适合Linux初学者的两本经典书籍

用于室内定位的TDOA算法matlab仿真代码：含chan氏，taylor算法，卡尔曼滤波算法，及改进的基于卡尔曼的奇异值抛弃和整体偏移法,考虑NLOS因素

imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection

3G9bus_D201880419.psc

简述高斯伪谱法，包括算法、公式、流程等。还有对软件的使用说明

这是QT5.9C++开发指南，有需要的可以下载，对于QT入门的初学者帮助较大

用matlab画二维正态函数图像画坐标网格[x,y]=meshgrid(-5:0.1:5,-5:0.1:5)正态分布密度函数f=1/(2*pi*sigma1*sigma2*sqrt(1-p*p))*exp(-1/(2*(1-p*p))*(((x-u1).^2)./(sigma1*sigma1)-2*p*((x-u1)*(y-u2))./(sigma1*sigma2)+((y-u2).^2)./(sigma2*sigma2)))画图mesh(x,y,f)

此系统是利用Java语言开发的，里面有封装好的需要预测地区的天气数据包，利用Java语言进行解析，然后绘制天气雷达图，并利用Java界面编程将数据动态的展示到界面上。需要的可以下载参考学习。

恩菲特公司的1553B中文手册，手册丰富，详细，是1553B开发者的优选方案成都恩菲特科長有限公司EPH31580日录恩菲特产品保修条款…安全标志符号,D香看看看。。。垂垂看导D看警告第1章芯片概述…11.简介12.EPH31580特性111.3.EPH31580描述……14.电气特性+++··+++++++.1415.功能描述.…1.6.曼彻斯特解码…171.7.吋间戳178.中断19.存储器访问和寄存器访问1.10. BUS CONTROL框架.171.11. REMOTE TERMINAL框架……11.12. BUS MONITOR框榘18第2章软件接口自●●看命·●●●看鲁●息1921.上电状态22.存储器管理23.寄存器定义…21.中断屏敞寄存器(读/写22.配置寄冇器#1(读/23.配置寄存器#2(读/写)24.开始/复位寄存器(写)2.5.BC/RT命令堆栈指针寄存器(读)….262.6.BC控制字尕RT子地址控制宇寄存器(读)…2627.时标寄存器(读/写)28.中断状态寄存器(读29.配置寄存器#3(读/写)……2.10.配置寄冇器#4(读/写)21.配置寄存器#5(读/写)2.12.数据堆栈指针寄存器(读)…322.13.BC下一条消息开始时间寄存器(读/)214.BC帧时间/RT最后一个命令字/BM触发设置寄存器(读/写)2.15.RT状态字寄存器(读)216.RIB字寄存器(读).342.17. BLOCK STATUS WORD第3章 BUS CONTROL OPERATION……38HTTP:www.enpht.comTel:028-851482738528FAX:028-85148287107第3页成都恩菲特科長有限公司EPH31580BC存储器管理…38ACTIVE AREAS DOUBLE BUFFERING38PROGRAMMING OF BC MESSAGE FRAMES39BC Memory managcmcntMessage Block Formats∴39BC控制字∴…42DESCRIPTOR STACK44C MESSAGE GAP TIMEBC FRAME AUTO REPEATMINOR AND MAJOR FRAMES甲甲···:·…46BCⅠ NTERRUPT……46OTUER FUNCTIONBC SOFTWARE INITIALIZATION SEQUENCE··47BC PSEUDO CODE EXAMPLE.49第4章 REMOTE TERMINAL OPERATION,51RT存储器结构51RT存储器管理SUBADDRESS CONTROL WORDRT STACK AND INTERRUPTSTIME TAG WORDDATA BLOCK POINTER OR MODE DATA WORD57COMMAND WORD RECEIVEDRT COMMAND ILLEGALIZATION57SELECTED MODE CODE INTERRUPT60BROADCAST OPT⊥0NBUSY BITRT ADDRESS INPUTS62RT STATUS WORDRT-TO-RT RESPONSE TIMEOUT64SUMMARY OF RESPONSES TO MODE CODE MESSAGESRT SOFTWARE INITIALIZATION PROCEDURERT PSEUDO CODE EXAMPLE.68第5章 BUS MONITOR OPERATION.71MONITUR SELECTION FUNCTIONMESSAGE MONITOR FORMATSBM存储器管理MESSAGE MONITOR BLOCK STATUS WORDBM SOFTWARE INITIALIZATION PROCEDURE,76第6章 EXTERNAL INTERFACES通垂函a看自PIN DESCRIPTIONS BY FUNCTIONAL GROUPS隔离变压器到外部系统的连接BUFFERED u TRANSPARENT MODEHTTP:w.enphtcomTEL:028-851482738528FAX:028-85148287107第4页成都恩菲特科長有限公司EPH31580外部时序接口BUFFERED模式接口时序85与几和典型器件的连接与ADSP2101的连接与68040的连接与80286的连接.