MATLAB仿真在现代通信中的应用
MATLAB仿真在现代通信中的应用,特别是无线通信仿真详细具体，适合无线通信研发人员使用。内容简介本书以现代无线电通信中的关键技术:扩频、跳频、OFDM、3G系统、无线接入系统以及常见无线通信系统作为对象,以 MATLAB/ Simulink作为仿真工具,对上述系统进行了仿真实验还对数字信号通过各种调制方式,发送滤波器后的频谱特性,以及应用各种差错控制方式后的传输特性给出了系列仿真实例。并对上述仿真内容进行了简单的原理性介绍,对于建模和仿真编程中出现的主要问题与注意事项做了相应敏讲解。仝书源程序附有光盘本书可作为高等学校通信专业的教学、科硏参考书,也可供管理部门作为参考资料、图书在版编目C|P)数据MATLAB仿真在现代通信中的应用徐明远,邵玉斌编著一西安:西安电子科技大学出版社,20114ISBN978-7-56062554-6Ⅰ①M…Ⅱ①徐…②邵…Ⅲ①通信系统一系统仿真一软件包, MATLABⅣ①TN914中国版本图书馆CP数据核字(2011第027693号策划臧延新责任编辑杨宗周出版发行西安电子科技大学出版社(西安市太白南路2号)电话(029)8824288588201467邮编70071网址www.xduph.com电子邮箱 xdupfxb00@163com经销新华书店印刷单位陕西天意印务有限责任公版次2011年4月第1版20ll年4月第1次印刷开本787毫米×1092毫米116印张13625数315千字印数1~2000册定价30.00元(含光盘)ISBN978-7-5606-25546/N·0594XDUP2846001-1煮如有印装问题可调换*本社图书封面为激光防伪覆膜,谨防盗版。前言近十年来,无线电技术突飞猛进,无线电事业快速发展。扩频、跳频、OFDM技术3G系统、蓝牙、IEEE802.11a、数字电视、智能天线等技术的出现,让人目不暇接。无线电成了现代文明的重要组成部分。人们在享受现代文明带来的方便与效率时,想到了应该对这些新技术和新系统多一些了解,然而,深奧的理论、复杂的技术、昂贵的设备与仪器给学习带来了不少的困难。人们在寻找与快速进步的技术相适应的学习与研究方法时,MATLAB仿真在新技术的学习与新系统的研发中成了有力的工具。应用 MATLAB的编程方法和功能模块,可以搭建各种仿真系统,还可以应用丰富的时间域、频率域、相位域的仿真测量仪器。许多新一代通信系统的系统级的仿真程序出现在 MATLAB软件的演示实例中,这使得学习的效率大为提高,对技术与系统的理解已经从概念深入到电路方案和参数选取的层面。建立和谐的电磁环境,需要了解各种无线电通信系统的特性,其中包括时间域、频率域、相位域以及传输特性。特别是它们之间的定量关系可以从仿真实例运行的结果中得到。也可以说,每个仿真实例就是一个小实验平台,实验中可以对通信的相关原理,甚至通信系统进行研究,其中的分类结果也可以作为资料备查。本书应用 MATLAB仿真工具对常见的调制方式、发送滤波器、差错控制方式以及各种通信系统(包括新一代的通信系统)的相关特性进行研究。可以运行的大量仿真实例,一方面给出了仿真的结果;另一方面还给出了部分仪表测量的结果可供比对。仿真实例大部分是作者在教学与科研实践中自行编制的,小部分是 MATLAB软件中的演示仿真实例全书分以下五部分:第一部分基础知识,包括数字调制、发送滤波器、通信信号的测量与表达。第二部分常用无线电通信系统,包括公众移动通信系统、专用移动通信系统、卫星通信系统。第三部分新技术与3G,包括扩频、跳频、OFDM以及3G系统。第四部分无线接入系统与数字电视,包括蓝牙、802.1a与数字电视。第五部分天线与射频技术,包括天线阵列、射频传输线、滤波器。书中给出了简单的原理介绍、 MATLAB仿真的系统、程序(光盘)以及程序运行结果。对编程中的主要问题与注意事项作了讲解。着重讨论了各种系统及输出信号的频谱特性。对于系统的传输特性,以及影响系统传输特性的因素,譬如调制方式、差错控制方式也进行了较系统的讨论。为了保持本书简练的篇幅,没有在书中详细介绍所有仿真系统中各个模块的参数设置,也没有将雷同的系列仿真系统的程序在书中展示。购书所附的光盘提供了书中提到的全部软件。点击模块打开对话框可以仔细研究其中每个模块的参数设置。若需要还可以将其拷贝出来后按照读者的意愿,遵循 MATLAB的相关规则更改参数后进行学习研究。本书可作为高等学校通信专业的教学、科研参考书,也可供管理部门作为参考资料。