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专用集成电路设计实用教程

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IC设计经典教材,《专用集成电路设计实用教程》专用集成电路设计实用教程虞希清编著大學出瓶社图书在版编目(CIP)数据专用集成电路设计实用教程/虞希清编著.一杭州:浙江大学出版社,2007.1ISBN978-7-308-05113-2专..Ⅱ.虞..Ⅲ.集成电路一电路设计一高等学校一教材Ⅳ.TN402中国版本图书馆CIP数据核字(2006)第165341号专用集成电路设计实用教程虞希清编著任编辑张真封面设计张真出版发行浙江大学出版社(杭州天目山路148号邮政编码310028)(E-mail:zupress@mail,hz,zj.cn)(网址http://www.zjupress.com排版杭州好友排版工作室印刷杭州浙大同力教育彩印有限公司开本787mm×1092mm1/16印张18.25字数467千印数2001-3000版印次207年1月第1版2007年7月第2次印刷书号ISBN978-7-30805113-2定价38.00元版权所有翻印必究印装差错负责调换内容提要在现代的IC设计中,工程师们广泛地使用数字电路的逻辑综合技术。工程师们使用RTL代码和IP描述设计的功能,进行高级设计,用综合工具对设计进行编辑和优化,以实现满足设计目标的电路。根据多年为客户进行技术培训,技术支持和IC设计的经验,笔者编写了本书。书中主要介绍了IC设计的基本概念,设计流程和设计方法,并就工程师们在设计中常见的问题,提供了解决方法。本书的特点是实用性强全书共分九章,第一章概述EC设计的趋势和流程;第二章介绍用RTL代码进行电路的高级设计和数字电路的逻辑综合;第三章陈述了IC系统的层次化设计和模块划分;第四章详细地说明如何设置电路的设计目标和约束;第五章介绍综合库和静态时序分析;第六章深入地阐述了电路优化和优化策略;第七章陈述物理综合和简介逻辑综合的拓扑技术;第八章介绍可测性设计;第九章介绍低功耗设计和分析本书的主要对象是IC设计工程师,帮助他们解决IC设计和综合过程中遇到的实际问题。也可作为高等院校相关专业的高年级学生和研究生的参考书。前言本书在 Synopsys公司的逻辑综合培训资料基础上编写而成。从事EDA工作和ASIC设计已有十几年了。在给中港台ASIC设计工程师提供的技术培训和支持中,工程师们曾提出了设计和使用设计工具中遇到的各种各样的问题。教学相长,在和工程师讨论问题、提供解决方案的过程中,我得到了很多的经验和启发。在为用户解决一些实际问题,为他们提供培训后,我曾收到热情的掌声和感谢信。用户的掌声和谢意给了我很大的鼓励和鞭策,使我下决心要编写一本实用的中文版的集成电路设计教程和手册,以答谢用户们的支持和帮助。本书讲究实用性,希望其中的内容能帮助ASIC设计工程师清楚明了IC设计的基本概念,IC设计的流程,逻辑综合的基本概念和设计方法,解决进行IC设计时和工具使用时所遇到的问题。全书共分九章,第一章概述IC设计的趋势和流程;第二章介绍用RTL代码进行电路的高级设计和数字电路的逻辑综合;第三章陈述了IC系统的层次化设计和模块划分;第四章详细地说明如何设置电路的设计目标和约束;第五章介绍综合库和静态时序分析;第六章深入地阐述了电路的优化和优化策略;第七章陈述物理综合和简介逻辑综合的拓扑技术;第八章介绍可测性设计;第九章介绍低功耗设计和分析本书的主要对象是IC设计工程师,帮助他们解决IC设计和综合过程中遇到的实际问题。也可作为高等院校相关专业的高年级学生和研究生的参考书。在本书的编写过程中,得到了 Synopsys中国区高级技术经理常绍军先生的大力支持。常绍军先生、资深的应用技术顾问李昂先生和冯源先生审阅了本书,并提出了宝贵的意见和建议。在此,表示衷心的感谢。在本书编写过程中,得到了全家的支持,深表谢意!由于时间仓促,知识水平有限,书中难免有不足和错误之处,敬请各位专家,IC设计工程师和同行们批评指正,不胜感激。来函可发电子邮件( Email: victory_snps@ yahoo.com.hk)。虞希清2006年11月于 Synopsys香港目录第一章集成电路设计概论1.1摩尔定律………………∴…………11.2集成电路系统的组成1.3集成电路的设计流程第二章数字电路的高级设计和逻辑综合132.1RTL硬件描述语言设计132.1.1行为级硬件描述语言( Behavioral Level hdi)132.1.2寄存器传输级硬件描述语言( RTL HDI)172.1.3结构化硬件描述语言( Structure HDL)………………………………232逻辑综合(L。 gic Synthesis)…………………272.2.1逻辑综合的基本步骤…282.2.2综合工具 Design Compiler302.2.3目标库和初始环境设置鲁·自自音甲·是着音鲁备.··非曲●d■···●····第三章系统的层次化设计和模块划分353.1设计组成及 DC- Tcl…·自音···········日·········.···卡器日音是·晶自鲁bt·。……353.1.1设计物体( Design Object)鲁音自353.1.2 DC - Tcl简介香看·鲁·鲁·鲁.鲁自春3.2层次( Hierarchy)结构和模块划分( Partition)及修改463.2.1层次结构的概念463.2.2模块的划分…息鲁483.2.3模块划分的修改·看。51第四章电路的设计目标和约束…°。●看。面●554.1设计的时序约束…普·非鲁·鲁击曲■554.1.1同步( Synchronous)电路和异步( Asynchronous)电路…4.1.2亚稳态( Metastability)574.1.3单时钟同步设计的时序约束…血D。e574.1.4设计环境的约束724,1.5多时钟同步设计的时序约束…………794.1.6异步设计的时序约束832专用集成电路设计实用教程4.1.7保持时间( Hold Time)854.2复杂时序约束看香鲁e鲁曲鲁。自鲁自。a。自鲁自。鲁4.2.1多时钟周期( Multi-Cycle)的时序约束874.2.2门控时钟的约束904.2.3分频电路和多路传输电路的时钟约束鲁·看看看鲁924.3面积约束……………………………96第五章综合库和静态时序分析…985.1综合库和设计规则···········.······.··4·a·.·····◆···—985.1.1综合库……5.1.2设计规则1075.2静态时序分析5.2.1时序路径和分组1125.2.2时间路径的延迟1145.2.3时序报告和时序问题的诊断鲁·.···.·自击击合音。甲。。。●。。●……115第六章电路优化和优化策略…1206.1电路优化..