fenlei

C语言实现bmp图像放大缩小，24位bmp图像(The C language bmp image zoom, 24 bmp image)

数字水印处理，嵌入、提取、认证，可以在图形，视频和文本中添加数字水印，增强文档的保密，防止泄密(Digital watermarking processing, embedding, extraction, authentication, can be in graphics, video and digital watermarking to add text to enhance the confidentiality of documents to prevent leak)

小型图像处理平台，包括滤波，边缘提取，边缘优化以及图像匹配功能(Small image processing platform, including filtering, edge detection, edge optimization and image matching function)

分割视图 希望大家多多批评指正 多多交流(segmentation View I hope Members can interact more criticism correction)

英文原本经典计算机图形学教程，PPT格式，很好的学习材料和上课资料(English was the classic computer graphics course, PPT format, good learning materials and school information)

关于elastix医学图像配准算法库的例子程序，有助于分析elastix如何操作，是一个很好的教程(this is a example set of elastix library)

说明：  ：建立了碳钢渗硫表面和非渗硫表面的多球凸峰面接触模型，模型中，凸峰高度按高斯函数分布．用塑性流线 理论分析了渗硫层的摩擦系数．计算结果表明：摩擦系数随载荷的增加而增加；相同粗糙度下，磨削加工的摩擦系 数比车削加工的摩擦系数大；摩擦系数随着渗层厚度的增大而增大．从减小摩擦系数的角度来考虑，渗硫层并非 越厚越好． (the multi-asperity sphere-shape model for surface contact between sulphurized layer and unsulphurized layer is established．in which the height of sphere-shape asperities follows the Gaussian distribution．1he frictional coeficients of sulphurized layers are analyzed by using plastic flown line theory．1he results show that the frictional coeficient increases with the load．the frictional coeficient of ground surface is higher than that of tumed surface in case of the same roughness．1he thicker the sulphuri[ed layer is．the higher the frictional coeficient is．From the viewpoint of reducing frictional coeficient，the thickness of sulphurized layer should be smaller．)

说明：  此程序为地震层析成像的LSQR算法，此算法用来解反问题。(This procedure for seismic tomography LSQR algorithm, the algorithm used to solve inverse problems.)

说明：  基于opencv的小面积区域的去除.可以去除面积小于指定面积的无兴趣区域.(Opencv-based small area of the region to remove. Can remove an area of less than the specified area is not interested in the region.)

VisualC++数字图像处理技术详解第2版光盘-第五章(VisualC++ digital image processing technology Detailed Version 2 CD- Chapter V)