基于ROS的机械臂运动控制

多智能体一阶二阶一致性 matlab 仿真。包涵一阶，二阶多智能体一致性，包涵对车辆的编队的算法仿真，最后仿真实现小车位置和速度的一致性。还包含带领导和时滞系统时的matlab仿真m文件多智能体

赛灵思的FPGA芯片最小系统板的原理及PCB，有兴趣的可以看一看

Lumped Elements for RF and Microwave Circuits英文版，射频微波电路入门Lumped Elements for RFand microwave circuitsFor a listing of recent titles in the Artech House Microwave library,turn to the back of this bookLumped Elements for RFand microwave circuitsInder bahlArtech houseBoston londonwww.artechhouse.comLibrary of Congress Cataloging-in-Publication DataBahl, I.J.Lumped elements for RF and microwave circuits /Inder Bahlp cm.--(Artech House microwave libraryncludes bibliographical references and indexISBN 1-58053-309-4(alk. paper1. Lumped elements(Electronics) 2. Microwave integrated circuits. 3. Radiofrequency integrated circuits. 4. Passive components. I. Title. II. SeriesTK7874.54B342003621.38132-dc212003048102British Library Cataloguing in Publication DataBahl, I. J. Inder jit)Lumped elements for RF and microwave circuits.-(Artech House microwave library1. Radio circuits 2. Microwave circuits I. Title621.38412ISBN1-58053-3094Cover design by Igor Valdmar2003 ARTECH HOUSE, INC.685 Canton StreetNorwood Ma 02062All rights reserved Printed and bound in the United States of America. no part of this bookmay be reproduced or utilized in any form or by any means, electronic or mechanical, includingphotocopying, recording, or by any information storage and retrieval system, without permissionn writing from the publisherall terms mentioned in this book that are known to be trademarks or service marks have beenappropriately capitalized. Artech House cannot attest to the accuracy of this information. Useof a term in this book should not be regarded as affecting the validity of any trademark or servicemarkInternational Standard Book Number: 1-58053-309-4Library of Congress Catalog Card Number: 200304810210987654321To my adorable grandsons, Karan and Rohan Kaushal, with whom I play, cry,and laugh, and who have provided me with the idea and inspiration towrite this bookContentsPrefaceXVAcknowledgmentsXXIntroduction1.1 History of Lumped Elcements)Why Use Lumped Elements for rF andMicrowave circuits1.3 L, C, R Circuit Elements1.4 Basic Design of Lumped Elements4.1 Capacitor1.4.2 Inductor4.3 Resistorumped-Element Modelin1. 6 Fabrication1.7 ApplicationsReferencesInductors2.1 IntroductionLumped Elements for RF and Microwave Circuits2.2 Basic Definitions2.2.1 Inductance2.2.2 Magnetic Energy182.2.3 Mutual Inductance202. 2. 4 Effective Inductance202.2.5Imedang2.2.6 Time Constant2.2.7 Quality Factor222.2.8 Self-Resonant Frequency232.2.9aximum Current Ratin2.2.10 Maximum Power Rating2.2.11 Other Parameters232.3 Inductor Configurations242.4 Inductor models2. 4. 1 Analytical Models252.4.2 Coupled-Line Appiroach282.4.3 Mutual Induse arppi342.4.4 Numerical Approach362.4.5 Measurement-Based model382.5 Coupling Between Inductors452.5. 1 Low-Resistivity Substrates2.5.2 High-Resistivity Substrates462.6 Electrical Representations2.6. 1 Series and Parallel representations2.6.2 Network Representations51References52Printed Inductors573.1 Inductors on Si Substrate583.1.1 Conductor Loss3.1.2 Substrate Loss3. 1.3 Layout Considerations3.1.4 Inductor Model3. 1.5 Q-Enhancement Techniques3.1.6 Stacked-Coil Inductor803.1.7 Temperature Dependence84

主要用于OFDM的频偏估计，利用导频的相关性

用matlab实现的最小二乘法用于系统辨识，从文件中读取数据，然后辨识。里面包括各种基于最小二乘法的算法，普通最小二乘，广义最小二乘。。。等等

资料为 PCB 格式和 SCH 格式，需要用PADS9.5打开MTK MT6735是联发科为中低端产品量身定制，助力厂商推出支持CDMA网络的电信版手机或者支持全模的全网通智能手机。采用4核A53处理器， 主频率1GHz起，标准版主频为1.3GHz，最高可至1.5GHz，所整合的GPU为ARM Mali-T720，搭载450MHz的T720MP2。能支持1080P屏幕、13MP相机和1080P视频回放录制等。MT6735也会整合多合一无线连接芯片，支持蓝牙、GPS、WIFI等功能，重点是能兼容FDD/TDD/WCDMA/TD-SCDMA/CDMA2000以及GSM网络。

代码包含基于差分算法的多聚焦图像融合算法的源代码以及不同图像块清晰度判定方法的源代码。有空间频率，边缘检测，灰度差等方法。

支持大部分网卡：RTL8168，RTL8168EF，RTL8136，RTL8136EF，RTL8139，ULi5263，ULi5261，SiS，INTEL5266DC，RTL8169，BCM57781，INTEL82579，INTEL82583，INTEL82574_BMC，INTEL82574，AR8161，INTEL217，INTEL210，INTEL217V，INTEL211.32，INTEL211.39，RTL8168DP，AR8171，AR8111GEF，INTEL210.31，INTEL350.151F，INTEL350.1521，INTELX540.1528，INTELX540.

【实例简介】程序代码经过硬件与仿真的测试

电子技术课设实例（自动日历表）multisim仿真+报告