现代综合评价软件 模糊 灰色 AHP等方法

LaTeX是一款专门用于论文写作的编辑器，很多期刊文章要求用LaTeX格式。这里包含三篇PDF文档

机器人聊天。 有趣好玩。

理论上我们可以看出Y（t）的自相关函数的图像在零点有一个冲激，其他都与原信号的自相关函数相一致，所以通过观察Y（t）的自相关函数的图像我们可以检测出原余弦信号的存在。

基于51单片机的全自动洗衣机控制系统（完整程序、注释和Proteus仿真）【验证过】

Matlab 官方有关于HDL coder开发的详细技术文档， HDL Coder可以把Simulink模型、MATLAB代码和Stateflow框图生成位真、周期精确、可综合的Verilog和VHDL代码，很适合用于FPGA/ASCI的快速开发，里面还有大量的例程等等ContentsHDL Code generation from MATLaBMATLAB Algorithm DesignData Types and scope1-2Supported data TUsuppyted data type1-3Scope for variables1-3Operators1-4Arithmetic operate1-4Relational operators1-4ogical Operators1-5Control flow statements1-6Vector Function Limitations related to Control1-7PersistentⅤ ariables1-8Persistent Array variables1-10Complex data Type Support1-11Declaring complex signaIs1-11Conversion Between Complex and real signals1-12Support for vectors of Complex Numb1-12ystem Objects1-14Why use System objects?1-14Predefined System Object1-14User-Defined System ob1-14Limitations of HDL Code Generation for SystemObjects1-15System object Examples for HDL Code Generation.. 1-16Predefined System Objects Supported for HDL CodeGeneration1-17Load constants from a mat-file1-18Generate Code for User-Defined System Objects1-19How To Create a User-Defined System object1-1User-Defined System object Example1-19Map Matrices to ROM1-22Fixed-Point bitwise Functions1-231-23Bitwise Functions Supported for HDl Code Generation 1-23Fixed-Point Run-Time Library functions1-29Fixed-Point function limitations1-33Model State with Persistent variables and SysteObjects1-34Bit Shifting and bit rotation1-8Bit Slicing and Bit Concatenation1-41Guidelines for Efficient hdL code1-43MATLAB Design Requirements for HDL CodeGeneration1-44What is a matlab test bench?1-45MATLAB Test Bench Requirements and bestractices1-46MATLAB Test Bench requirements1-46MATLAB Test bench best practices1-46ContentsMATLAB Best Practices and Design Patterns forHDL Code generation2Model a counter for hdl code generation2-2MATLAB Counter2-2MATLAB Code for the counter2-3Best Practices in this Example2-4Model a state machine for HDL Code Generation2-5MATLAB State machinesMATLAB Code for the Mealy State MachineMATLAB Code for the moore state machine2-7Best practic2-9Generate hardware Instances For local functions2-10MATLAB Local functions2-10MATLAB Code for mlhdlc two counters. m2-10Implement RAM USing MATLAB Code2-13Implementation of RAM2-13Implement RAM Using a Persistent Array or Systemobject