNALS…音·。·看290C.3. TARGET SIGNALS…291C.4. DATA PHASES…292C.5. ARBITRATION.……………………………………292C.6. LATeNCY······:“·······293C.7. DEVICE SELECTION……………,……………………………293C 8. PARITY垂垂垂D·垂294D. CLASS CODESD 1. BASE CLASS OOH...w.w...296D 2. BASE CLASS OlH296D. 3. BASE CLASS O2H··297D 4. BASE CLASS O3H297D.5. BASE CLASS04H.………………………298D. 6. BASE CLASS OSH298D.7. BASE CLASS06H...………….…………………299D 8. BASE CLASS OZH,300D 9. BASE CLASS OSH.301D.10. BASE CLASS C9H.……………………………………………….301D.11. BASE CLASS OAH.…………………302D 12. BASE CLASS OBH302D. 13. BASE CLASS OCH303D.14. BASE CLASS ODH….…304D. 15. BASE CLASS OEH304D. 16. BASE CLASS OFH·····.····;····:·;:·······304D.17. BASE CLASS JOH.……………………………………………1305D, 18. BASE CLASS 11H305E. SYSTEM TRANSACTION ORDERINGE.I. PRODUCER- CONSUMER ORDERING MODEL308E. 2. SUMMARY OF PCI ORDERING REQUIREMENTS310E.3. ORDERING OF REQUESTS........................................311E.4. ORDERING OF DELAYED TRANSACTIONS…………312E.5. DELAYED TRANSACTIONS AND LOCK#.317E.6. ERROR CONDⅠ TIONS……318. EXCLUSIVE ACCESSES..m.msn0..319F.1. EXCLUSIVE ACCESSES ON PCIF 2. STARTING AN EXCLUSIVE ACCESS321F.3. CONTINUING AN EXCLUSIVE ACCESS323F 4. ACCESSING A LOCKED AGENT324F 5. COMPLETING AN EXCLUSIVE ACCESS325F. 6. COMPLETE BUS LOCK ......................................................................325IO SPACE ADDRESS DECODING FOR LEGACY DEVICES..9.... 327PCI LOCAL BUS SPECIFICATION, REV.3.0CAPABILITY IDS。,0329I. VITAL PRODUCT DATA331VPD FORMAT3I.2COMPATIBILITY……………………………334L.3. VPD DEFINITIONS3341.3.1. VPD Large and small resource Data Tags......·D垂看3341.3.2. VPD Example…3378PCI LOCAL BUS SPECIFICATION. REV.3.0FiquresFIGURE -I: PCI LOCAL BUS APPLICATIONS春DFIGURE 1-2: PCI SYSTEM BLOCK DIAGRAM17FIGURE2-1: PCI PIN LIST.…………..…………21figure 3-1: ADDRESS PHASE FORMATS OF CONFIGURATION TRANSACTIONS...... 48Figure 3-2: LAYOUT OF CONFIG ADDRESS REGISTER, ..............................................50Figure 3-3: HOST BRIDGE TRANSLATION FOR TYPE O CONFIGURATION TRANSACTIONSADDRESS PHASE51FIGURE3-4: CONFIGURATION READ…………156FIGURE3-5: BASIC READ OPERATION………………………65FIGURE 3-6: BASIC WRITE OPERATION66FIGure 3-7: MASTER INITIATED TERMINATION........................ 68FIGURE3-8: MASTER- ABORT TERMINATION…………69Figure 3-9: RETRY. ..........................................................................................................73FiGure 3-10: DISCONNECT WITH DATA. ........................74FiGure 3-11: MASTER COMPLETION TERMINATION:·:····:··.·4····.···…75FiGURE 3-12: DISCONNECT-1 WITHOUT DATA TERMINATION·····76Figure 3-13: DISCONNECT-2 WITHOUT DATA TERMINATION76FiGure 3-14: TARGET-ABORT…177figure 3-15: BASIC ARBITRATIONFIGuRE 3-16: ARBITRATION FOR BACK-TO-BACK ACCESS…94FiGurE 3-17: DEVSEL# AsSERTION·····:···.·:··110Figure 3-1 8: IDSEL STEPPING114FiGure 3-19: INTERRUPT ACKNOWLEDGE CYCLE. ...................................................114FIGURE3-20: PARITY OPERATION………116FIGuRE 3-21: 64-BIT READ REQUEST WITH 64-BIT TRANSFER125FIGURE 3-22: 64-BIT WRITE REQUEST WITH 32-BIT TRANSFER..........126FIGURE 3-23 64-BIT DUAL ADDRESS READ CYCLE129FIGURE 4-1: ADD-IN CARD CONNECTORS...........................138FIGURE4-2:V/ICURⅤ ES FOR5 V SIGNALING.