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LSM303DLHC

于 2013-04-08 发布 文件大小:415KB
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  新一代地磁模块,助力高精度移动罗盘。新产品LSM303DLHC采用3x5x1mm微型封装,最小功耗仅为110µ A,可满足便携式消费电子应用对尺寸和功耗的限制性要求,同时还具有出色的测量精度和性能。 在一个封装内同时集成高性能运动感应和地磁感应(Ultra compact high performance e-compass 3D accelerometer and 3D magnetometer module)

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