Properties2-13Implement RAM Using hdl. RAM2-14For-Loop best Practices for HDL Code generation2-16MATLAB Loops2-16Monotonically Increasing Loop Counters2-16Persistent Variables in Loops2-17Persistent Arrays in Loops2-17Fixed-Point Conversion3Floating-Point to Fixed-Point Conversion3-2Fixed-Point Type Conversion and Refinement3-16Working with Generated Fixed-Point Files3-26Specify Type Proposal Options3-33Log Data for Histogram3-37Automated Fixed-Point Conversion3-40License Requirements3-40Automated Fixed-Point Conversion Capabilities3-40Code Coverage3-42Proposing Data Types3-45Locking Proposed Data Types3-47Viewing functions3-47lew1ariables3-48Istogram ...3-54Function Replacements3-56Validating Types3-57g Numerics3-57Detecting Overflows3-57Custom plot functions3-59Visualize Differences Between Floating-Point and Fixed-Point results3-61Inspecting Data Using the Simulation Data Inspector 3-67What Is the Simulation Data Inspecto3-67Import Logged Data3-67Export Logged data3-67Group signals3-67Run options3-68Create Report3-68Comparison Options3-68Enabling Plotting Using the Simulation Data Inspector 3-68Save and Load simulation Data Inspector Sessions3-68Enable Plotting Using the Simulation Data Inspector 3-70From the UI3-70From the Command Line3-70Replacing Functions Using Lookup TableApproximations·3-72Replace a custom function with a lookup Table3-73From the UI3-73i ContentsFrom the Command line3-81Replace the exp Function with a Lookup Table3-84From the ui3-84From the Command line3-92Data Type Issues in Generated Code3-94Enable the highlight Option in a MaTLAB CoderProject3-94Enable the Highlight Option at the Command Line... 3-94Stowaway doubles3-94Stowaway singles3-94Expensive Fixed-Point operations3-94Code GenerationCreate and set Up Your Project4-2Create a New Project4-2Open an Existing ProjectAdd Files to the project4-4Primary Function Input Specification4-6When to Specify Input Properties4-6Why You must Specify Input Properties4-6Properties to Specify4-6Rules for Specifying Properties of Primary Inputs4-8Methods for Defining Properties of Primary Inputs4-8Basic hdl code generation with the workflowAdvisor4-10HDL Code Generation from System Objects4-14Generate Instantiable code for functions4-19How to generate Instantiable Code for Functions4-19Generate Code Inline for Specific Functions4-19Limitations for instantiable code generation forFunctions4-19Integrate Custom HDL Code Into MATLAB Design.. 