…………………143FIGURE 4-3: MAXIMUM AC WAVEFORMS FOR 5V SiGnaling145FIGURE 4-4: V/I CURVES FOR 3.3V SIGNALING148FIGURE4-5:MAⅹ IMUM AC WAⅤ EFORMS FOR3.3ⅴ SIGNALING………150FIGURE 4-6: CLOCK WAVEFORMS151FIGURE 4-7: OUTPUT TIMING MEASUREMENT CONDITIONS.··4·:······.·154FIGURE4-8: INPUT TIMING MEASUREMENT CONDITIONS…………154FIGURE 4-9: SUGGESTED PINOUT FOR POFP PCI COMPONENT···“···:.···.····:·········157FIGURE4-10: CLOCK SKEW DIAGRAM………158FIGURE 4-1: RESET TIMING16lFIGURE4-12: MEASUREMENT OF TPROP,3.3 VOLT SIGNALING……………166FIGURE 5-1: PCI RAW ADD-IN CARD(3.3V, 32-BIT).183FIGURE 5-2: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 32-BIT)..........184FIGURE 5-3: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 64-BIT)....185FIGURE 5-4: PCI RAW LOW PROFILE ADD-IN CARD(3.3V, 32-BIT)..........186PCI LOCAL BUS SPECIFICATION, REV.3.0FIGURE5-5: PCI ADD-Ⅰ N CARD EDGE CONNECTOR BEⅤEL……187FIGURE56: PCI ADD-IN CARD ASSEMBLY(3.3V)……………………………88FIGURE 5-7: LOW PROFILE PCI ADD-IN CARD ASSEMBLY 3.3V)189FIGURE 5-8: PCI STANDARD BRACKET………190FIGuRE 5-9: PCI LOW PROFILE BRACKET191FIGURE 5-10: PCI STANDARD RETAINER···192FIGURE5-11: IO WINDOW HEIGHT∴………………193FIGURE 5-12: ADD-IN CARD INSTALLATION WITH LARGE IO CONNECTOR.......194FIGURE 5-13: 32-BIT CONNECTOR196FIGURE 5-14: 3.3V/32-BIT CONNECTOR LAYOUT RECOMMENDATION. ........................197FIGURE5-15:3.3V/64-BIT CONNECTOR198FIGURE 5-16: 3.3V/64-BIT CONNECTOR LAYOUT RECOMMENDATION 199FIGURE 5-17: 3.3V/32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES2(垂D·。垂,音着垂。着音D。。着。D音着音垂。音着音FIGURE 5-18: 3.3V/64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES….201FIGURE5-19: UNIVERSAL 32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES………………………………202FIGURE 5-20: UNIVERSAL 64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES203FIGURE5-21:PCⅠADD- IN CARD EDGE CONNECTOR CONTACTS……204FIGURE5-22: CONNECTOR CONTACT DETAIL………………205FIGURE 5-23: PCI CONNECTOR LOCATION ON SYSTEM BOARD208FIGURE5-24:32- BIT PCI RISER CONNECTOR……209FIGURE 5-25: 32-BIT/3.3V PCI RISER CONNECTOR FOOTPRINT210FIGURE 5-26: 64-BIT/3.3V PCI RISER CONNECTOR211FIGuRE5-27:64-BI/3.3ⅴ PCI RISER CONNECTOR FOOTPRINT∴………212FIGURE 6-1: TYPE OOH CONFIGURATION SPACE HEADER215FIGURE 6-2: COMMAND REGISTER LAYOUT217FIGURE6-3: STATUS REGISTER LAYOUT……………………………219FIGURE 6-4: BIST REGISTER LAYOUT222FIGURE 6-5: BASE ADDRESS REGISTER FOR MEMORY........... 225FIGURE 6-6: BASE ADDRESS REGISTER FOR L/O225鲁着D音看FIGURE 6-7: EXPANSION ROM BASE ADDRESS REGISTER LAYOUT.....,..... 228FIGURE6-8: EXAMPLE CAPABILITIES LIST…….231FIGURE6-9: MSI CAPABILITY STRUCTURES…..……233FIGURE 6-10: MSI-X CAPABILITY STRUCTURE238FIGurE 6-11: MSI-X TABLE STRUCTURE翻音。音239FIGurE 6-12: MSI-X PBA STRUCTURE…239FIGURE 7-1: 33 MHZ PCI VS 66 MHZ PCI TIMING······:··················257FIGURE7-2:3.3 V CLOCK WAVEFORM.…………259FIGURE 7-3: OUTPUT TIMING MEASUREMENT CONDITIONS263FIGURE -4: INPUT TIMING MEASUREMENT CONDITIONS263FIGURE75:TvAL(MAX) RISING EDGE…………264FIGURE 7-6: TVAL(MAX) FALLING EDGE·265FIGURE77:TVAL(MIN) AND SLEW RATE……26510