环境温度封装形式…订货号附录一:变压器选型手册97HTTP:/ww.enphtcomTEL:028-85148273/8528FAX:028-85148287107第5页成都恩菲特科長有限公司EPH31580恩菲特产品保修条款产品名称:1553A/B协议芯片产品型号:EP-H31580保修期限:一年1.恩菲特公司对由恩菲特公司出售的硬件产品和附件提供质量保修,保修期限如上所示。在保修期内如果出现因质量原因而产生故障,恩菲特公司在收到关于产品故障的通知并经查验核实后,有权选择维修或整套更换产品。整套更换的产品可以是新的或接近新的2.恩菲特公司保证软件产品经过充分测试。如果恩菲特公司在保修期内收到关于软件故障的通知,将在查验核实后免费更换软件3.恩菲特公司不保证在产品修理过程中产品可不中断地使用。但恩菲特公司保证在合理的期限内修理好发生故障的产品4.产品保修期从产品发运之日或由恩菲特公司开始安装之日起开始计算。如果用户的进度安排延后使恩菲特公司在产品发运之日起30天内仍未开始安装,产品保修期从交付之日后的笫31天开始计算5.恩菲特公司对任何下列情况而导致的产品故障和损坏不提供免费保修:(a)错误的使用或不适当的维护和校正,(b)非恩菲特公司提供的软件、接口、部件或其它物品,(c)未经许可的拆卸、修改和错误使用,(a)超过产品技术规格指明的范围使用,(e)不适当的运输、搬运和存贮,(f)其它不可抗力原因造成的故障或损坏(如HTTP:ww.enphtcomTEL:028-851482738528FAX:028-85148287107第6页成都恩菲特科長有限公司EPH31580地震、战争、交通事故等)6.在法律允许的范围内,上述保修条款是唯一明确的,同时没有任何其它的保修条款,不论是书面的或口头的。恩菲特公司明确表示拒绝承认任何暗示的保修条款和商业条款7.如果用户因使用恩菲特公司产品造成对其它物品损坏或身体伤害,经法院裁定其直接原因是恩菲特公司产品缺陷,恩菲特公司对此负责。版权声明所有恩菲特公司出售的软件产品或随同硬件产品出售的软件和文件,其版杈属恩菲特公司所有,恩菲特公司保留软件产品和文件方面的所有版权。用户对产品的购买并不表示用户在版权方面的任何许未经恩菲特公司书面许可的任何复制和出售均是被禁止的成都恩菲特科拈冇限公司HTTP:www.enpht.comTel:028-851482738528FAX:028-85148287107第7页成都恩菲特科長有限公司EPH31580安全标志符号符号说明符号说明贴在产品上的标志符号表示仪器在操作前必须表示使用者必须遵循产品手保证相应的接线端接地册中相应的警告或注意内容良好,以免电击而引起以免造成人身伤害或设备损设备损坏或人身伤害。坏交流直流表示相应的操作危险。△操作员应严格按规定操高压危险。警告作,否则可能导致人身危险表示相应的操作危险操作员应严格按规定操凸⊥机外壳楼地通常与注意,否则可能寻受慢备设备的金属外壳相连接。损坏或永久性数据丢失HTTP:ww.enphtcomTEL:028-851482738528FAX:028-85148287107第8页成都恩菲特科長有限公司EPH31580敬在操作,维护及修理设备的整个过程中要严格遵守以下安全事项违反这些安全规程或任何本手册中警告和注意事项规定的操作导致的设备损坏或人身伤害,恩菲特公司不对此类事故承担责任●对第一类安全设备(具有俣护地接线端子的设各),必须在产品的主电源输入端或供电电源电缆提供一个可靠的安全地连接对于模块式设备,为确保模块安全接地,应将模块前面板上的紧固螺钉旋紧,以保证模块的紧固面板与机箱保护地可靠接通●仪器不应接触易燃易爆气体或在有易燃易爆气体的环境下操作●为了避免火灾,应使用具有相同电压和电流的保险溶丝。不能使用修理过的保险熔丝或短接保险盒●操作人员不应打开机盖。这只能由经过培训的专业技术人员进行。打开机盖是危险的,因为设备中可能存在危险电压。甚至在设备断电以后,高压也可能存在。为了避免人身伤害,应由经过培训的专业技术人员来操作。●不要操作危险设备或在危险的条件下操作设备。如果任何削弱安全性或可能导致安全保护设施失效的情况存在(包括物理损坏,潮湿或别的原因),应立即拔除电源线,直到由专业技术人员确认后方可操作●不要单独维修或调整仪器,以免发生危险时可得到帮助和救治HTTP:www.enpht.comTel:028-851482738528FAX:028-85148287107第9页成都恩菲特科長有限公司EPH31580不能更换或更改产品中的元器件,除非有明确的认可和授权。因为这将带来其它危险。如仪器出了故障,应将其送到恩菲特公司指定的维修点进行维修,从而保证仪器的各项功能文献版本吏新历史所有版本和手册更新及发行时间都列举在下面。手册的初始版本是Ver1.00。不论何时更新手册,版本号都在尾数加1。当更新涉及到较为重要的内容时,版本号中间的数加1,当更新涉及到核心内容时,版本号第一位数加1。更新的内容通过手册发行,包括修改的内容及对手册新增加的内容。新版本均包括了对旧版本更改的内容。每个新版本或更新后版夲都有一页标注该文献的更改情况Ⅴrl.0l..,,,∴,,.,2005.05HTTP:/ww.enphtcomTEL:028-85148273/8528FAX:028-85148287107第10页

最完整的altera实现DDS正弦波、方波、三角波发生器Verilog程序用QuartusII工程，本资源是全网最全面的，分为代码和文本二部分。并在友晶科技板子上验证过。

二十四脉波整流的simulink仿真模型，可以参考试试