4-21Define the hdl. Black Box System object4-21Use System object In MATLAB Design Function4-23Generate HDL Code4-23limitations for hdl. black box4-26Enable matLab function block generation4-27Requirements for MaTLAB Function Block Generation 4-27Enable matlab function block generation4-27Results of matlab function block generation4-27System Design with HDL Code Generation fromMATLAB and simulink4-28Generate Xilinx System Generator Black Box Block4-32Requirements for System Generator Black Box BlockGeneration4-32Enable System Generator black Box block GeResults of System Generator Black Box Bloc neration4-32Generation4-33Generate Xilinx System Generator for DsP black boxfrom MATLAB HDL Design4-34Generate HDL Code from MATLAB Code Using theCommand line interface4-40Specify the Clock Enable rate4-45Why specify the clock Enable rate?4-45How to Specify the clock Enable rate4-45Specify Test Bench Clock Enable Toggle rate4-47When to Specify Test Bench Clock Enable Toggle rate4-47How to Specify Test Bench Clock Enable Toggle rate4-47Generate an HDL Coding Standard report fromMATLAB4-49Using the hdl Workflow advisor4-49Using the Command Line4-51Generate an HDL Lint Tool script4-53How To generate an hdl lint Tool Script4-53ContentsGenerate a Board-Independent Ip core from MATLAB 4-55Generate a board-Independent Ip core4-55Requirements and Limitations for IP Core generation4-57Minimize clock enables4-58Using the GUi4-59Using the Command Line4-59Limitations4-59VerificationVerify Code with HDL Test Bench5-2Generate Test bench with file i/oWhen to Use file i/o In Test bench5-5How Test bench generation with file i/o works5-5Test Bench Data files5-5How to generate Test bench with file i/o5-6Limitations When Using File 1/0 In Test Bench5-6DeploymentGenerate Synthesis Scripts6-2Optimization7RAM Mapping7-2Map persistent Arrays and dsp. Delay to RAM7-3How To Enable RaM Mapping7-3RAM Mapping requirements for Persistent Arrays andSystem object PropertiesRAM Mapping Requirements for dsp. Delay Systemob7-6RAM Mapping Comparison for MATLAB Code7-8Pipelining7-9Port registers7-9Input and Output Pipeline registers7-9Variable pipelining7-9Register Inputs and Outputs7-10Insert Input and Output Pipeline registers7-11Distributed Pipelining7-12What is Distributed Pipelin7-12Benefits and Costs of Distributed pipelining7-12Selected Bibliograph7-12Pipeline matlab variables7-13Using the hdl Workflow Advisor7-13Using