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炫酷的在线抽奖程序，实用于任何场景的抽奖。支持维护抽奖人员，默认第一次中奖人员为6号人员。

包含往年美赛获奖论文、LaTeX工具、LaTeX模板、论文写作简单说明

设计一个虚拟存储区和内存工作区,编程序演示下述算法的具体实现过程,并计算访问命中率：要求设计主界面以灵活选择某算法，且以下算法都要实现1）先进先出算法（FIFO）2）最近最久未使用算法（LRU）3）最佳置换算法（OPT）

传统的全景图像拼接算法，多采用 Harris 角点的特征提取或尺度不变特征转换 (SIFT)的特征匹配算子的方式，对存在重合部分的图像进行图像拼接处理。但对于车载全景图像拼接算法而言，车身四周采集到的 4 幅鱼眼畸变图像，使用特征提取算子的方法进行的拼接，运算的复杂度高，效率低，不能满足车载设备的实时性要求。针对这一问题，该文提出一种专门应用在车载系统的车载全景图像拼接算法，并对其进行 Matlab 仿真，最大限度提高算法的运算效率，以满足车载系统实时性的要求，真实的反应路况信息，辅助驾驶员安全驾驶。关键词：计算机视觉；图像拼接；车载全景；实时性；鱼眼图像

我是毕业于重庆大学通信工程学院集成电路设计与集成系统2010级学生。我的本科毕业设计题目是串口/USB接口的上位机软件设计。这是我答辩用的PPT。串口/USB接口的上位机设计1绪论(1)选题背景和研究意义工业生产和科学研究对现场数据采集、处理的需求,使得高校、便捷的上位机应用到数据采集系统。(2)国内外研究现状数据采集产品alibaba com.tn产品实物图串口儿USB接口的上位机设计2方案对比与选择(1)数据采集系统整体框图该系统主要由以下几个功能模块组成,如下图所示。SDRAM乒乓缓冲USBA模拟信号FPGA主控转换制器数据传输上位机软件外围配置系统功能模块框图(2)方案对比与选取口八USB2.0特征比较表特征插接操作性「成本传输传输速度是否需开发难度「发展性距离驱动方案不方便,体较慢,最串口积较大,需低长快达否简单接近淘汰重启230Kbps方便,小巧快,广泛普及USB20即插即用高短480Mbps是复杂前景光明数据釆集系统的关键指标和要求是精确和高速结合上表选取USB接口来进行系统中的数据传输。串口八USB接口的上位机设计3USB固件和驱动设计(1)USB芯片固件设计电复位初始化状态变量固件设计包括调用 TD Init(,使能中断主程序、初始化是否需要重枚举?是延时1.5s,重枚举子程序,重枚举否子程序,处理设一是否收到EUP包2是→分析命令,执行请求备请求子程序等主要子程序。是否产生中断挂起?是挂起处理器否是否收到唤醒信号?否/唤醒处理器调用TD_Po|()固件主程序流程图(2)UB2.0驱动设计为 Driverizard叵网Step Navigation Project Summary For微软用户Project Name= CQU USB [04441314Project NameProject Location =E: DRIVER dr3CQU USB[044413142. ProJect TypeProject Type=WDM驱动设3. Driver TypeHandle rP M reAd4. Hardware busHandle rP M] Write5. USB ResourcesHandle rP M device CoNtrol计参数配需andersDriver Tupe FUNCTIONALHardware bus= useB RegistryHardware=凵SBWv|D①44&FD1314置最终界4. Power0. WHInstallation面如下图2 Additional3. Summary所示HelBack屬Mext1 nish Cance1参数配置界面申SB接口的上位机设計4上位机软件设计上位机软件设计下图为上位机设计的流程图。开始变量定义并初始化数据处理并计算USB连接成功八否否数波形显数据保存?值是开启线程示数据再现?/诉开启采集?打开数据窗体上位机设计流程图串口闶SB接口的上位机設5调试运行整体调试重庆大学通信工程学院USB BLASTER6-FPGA JTAGJ7-FPGACyclone.I;U57FPGA+2SDRNYMUSB2AJ16Cyclone.Il调试过程CHFIu12J5RC5510 20M ADC MODULE zo 9oU58LIANGZIUSB硬件实物串口SB接口的上位机设许5调试运行(1)固件下载和驱动安装USB芯片的固件程序可通过 EZ-USB Control panel在线下载和固化,界面显示如下图所示。EZ-USB InterfaceDevice cypress Ez-USB FX2LP No ebL Clear Load Mon s EEPROM Select MonGEt DeGet Conf Get Pipes Get String= Down ade-Load Lg EEPRom URE Statvend Req Req 0x00 Value 0x0000 Index 0x0000 Length 0Dir o OUTHex Bytes CO B4 04 81 00 01 00so TranPipeLength 128Packet siBulk Trans PipeLength 64Hex BytesReset Pipe Abort Pipe File TransPipeSet IFace Interface DAltsetting 0ev立e⑩e三iPt了lEngthbDescriptorfype: 1bcdUSB: 0x0200bDevicecla33. 0xFE上 Devices1kC1a:xEFbDeviceFrotoc口LOHEEbMaxpackets立ze0:4vEndorx04B4立 aProductX613bcdDevice032001mAnufActurer. 0立adct立三e〓i卫 NUTE:上 unConEiquratior固件下载界面