···4····;··.·.·.·.·a·a·;··1226.1.1 Synopsys的知识产权库- Design Ware1236.1.2电路优化的三个阶段………………………1266.2优化策略…………1346.2.1编辑策略垂由d垂……1356.2.2自动芯片综合( Automated Chip Synthesis)………………………………1416.3网表的生成格式及后处理144第七章物理综合1487.1逻辑综合(L。 gic Synthesis)遇到的问题……………………1487.2物理综合( Physical Synthesis)的基本流程鲁鲁自谁…………………………1517.3逻辑综合的拓扑技术( Topographical Technology)…………162第八章可测试性设计…1748.1生产测试简介…………1748.2可测试性设计鲁D曹吾音·非·自·········着4鲁4鲁是1768.2.1物理瑕疵和故障模型1768.2.2D算法( D algorithm)1788.3测试协议( Test protocol)1858.4测试的设计规则·●鲁q鲁·音鲁鲁D鲁香曹音音音·自自··。·非鲁曲··●1908.4.1可测试性设计中的时钟信号1908.4.2三态总线和双向端口的测试。非……………………198录8.5门级网表可测试问题的自动修正2048.6扫描链的插入2088.7可测试设计的输出和流程2228.8自适应性扫描压缩技术………225第九章低功耗设计和分析2299.1工艺库的功耗模型…………2319.2功耗的分析…鲁鲁鲁……………2379.3低功耗电路的设计和优化2519.3.1门控时钟电路25293.2操作数分离………2619.3.3门级电路的功耗优化●·4·■D鲁曹春击自由2669.3.4多个供电电压( Multi-VDD)…2749.3.5电源门控………276参考文献……………………281第一章集应电路设计概记集成电路( Integrated Circuits)是现代电子设备的重要组成部分。因此,成功设计集成电路对整个电子信息技术产业的发展起到重要的作用。由于科技的发展,半导体芯片的集成化程度越来越高,设计的系统越来越复杂,规模越来越大,设计的性能越来越髙,功耗也越来越大,这些不断地给芯片设计工程师和电子设计自动化( Electronics Design Automation,简称EDA)厂商提出新的课题和挑战。1.1摩尔定律摩尔提出著名的“摩尔定律”已经40多年了。1965年4月,摩尔在《电子学( Electronics)》杂志上发表文章预言,半导体芯片上集成的晶体管数量将每年翻一番。1975年,他又提出修正说,芯片上集成的晶体管数量将每两年翻一番。晶体管数量MOORES LAWIntels Tanuma 2 Processo1000000000ante△nmtele Pentium Pr100000000Intels Pentium m Processoitels Pentium Pro10000000Intelstuma Printels*v Proces1000000Intel388 pre28610000080801000080084004●100019701975198019851990199520002005年度图1.1.1图1.1.1为在过去25年, ntel CPu中晶体管增长的情况。集成电路的规模不断地稳

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  • cpci express的标准
    目前能找到的cpci express总线的标准ContentsIntroduction1.1 Statement of Compliance131.2 Terminology131.3 Applicable Documents181.4 Objectives…191.5 Name and Logo Usage....翻1E,B面201.5.1 Logo Use201.5.2 Trademark polic201.6 Intellectual Property211.7 Special Word Usage221.8 Connectors1.8.1 Legacy CompactPCI Connectors221.8.2 High -Speed Advanced differential Fabric Connectors1.83 UPM Power Connectors∴…251.8.3.1 System Slot/Board and Type 1 Peripheral Slot/Board.251.8.3.2 Switch Slot/ Board261.8.4 eHM C271.8.5 CompactPCI Pluggable Power Supply Connector271.9 Slot and board descriptions281.9.1 Connector Reference Designators...............311.9.2 System Slot and Board1.9.3 Type 1 Peripheral Slot and Board321.9.4 Type 2 Peripheral Slot and Board331.9.5 Hybrid Peripheral slot351.9.6 Legacy Slot1.9.7 Switch Slot and board.36197.13uSwitchSlotandboard.wwwwwww.361.9.7.2 6U Switch Slot and board371.10 EXample Configurations402 Mechanical Requirements452.1 Mechanical Overview452.2 DrayStandard452.3 Units452.4 Keepout Zones452.5 Connector Requirements.452.5.1 ADF Connectors452.5.1.1 Board connectors452.5.1.3 Backplane Connectors with Hot-Plug Suppor o2.5.1.2 Backplane Connectors without Hot-Plug Support46462.5.2 eHM Connectors462.5.2.1 Board Connector Type Designation.462.5.2.2 Backplane Connectors without Hot-Plug Support .........462.5.2.3 Backplane Connectors with Hot-Plug Support..... 