the Command Line Interface7-13Limitations of MatlAB Variable Pipelining7-13Optimize MatLAb loops7-15oop Streaming7-15Loop unrolling7-15How to Optimize maTLaB loops7-15Limitations for MaTLAB Loop Optimization7-16Constant Multiplier optimization7-17Specify constant multiplier optimization7-19Distributed Pipelining for Clock Speed Optimization7-20Map Matrices to Block RAMs to Reduce Area7-27Resource Sharing of Multipliers to Reduce Area7-32Loop streaming to Reduce Area7-41Contents

PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification

海思低功耗 WIFI 门铃方案（Hi3518EV300+Hi1131s+MCU+LiteOS)一、具体方案实现：   1、硬件设计电源管理是核心。   2、设备固件开发LiteOS+唤醒。   3、音视频平台+唤醒服务器。   4、APP 可免费提供源码参考，需要请留言。二、目前应用：WIFI 门铃；WIFI视频门锁；WIFI 猫眼；低功耗猫眼

adams分析实例，定轴轮系和行星轮系传动模拟和仿真3.5在 ADAMS/view中位置方向库中选择位置旋转( Position: Rotate.)图标一,在角度(Ange一栏中输入90,表示将对象旋转90度。如图3-3所示。在 ADAMS/View窗口中用鼠标左键选择圆柱体,将出来一个白色箭头移动光标,使白色箭头的位置和指向如图3-8所示。然后点击鼠标左键,旋转后的圆柱体如图3-9所示。gravity图3-8圆柱体的位置旋转图3-9旋转90后的圆柱体4.创建旋转副、齿轮副、旋转驱动4.1选择 ADAMS/wiew约束库中的旋转副( Joint: Revolute图标。,参数选择2Bod1loc和 Normal to grid,在ADAMS/view工作窗口中先用鼠标左键选择齿轮(PART2)然后选择机架( ground),接着选择齿轮上的PART2cm如图4-1所示。图中显亮的部分就是所创建的旋转副( JOINT_1该旋转副连接机架和齿轮,使齿轮能相对机架旋转4-1齿轮上的旋转副4.2再次选择 ADAMS/iew约束厍中的旋转副( Joint:Revolute)图标参数选择2Bod-1Loc和 Normal ToGrid。在 ADAMS/wew工作窗口中先月鼠标左键选择齿轮PART3),然后选择机架〔 ground),接着选择齿轮上的PART3.cm,如图4-2所示。图中显亮的部分就是所创建的旋转副( JOINT_2)该旋转副连接机架和齿轮使齿轮能相对机架旋转图42蜗杆上的旋转副43创建完两个定轴齿轮上的旋转副后,还要创建两个定轴齿轮的啮合点( MARKER)。齿轮副的啮合点和旋转刮必须有相同的参考连杆(机架),并且啮合点Z轴的方向与齿轮的传动方向相同。所以在本题中,啮合点( MARKER)必须定义在机架( ground)上,机架可以看作机架选择 ADAMSAVIew工具箱的动态选择( Dynamic Pick)图标,将两个齿轮的啮合处进行放大,再选择动态旋转图标鬥,进行适当的旋转。选择 ADAMS/View零件库中的标记点工具图标数选择如图4-3所示。选择坐标为(100,50,0),如图4-4所示,图中显亮的部分就是所创建的啮合点( MARKER14)。MarkerAdd to groundLyOrientati onlobal xY图4-3标记点的选项图44蜗轮蜗杆的啮合点4.4下面将对上面做出的啮合点进行位置移动和方位旋转,使该啮合点位于两齿轮中心线上,并使啮合点的Z轴方向与齿轮旋转方向相同。在ADAMS/View窗口中,在两个齿轮啮合处点击鼠标右键,运择 - Maker:rr-Clr de: CYLINDER_1MARKER14 Modify,如图45所示。在弹出的对话框中,将 LocationAl: raSelct栏的值1000.50.0,00改为100.0,25,00(位置移动)将 Orientation栏中的值0.0,0.0,0.0修改为0,90,0方位旋转)如图46所示。点击对话椎下而的OKApea『ane键讲行确定,旋转后的啮合点( MARKER_14)如图4-7所不。从图中可以看出,啮合点的Z轴(蓝色)Z轴的方向与齿轮的啮合方向相同图4-5属性修改对话框Nanedingzhoulaensi two. cround MARKER_ 7Inn n. 25. nLocation Relative Ta. dingzhouluerutitws0.0,90.0,0.0Ori entation Relative Td. dingzhoulueas i twoirer」[spy]a0写糖图4-7旋转后的啮合点图4-6进行坐标轴的旋转45选择 ADAMS/View约束库中的齿轮副(Gear)图标在弹出的对话框中的 Joint Name栏中,点击鼠标右键分别选择 JOINT1、JONr2。如图4-7所示。在 Common Velocity Marker栏中,点击鼠标右键选择啮合点( MARKER14)。