fast-descent

说明：  c语言编写的高效用LU分解法求任意维数的矩阵的逆，它是经典书籍《算法导论》（第二版）中矩阵求逆的c语言实现。 (The algorithm of matrix inverse is based on LU decomposition which is proposed by the book of introduction to algorithm (second edition).)

频谱分析,用于对等时间间距的序列进行频谱分析 很好的(Spectrum analysis for equivalent time interval sequence spectrum analysis is very good)

多重网格方法求解矩形边界条件下泊松方程，偏微分方程数值求解(use multigrid method to solve poisson equation in rectangular domain)

说明：  该文件是用C语言实现快速傅里叶变换的源代码，需要的朋友快下载(The document is used C language to achieve fast Fourier transform of the source code, need friends fast download)

贝塞尔函数与汉克尔函数的Matlab实现(Bessel function and Hankel function of the Matlab implementation)

采用QR分解方法计算矩阵特征值和特征向量(computes a partial Schur decomposition of a square matrix or operator)

计算流体力学中运用有限体积法求解二维无粘欧拉方程，非结构网格(CFD finite volume method for solving two-dimensional inviscid Euler equations, unstructured grids)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

车间调度问题的遗传算法matlab源程序，供大家参考(shop scheduling GA Matlab source for reference)

滤波器与匹配电路的设计，基于简化实频技术的matlab实现(the SRFT achieves an optimal lter design byusing computer-aided optimization. This code will describe SRFT and a MATLABR implementation of the SRFT currently under development)