462.5.3 UPM Connectors462.5.3.1 Backplane Connectors…………462.5.3.2 Board Connectors without Hot-Plug Support47PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification2.5.3.3 Board Connectors with Hot-Plug Support2.5.4 HM Connectors472.5.5 47-Position Pluggable Power Supply Connector472.6 Chassis Subrack Requirements472.7 Backplane Requirements472.7.1 3U Backplane Dimensions and Connector Locations....... 472.7.2 6U Backplane Dimensions and Connector Locations2.8 Slot Numbering and Glyphs512.9 Board Requirements2.9.1 3U System/Type 1/Type 2 Board Dimensions and ConnectorLocations512.9.2 6U System/Type 1/Type 2 Board Dimensions and ConnectorLocations2.9.3 3U Switch board dimensions and connector locations wwm. 5429.4 6U Switch board dimensions and connector locations.552.9.5 Board pcb thickness562.9.6 ESD Discharge Strip562.9.7 ESD Clip562.9.8 Front Panels562.9.9 CompactPcI Express logo572.9.10 PMC/XMC Support….5729.11 Cross sectional vi582.9.12 Component Outline and Warpage582.9.13 Solder Side Cover(Optional)582. 9.14 Component Heights2.9. 15 System Slot Identification592.10 Rear-Panel 1/0 Board Requirements592.10.1 3U Rear-Panel l/o board dimensions592.10.2 6U Rear-Panel l/o board dimensions3 Electrical Requirements623. 1 Signal Definitions623.1.1 PCI Express Signals.623.1.1.1 PCI EXpress Transmit SigInaIs3.1.1.2 PCI Express Receive Signals623.1.1.3 Interconnect Definition633.1.1.3.1 Link definit633.1.1.3.2 Link Grouping.633.1.1.4 Electrical B643. 1.1.4.1 AC Coupling653.1.1.4.2 Insertion loss653.1.1.4.3 Crosstab‖k3.1.1.4,4 Lane-to-Lane skew3.1.1. 4.5 Equalization673.1.1.4.6 Skew within the Differential Pair(Intra-PairSkew)3.1.1.5 Jitter Budget Allocation683.1.1.5.1 Random Jitter(Rj)683.1.1.5.2 System Level Jitter Distribution693.1.1.5.3 Interconnect Jitter Budget693.1.1.5.4 Eye Patterns703. 1.1.5.5 Type 2 Peripheral Transmitter Eye4PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specification3.1.1.5.6 Controller Transmitter Eye3.1.1.5.7 Type 2 Peripheral Receiver Eye3.1.1.5. 8 Controller Receiver eye743.1.1.5. 9 Backplane Compliance Testing3.1.1.5. 10 Alternative Controller tX measurement.wm.773.1.1.6 Reference Clock783.1.1.6.1Hot-Pug…...….783.1.1.6.2 Clock Fan-Out..793. 1.1.6.3 Clocking dependencies3. 1.1.6.4 AC-Coupling and Biasing793.1.1.6.5 Routing length803. 1.1.6.6 Reference Clock Specification813.1.1.6.7 REFCLK Phase Jitter Specification3.1.2ESD853.1.35VauX.853.1.4 SMBI3.1.4.1 SMBus " Back Powering Considerations883.1.4.2 Backplane Identification and Capability Using SMBus. 883.1.5 PWRBTN# Signal943.1.6 PS ON# Signal.943.1.7 PWR OK Signal.......953.1.8 WAKE# Signal3.1.8. 1 Implementation Note983.1. 9 PERST# Signal993.1.9.1 nitial Power-Up(G3toL0)……………………1003.1.9.2 Power Management States(so to S3/S4 to so)1013.1.9.3 Power down1023.1.10 SYSEN# Signal…1033.1.11 Geographical Addressing1033. 1. 