如图4-8所示,然后点击对话框下面的OK按钮,两个齿轮的齿轮副创建出来,如图49所示1 Constraint Create Complex Joint Gearme[mhte×1cmmndingrhoulNeni GEAR 1Gear Nemedinczhouluenxi two GEAR_1Adms工dCommentsJoint NameN 1, JOINT 2Common Velocity MarkerCommon veloci ty Markey鬥 AREER1ParameterizedingzhouluenxiApplyCaneelJoINT 247齿轮副的创建对话框图48齿轮副的创建要素图4-9定轴齿轮的齿轮副46在 ADAMS/View驱动库中选择旋转驱动( Rotational joint Motion)按钮,在sped-栏中输入360,360表示旋转驱动每秒钟旋转360度。在 ADAMS/View工作窗口中,两个齿轮中仟选一个作为丰动齿轮,本设计中选择左边的齿轮(红色的),用鼠标左键点击齿轮上的旋转副( JOINT1),一个旋转驱动创建出来,如图4-10所示,图中显亮的部分为旋转驱动。图4-10齿轮上的旋转驱动5仿真模型5.1点击彷真按钮圖设置仿真终止时间〔 End Time冫为1,仿真工作步长( Step Size)为0.01然后点击开始仿真按钮进行仿真52对小齿轮的进行运动分析。因为太齿轮的齿数为x1=50,小齿轮的齿数2=25,模数m=4mm,因此根据机械原理可以知道,对于标准外啮合渐开线直齿圆柱体齿轮传动,小齿轮的转速为大齿轮的2倍。对小齿轮的旋转副 JOINT2进行角位置分析。在 ADAMS/View工作窗口中用鼠标右键点击小齿轮的旋转副JOINT2,选择 Modify命令,如图5-1所示,在弹出的修改对话框中选-CyInder: CYUND-R 2择测量( Measures)图标如图52所示。在弹出的测量对话框中-M=rsr:cri-Marker: MAR ER 5将 Characteristic栏设置为Ax/Ay! Az Projected Rotation,将st gourdComponent栏设置为Z,将From/At栏设置为PART3. MARKER5(或者ground MARKER6),其他的设置如图5-3所示。然后点击对话框下面的Jark::JoI_2OK”确认。生成的时间-角度曲线如图5-4所示。1 Joint MeasureMeasure namedingchouluensi two. JOINT_2 MEA 2JointJUINT 2Characteristic: Art/ Ay/Ar Projected Rotation图5-1旋转副属性修改命令ComponentC(ZFrom/此tC PART 3, MARKER 5tameI 2HARKER 6Crientati onSecond BodyRepresent coordinates inTypel revoluteForce Display Honev Create Strip Chartpose Mations)图5-3测量力对话框的设置团网」」_sy」cd图5-2修改对话框1 J0INT_2_MEA_17500Tine:1.000Current: 72037500.510图54时间和角度的曲线图由图5-4可以知道,当大齿轮每秒逆时针转过360度时,小齿轮顺时针转过的角度为720度符合标准外啮合渐开线直齿圆柱体齿轮传动角速度与齿轮的分度圆半径成反比。ADAMS分析实例-定轴轮系和行星轮系传动模拟有一对外聩合洧开线直圆柱体齿轮传动已知x1=50,32=25,m=4mm,=20°。两个齿轮的厚度都是5mm。1.启动 ADAMS双击桌面上 ADAMS/View的快捷图标,打开 ADAMS/View在欢迎对话框中选择“ Create a new model”,在模型名称( Model name)栏中输入; xingxingchiluen:在重力名称( Gravity)栏巾选择“ Earth normal(- Global y)”;在单位名称( Units)栏中选择“MMKS-mm,kg, N s, deg”。如图1-1所示。How would you l:ke to proceed?C Open an existing databaseImport a fileADAMSStart it D: AllAlS12Model name ing:ingchiluenGravity Earth Normal (-Global r)inits MMES-m,kg趴,degWurkiny Gril Fellingsv Show冒 orkime Grid图1-1欢迎对话框C Rectangular C Folar2.设置工作环境2.1对于这个模型,网格间距需要设置成更高的精度以满足要求。szC750mn)(500mm)在 ADAMS/View菜单栏中,选择设置(〈stim)下拉菜单中的工作sp网格( Working grid)命令。系统弹出设置T作网格对話框,将网格ColorWeight的尺寸Sie)中的X和Y分别设置成750mm和500m,间距( Spacing) Dots Contrast1中的X和Y都设置成50mm。然后点击“OK”确定。如图21所表 Ares Contrast1Lines Contrast厂 Triad Solid2.2用鼠标左键点击选择( Select)图标,控制面板出现在| Set location工具箱中。Set orientationQ23用鼠标左键点击动态放大( Dynamic Zo0m)图标Applyance在模型窗口中,点击鼠标左键并按住不放,移动鼠标进行放大或缩小。