cholesky

计算电磁学有限元法全美经典教材，金建铭编著英文版(FEM computational electromagnetics American classic textbook, Jin Jianming edited English)

二维脊形光波导的FDTD仿真，能轻易修改波导尺寸和波导介质，，对硅等高折射率的波导求解正确(fdtd simulation of optical waveguide)

c++算法源代码，主要是POJ上面的算法，根据标号可以找到。(c++ algorithm source code, POJ above algorithm, based on the label can be found.)

基于Wegstein方法的求解方程的C++程序。(Wegstein-based method for solving equations C++ program.)

用牛顿法解非线性方程组(包括论文及源程序)(with Newton method for solving systems of nonlinear equations (including papers and source))

通过滑动T检验时间序列的变化趋势，一般多用于气象分析(T-test time series by sliding the trend, generally used for weather analysis)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

用C语言实现计算两个数字的最大公约数，代码简单简洁，适合初学者学习。(C language is used to calculate the maximum common divisor of two digits. The code is simple and concise. It is suitable for beginners to learn.)

改进的冒泡排序的VC++源程序，希望大家能够从中受益！(improved Bubble Sort VC source, we hope to benefit from!)

根据给定的等距结点上的函数值与一阶导数值, 用埃尔米特等距插值公式计算指定插值点处的函数值。(According to the given equidistant nodes function value with a first derivative values, with equidistant interpolation Hermite interpolation formula specified function value at the point.)