12 LINKCAP Signal1043.1.13/OPin1043.1.14 Reserved pins1043.2 Hot-Plug Support.1043.2.1 Hot-Plug sub-System Architecture1043.2.2 Power enable1073.2.3 Wake#1083.2.4 Module Power good1083.2.5 Present detection1083.2.6 System Management Bus1083.2.7 System Management Bus alert1083.2.8 Attention LED1093.2.9 Attention Switch1093.2.10 DC Specifications1093.3 Backplane Connector Pin Assignments1093.3.1 System SI3.3.1.1 4-Link Configuration1103.3.1.2 2-Link Combination Configuration3.3.2 Peripheral Slot I ype 11133.3. 3 Peripheral Slot Type 2.1153.3.4 Hybrid Peripheral slot.1153.3.5 Legacy slot117PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification3.3.6 Switch Slot1173.3.6.1 3U Switch Slot3.3.6.2 6U Switch Slot x4 Link width1183.3.6.3 6U Switch Slot--X8 Link Width.1213.4 Power Supply Requirements…1233.4.1 Current Available1233.4.2 Regulation and Ripple and noise1243.4.3 Backplane Power Decoupling1243. 4.4 Power Supply Timing1243.4.5 Additional Power Requirements for Boards SupportingHot-Ppluc1254 Keying Requirements4Legacy Slots and Legacy boards12642 eHM Ke126A CompactPCI Express Advanced Differential Fabric Connector......129A 1 General data129A 1.1 Objective of this document.129A.1.2Scope129A.1.3 Intended Method of mounting129A 1. 4 Ratings and characteristics130A.1.5 Normative references130A.1.6 Markings……131A 1.7 Type Designation国131A.1.8 Ordering Information132A 1. 9 Special Connector LoadingsA2 Technical InformationA.2.1 Contacts and terminations133A 3 Dimensional Information134A.3.1 Isometric view and common features.134A 3.2 Engagement Information134A.3. 2.1 Electrical Engagement Length134A.3.2.2 First Contact point135A 3.2.3 Perpendicular to Engagement direction135A.3.2.4 Inclination135A 3.3 Backplane Connectors136A 3.3.1 Dimensions1136A.3.3.2 Contacts136A.3.3.3 Contact Tip Geometry…………137A.3.3,4 Terminations137A. 3. 4 Front board connectors wwwwwwwwwww138A,3. 4. Dimensions.138A 3.4.2 Terminations138A 3.5 Mounting Information for Backplane Connectors138A. 3.5. 1 Hole Pattern on Backplanes139A 3.5.2 Backplane Contact Positional Requirements139A.3.5.3 True position of male contacts.139A.3.6 Mounting Information for Front Board Connectors.140A 3.6.1 Hole Pattern on Printed boards140A 4 Characteristics1416PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specificationA.4.1 Climatic Category141A 4.1.1 Climatic Category Test batch P: Initial EXamination .....141A 4.1.2 Climatic Category Test Batch A: Mechanical Tests.. 141A 4.1.3 Climatic Category Test Batch B: Harsh Environments. 144A.4.1.4 Climatic Category Test Batch C: Damp Heat146A 4.1.5 Climatic Category Test Batch D: ExtendedEnvironmental Tests147A 4.1.6 Climatic Categary Test Batch E: ExtendedEnvironmental Tests148A.4.2 Electrical characteristics148A.4.2.1 Impedance148A 4.2.2 Crosstalk149A.4.2.3 Propagation Delay149A42.4 Differential skew..149A 4.25 Insertion Loss149BEnriched hard-Metric ConnectorB. 1 General data国面国B150B. 1. 