本书编写中的不妥和疏漏之处,还望读者给予指出。作者的联系方式:xumil@163com,shaoyun99@sina.com徐明远邵玉斌2011年1月说明1.用 MATLAB m文件编写的程序序号在本书中是这样表示的:比如程序35表示第3章的序号为5的程序。在 MATLAB软件中用CHX35表示。2. MATLAB/Simulink程序在本书及 MATLAB软件中都用SCHX3_10表示(第3章的序号为10的程序),该仿真系统框图在本书中用图3-10表示。3.本书的程序可运行在 MATLAB2008B版本目录第一部分基础知识第1章数字调制1.1非连续相位的角度调制31.1.1FSK信号的仿真1.1.2PSK信号的仿真1412连续相位的角度调制.1.3正交幅度调制29第2章发送滤波器,·,2.1概论322.2升余弦脉冲滤波器.332.3平方根升余弦滤波器4124高斯滤波器…46第3章通信信号的测量与表达3.1通信仿真中常用的信号测量模块3.1.1 Simulink基本模块中的 Sinks子库简介,,,,,,,,,,,,,,,,,513.12 Simulink通信工具箱中的 Comm sinks子库简介….52313 Simulink信号处理工具箱中的 Signal Processing Sinks子库简介533.2信号的测量…623.21窄带随机信号的产生和波形测量3.2.2各种信号的表示和测量633.3差错控制传输特性的测量与表达72331线性码……1733.32循环码.753.33里德-索洛蒙码773.34卷积码335汉明码3.3.6BCH码3.37循环冗余码8534信号统计参数的测量.…863.4.1统计模块库86342概率密度函数873.4.3瑞利衰落信道的仿真测试……344图像的灰度直方图3.5图像和视频信号的测量与表达3.5.1模块库…3.52图像的读出与显示933.53图像加噪与滤波…,.,,,·943.54图像的二维变换与反变换963.5.5图像有损压缩“““第二部分常用无线电通信系统第4章公众移动通信系统1014.1公众通信系统概述…….1014.1.1最早期的移动通信系统014.1.2第1代移动通信系统….4.1.3第2代移动通信系统1024.1.4第2.5代移动通信系统……,,,,,,,1044.1.5第3代移动通信系统1064.1.6第4代移动通信系统…1084.2GSM全球移动通信系统.,,非1094.3CDPD蜂窝数字分组数据网……11144NADC北美数字蜂窝网1134.5PDC个人数字蜂窝电话144.6 CDMA IS-95码分多址通信系统1174.7CT-2第2代无绳电话系统184.8数字增强型无绳通信标准12049PHS个人手持式电话系统12第5章专用移动通信系统12451集群通信系统…12452APCO数字集群通信系统1255.3 TETRA欧洲数字集群通信系统12754THTS地面航空电话系统…129第6章卫星通信系统1316.1铱星系统.1316.2美国ICO卫星通信系统13363甚小孔径终端卫星通信系统…135第三部分新技术与3G第7章新技术…1417.1扩频1417.2多元扩频7.3跳频…14674正交多载波调制OFDM.150第8章3G系统15281 WCDMA码分多址通信系统15282CDMA2000码分多址通信系统157第四部分无线接入系统与数字电视第9章无线接入系统…91蓝牙系统 BLUE TOOTH16592无线局域网 HiperLAN216993无线局域网802.11标准,.非,,,,,,,,,,,,,,,,甲174第10章数字电视系统10.1数字电视广播系统…17910.2卫星广播系统182第五部分天线与射频技术第11章天线187111天线方向图18711.2均匀直线阵的波束扫描…11111187113均匀圆形阵的波束扫描189114非均匀直线阵的波达方向估计19211.1 Capon法194114.2 Music法195第12章射频…19612.1波导19612.2传输线19812.3滤波器205参考文献207
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索尼 imx274 datesheet
imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection
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