系统的介绍了包络分析在实际中的应用，介绍了matlab进行包络分析的方法，并附有源程序供科研人员学习这是一个分式规划问题。若令则()可化为等价的线性规划问题:线性规划()的解和称为的最佳权向量,它们是使的效率值达到最大值的权向量。注意:作为线性规划的解,和不是唯一的义()若线性规划()的解满足:,则称为弱有效的;()若线性规划()的解中存在解并且则称为有效的。为了便于检验的有效性,一般考虑()的对偶模型的等式形式(带有松弛变量目具有非阿基米德无穷小)∑∑其中是项输入的松弛变量是项输出的松弛变量;是个的组合系数;;是个很小的止数(般取)。定理设线性规划(的最优解为则()若为弱有效()的;()若且则为有效()的程序由上一节知,要计算一个的相对效率值并讨论其(弱)有效性,须解一个线性规划若要计算所有的相对效率值,则须解个线性规划,其计算量比较大,一般须利用计算机进行计算。我们利用数学软件编写了解模型()和(的程序,比较方便地解决了的计算量大和计算复杂的问题是由公司用语言编写的著名的工程数学应用软件。它自牛推向市场以来,历经十几年的发展和竞争,现已成为国际认可的最优化的科技应用软件。目前,口经成为世界上诸多科技领域的基本应用软件。在国内、外的很多高等院校和科研机构已经十分普及。熟练地运用已成为晑校师生及科研人员的基本技能强大的矩阵运算能力和方便、直观的编程功能是我们选择它作为编写应用程序的原因。诚然,或是解线性规划问题的专业软件,但它们缺乏方便的编程功能和矩阵输入功能,在解一系列线性规划时,它们不如方便。此外,它们的普及程度远不如因此,我们认为是编写应用程序的最佳软件之一。所解的线性规划的标准形式是板小化问题:其中,是变量,是目标函数的系数向量,是不等式约枣的系数矩阵,是等式约束的系数矩阵,和分别是变量的下界和上界解线性规划()的语句为如果要解极大化问题,只须解极小化问题卜面,我们给出模型和(的程序。程序模型的程序)用户输入多指标输入矩阵用户输入多指标输出矩阵解线性规划,得的最佳权向量求出的相对效率值输出最佳权向量输出相对效率值输出投入权向量输出产出权向量程序模型(的程序)用户输入多指标输入矩阵用户输入多指标输出矩阵定义非阿基米德无穷小解线性规划,得的最佳权向量输出最佳权向量输出输出输出输出以上两个程序十分便于使用。用户只须输入多指标输入矩阵和输出矩阵,目可得到所需的结果。程序的应用设有某大学的同类型的五个系在一学年内的投入和产出的数据如下投教职工(人)教职工工资(万元)入运转经费(万元)毕业的本科生:(人)毕业的研究生(人)出发表的论文(篇)完成的科研项目(项)其中,运转经费指一学年內维持该系正常运转的各和费用,如行政小公费、图书资料费、差旅费等等。由程序,得到各系的相对效率值:以及各项投入和产出的权向量中定义,和至少是弱有效的和是非弱有效的。为了确认和的有效性并分析和非有效的原因,须利用模型(。由程序,得本问题的解:由以上解可看出:和的解中且松弛变量故由定理知,这几个系是相对有效的。和的非有效性也可以在以上解中看得一清二楚。以为例,根据有效性的经济意义,在不减少各项输出的前提下,构造一个新的投入的投入按比例减少到原投入的)倍,)并且(由非零的松弛变量可知)还可以进一步减少教职工工资万元、减少运转费用万元、多培养本科生人多完成项科研项目。对的非有效性可作类似的经济解释。结束语本文利用数学软件编写了便于使用的的计算程序,使计算量大和计算复杂的问题得到较好的解决。本文只对的模型进行了讨论。对于的另一个重要模型一模型,只须在模型(。中增加约東条件∑A,程序作相应的修攻即可。本文的程序为的理论研究和实际应用提供了方便、快捷的计算工具。参考文献:魏权龄评价相对有效性的方法北京:中国人民大学出版社盛旧瀚等里论、方法与应用北京:科学出版社,许波,刘征工程数学应用北京:清华大学出版社,

其中包含一些AQWA实例教程以及安装文件等

flex中调用dll，可以让大家方便的控制各种硬件设备等