1 Objective of this document150B.1.2 Description of the Connector,s Approach150B.1.3 Descriptive Partitions Found Further This document150B 1.4 Normative References15B 1.4.1 Primary references describing the generic Part ofthe co151B.1.42Additionalreferenceswwwwwww.15B.1.5 Intended Method of Mounting151B 1.6 Markings.152B.1.7 Type Designation(General)152B2 Technical Information∴152B 2.1 Definitions152B 2.2 Contacts152B 2.3 Contact Performance Level154B 2.4 Keying154B.2.4.1 Mating rules155B.2.4.2 Examples for mating and nonmating configurations . 156B.2.5 Type Designation156B 2.6 Applicational Information157B 2.6.1 Alignment and Gathering157B26.2 Polarization翻面面∴158B3 Dimensional InformationQB.3.1 General158B.3.2 View and common features158B3.3 Remarks on Mating Properties of eHM Connector…………159B 3. 4 Fixed Board connector160B 3.4.1 Dimensions160B 3.4.2 TerminationsB.3.4.3 Mounting Information for Fixed Board Connectors..161B 3. 4.4 Hole pattern on fixed board161B.3.4 5 Position of connectors on fixed board∴161B 3.5 Free board connectors162B 3.5.1 Dimensions162B 3.5.2 Termination163PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not Design TO/Do Not Claim Compliance To/Do Not Distribute This specificationB.3.5.3 Mounting Information for Free Board Connectors. .......163B 3.5.4 Hole pattern on free board163B 3.5.5 Position of connectors on front board163B4 Characteristics81.163B.4.1 Climatic Category∴163B 4.2 Electrical Characteristics163B.4.2. 1 Creepage and clearance Distances163B 4.2.2 Voltage Proof164B.4.2. 3 Current-Carrying Capacity.164B.4.2.4 Contact resistance.……164B 4.2.5 Insulation Resistance.164B 4.3 Mechanica164B.4.3.1 Mechanical Operation.164B.4.3.2 Engaging and Separating Forces164B 4.3.3 Contact retesert164B 4.3.4 Static Load. Transverse.164B 4.3.5 Gauge Retention Force.164B 4.3.6 Vibration(Sinusoidal.164B 4.3.7 Shock164B 4.3.8 Polarization method165B.4.3.9 Robustness and effectiveness of coding device .........165B.4.3.9.1 Conditions According to IEC60512-7,Test 13e....B165B 5 Test schedule165B.6 Quality Assessment Procedures…………….…..….…......…...165c Universal Power Connector(UPM)166C 1 General data.I....8.4.4面面面..166C.1.1 Objective of this document166C2 Dimensions167C 3 Perpendicular to Engagement Direction169C4 Inclination169C 5 Mounting Information169C 6 Climatic Category.171Figuresg1-1 HM Connectors231-2 Advanced Differential Fabric(ADF) Connector241-3 UPM Power Connector for System and Type 1 Peripheral Slots/Boards..251-4PowerConnectorforswitchslots/boardswwwwww.26-5 eHM Connector1-647- Position CompactS| Pluggable Power Supply Connector……….281-7 CompactPCI Express 3U Slot Examples29-8 Compact PCI Express 6u Slot Examples301-9 System Board311-10 System Slot321-11 Type 1 Peripheral Board321-12 Type 1 Peripheral Slot.331-13 Type 2 Peripheral Board-14 Type 2 Peripheral Slot34PICMG EXPO CompactPCI EXpress Specification, Draft