创建齿轮图2-1设置工作网格对话框3.1在 ADAMS/View零件库中选择圆柱Cylinder体 Cylinder)图标参数选择为“NewNew PartPart”,长度( Length)选择50mm(齿轮Y Length的厚度),半径( Radius)选择100mmm×ZV Radius210))。如图31所示。4×50100图3-1设置圆柱体选项3.2在 ADAMS/view工作窗凵中先用鼠标任意左键选择点(,,0)mm,然后选择点(0,50,0)。则一个圆柱体(PART2)创建出来。如图3-2所示。3-2创建圆柱体(齿轮)33在 ADAMS/iew中位置/方向库中选择位置旋转( Pusillum: Rotate,,)Selectedopy图标,在角度(Ange一栏中输入90.表示将对象旋转90度。如图33| About所示。在 ADAMS/wiew窗口中用鼠标左键选择圆柱体,将出来一个白色箭Angle头,移动光标,使白色箭头的位置和指向如图3-4所示。然后点击鼠标左键旋转后的圆柱体如佟3-5所示。图3-3位置旋转选项图3-4圆柱体的位置旋转35旋转90后的圆柱体34在 ADAMS/View零件库中选择圆柱体( Cylinder)图标,参数选择为“ New part”,长度( Length)选择50mm(齿轮的厚度),半径( Radius)选择50mm(m×z4×25=50)如图3-1所示。在 ADAMS/iew工作窗口口先用鼠标左键选择点(150,0,0)mm,然后选择点(150,50,0)。则一个圆柱体(PART3)创建出来。如图3-6所小。图3-6创建圆柱体(齿纶)3.5在 ADAMS/View中位置/方向库中选择位置旋转( Position: Rotate.)图标"一,在角度(Ange)一栏中输入90,表示将对象旋转90度。如图3-3所示。在 ADAMS/View窗口中用鼠标左键选择圆柱体,将出来一个自色箭头,移动光标,使白色箭头的位置和指向如图3-7所示。然后点击鼠标左键,旋转后的陨柱体如图3-8所示。3-7圆柱体的位置旋转图3-8旋转90后的圆杜体36在 ADAMS/VIew零件库中选择杆仁ik图标,,参数选择为如图39所示。在 ADAMS/View工作窗口中先用鼠标左键选择点PART2 MARKER1,然后选择点PART3 MARKER2。则一个连杆(PART4)创建出来。如图3-10所示。图3-10创建的连杆4.创建旋转副、齿轮副、固定副、旋转驱动4.1在本改计选择左边的齿轮(红色的)为固定齿轮选择 ADAMSaView约束库中的旋转副( Joint: Revolute)图标参数选择2Bod-1Loc和 Normal to grid。在ADAMS/View工作窗口中先用鼠标左键选择连杆aJ LDr3(PART_4),然后选择机架( ground),接着选择齿轮上的PART4 MARKER3,如图4-1所示。图中显亮的部分就是所创建的旋转副( JOINT1),该旋转副连接机架和连杆,使连杆能相对机架旋转。图4-1连杆的旋转别4.2再次选择 ADAMS/view约東库中的旋转副( Joint: Revolute)图标参数选择2Bod-lIoc和 Normal to grid。在 ADAMS/view工作窗口中先用鼠标左键选择齿轮(PART_2),然后选择连杆(PART_4),接着选择齿轮上的PART2cm(或者PART2 MARKER1),如图42所示。图中显亮的部分就是所创建的旋转副( JOINT2),该旋转副连接连杆和固定齿轮,使连杆能对固定齿轮旋转。因为 JOINT1和JOINT2重合在一起,所以从图4-2中区分不出来图4-2固定齿轮的旋转副43再次选择 ADAMS/view约束库中的旋转副( Joint: Revolute)饜标",参数近择2Bod-1Loc和Normal to grid。在 ADAMS/view工作窗口中先用鼠标左键选择齿轮(PART3),然后选择连杆(PART4),接着选择齿轮上的PART3cm(或者PART3 MARKER2),如图43所示。图中显亮的部分就是所创建的旋转副( JOINT3),该旋转副连接连杆和行星轮使迕杆能带动行星轮旋转。图4-3行星轮的旋转副44创建完两个齿轮和连杆上的旋转副后,还要创建两个齿轮的啮合点( MARKER)。因为行星轮要在定齿轮上做圆周运动,所以行星轮和固定齿轮的啮合点不是匝定不动的,它随着行星轮的运动而不断地变化,因此,可以把啮合点固定在连杆上,因为迕杆和行星轮一起做园周运动,并且两齿轮旋转中心的连线一定经过啮合点。下面我们将把啮合点围在连杆,并且使啮合点Z轴的方向与齿轮的传动方向相同。选择 ADAMS/view零件库中的标记点工具图标参数选择如图44所示。选择连杆(PART4)在选择连杆上点PART4cm,如图45所示,图中显亮的部分就是所创建的啮合点( MARKER_11)arherAdd to partOrientationGlobal xY图44标记点的选项图4-5固定齿轮和行星轮之间的啮合点45上面所创建的啮合点不在两个齿轮的分度圆的交线上,下面将对上面做出的啮合点进行位置移动和方位旋转使该啮合点位于两齿轮交线上,并仅啮合点的Z轴方向与齿轮旋转方向相同。在 ADAMS/VIew窗口中,在两个齿轮啮合处点击鼠标右键,选拦- Maker: MARKER14→ Modify,如图4-5所示。在弹出的对话框中,将 Location栏的值75.0.25.0,-25.改为100.0,25.0.-250(位置移动),将 Orientation栏中的值0.0.0.0.

基于主成分分析的图像融合matlab代码及实验图像

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