R.93, March 11, 2005Do Not Design To/Do Not Claim Compliance To/Do Not Distribute This specification1-15 Hybrid Peripheral slot351-16 Boards Supported By Hybrid Peripheral Slots361-17 3 Switch Board371-18 3 Switch Slot371-19 6U Switch board38-20 6U Switch Slot391-21 Backplane with Hybrid Peripheral Slots and Legacy Slots401-22 Backplane with all Hybrid Peripheral Slots411-23 Backplane with Type 2 and Hybrid Peripheral Slots421-24 3U Backplane with Switch, System, Type 1, and Type 2 Slots1-256 U Backplane with Switch, System,Type1, and type2S∴………43442-1 Backplane Overall Dimensions482-2 30 Backplane connector Locations492-3 6U Backplane Connector Locations502-4 board compatibility glyphs2-5 Glyph for Boards that Operate in Either System or Peripheral Slots512-6 Slot Compatibility Glyphs……512-7 3U System, Type 1, and Type 2 Board Dimensions and ConnectorLocations522-8 6U System/Type 1/Type 2 Board Dimensions and Connector Locations...532-9 3 Switch board Dimensions and connector locations542-106uswItchboarddimensionsandconnectorlocations..w.wwwwww.552-11 Modification to PCB to Support Thicker Boards562-12 CompactPCI Express Logo572-13 Alternate CompactPC| Express Logo....….….…572-14 Approximate Clearance Between the PMC/XMC PCB and the aDFConnector………………..572-15 Board cross-Sectional view82-16 3U Rear-Panel l/o board dimensions,602-17 6U Rear-Panel l/o Board Dimensions613-1 2-Link and Loss definition643-2 Backplane Connector Footprint683-3 Interconnect jitter allocation703-4 Peripheral TX Eye Mask723-5 Controller TX eye Mask733-6 Peripheral RX Eye Mask743-7 Controller RX Eye Mask753-8 Backplane TX Compliance signal763-9 Backplane RX Eye…763-10 Alternative Controller measurement783-11 Biasing for HCSL Clock Input3-12 Biasing Simulation Results.803-13 Single-Ended Measurement for swing.833-14 Single-Ended Measurement Points for delta cross point833-15 Single-Ended Measurement Points for Rise and Fall Time Matching ..........833-16 Differential Measurement Points for Duty Cycle and Period833-17 Differential measurement points for rise and fall time843-18 Differential Measurement Points for Ringback843-19 Eight-Slot Backplane Example913-20 Power Supply Timing95PICMG EXPO CompactPCI Express Specification, Draft R. 93, March 11, 2005Do Not design To/Do Not claim compliance To/do Not distribute This specification3-21 WAKE Rise and fall time measurement points983-22 WAKE# Circuit Example93-23 Power Up…1013-24 Power Management states1023-25 Power down1033-26 Typical Hot-Plug Interface Implementation1063-27 4-Link Configuration Backplane Example1103-28 2-Link Combination Configuration backplane example112A-1 Sample Part Number with Explanation132A-2 Special Connector Loading 01001面着国面国B面面国33A-3 View of connectors with common features134A-4 Connector Mating Sequence35A-5 Dimensional Drawing of Backplane 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