飞机机票系统
网上机票预订系统，里面有详细的外部接口需求、性能需求、软件属性需求、数据需求、概念设计以及详细设计的部分代码相关内容,如果满意可以点击订票,把相关信息添加到机票数据库表中,如果不满意,可以点重置,所有信息清空,再重新选择。●退票窗口,用户可以根据用户信息表中的我的机票信息査询,找出机票号,在输入到机票号査询里,点击査询获得你的杋票信息以及价格显示,点击退票则在数据库机票信息表中朋除本条信息。●管理员界血的管理员添加芥血能对管理员信息进行査询、添加、删除和修改,包括用户名、登陆密码和联系方式。管理员界面的舱位信息的査询、添加、删除和修改,包括舱位等缴编号、舱位等级名称、提供的各种服务类别,以及备注信息等。●管理员界面的客机信息界面对客杋信息的添加、修改、删除和査询,包括客机编号、客机型号、购买时间、服役时间、经济舱座位数量、公务舱座位数量、头等舱座位数量以及备注信息等。●管理员界面的航线信息界面对航线信息的添加、修改、朋除和査询,包括航线编号、出发城市、到达城市、航班日期、出发时间、到达时间、客机编号、经济舱价格公务舱价格、头等舱价袼和备注信息等。●客户等级信息的的添加、修改、删除和查询,包括客户等级编号、客户等级名称折扣比例和备注信息等。管理员界面的用户信息查询,能查询所有的已注册的用户信息。管理员界面订票信息界面,可以査询所有的已订的机票的信息。23用户特点及一般约束1.管理员和用户的登陆要求合法的管理员以及用户才能登陆体统,防止系统被无关人员动用,使用字符串匹配对用户名和密码进行判断。管理员和用户的登录对相应的操作权限也不一样,如果是用户登录,管理员的窗口属性为不可用,管员冇舱位信息管,客杋信息管理,航线信息管理客户类型信息管理,客户信息和订票信息管理,用户主要有舱位査询,客机信息査询,航线信息查询,客户类型信息查询,自己的信息管理,和自己订票和退票2管理员的日常操作管理员可以对舱位信息,客杋信息,航线信息,客户类型信息,进行査询、修改和删除操作,可以对客户信息和订票信息只有査询操作。3用户的的日常操作用户可以进行注册然后登陆系统,可以查询舱位信息,客机信息査询,航线信息查询,客户类型信息,可以对自己的信息进行修改,可以定票(按照肮班号进行预订机票,显示所订机票的信息和价格,进入支付系统付账,并再次要求客户确认,确认无误后订票成功)可以退票(在特殊情况下(如天气不适合飞机起降,飞机延误超过30分钟)等给予全额退票,如果是个人原因只能退50%),对退票后的机票要在未售出机票中重新体现24功能需求(用DFD图表示)241用户注册的DFD图顶层图:点击新用填写信息P获得确认注册成功可户注册填写相应的登录信息注册图点击新用写信息PIP2获得确认户注册填写相应的返回用户注册成功信息注册信息D添加用户信息数据流图开输入用广名和密码而断用P名和测码是青正提错忍录金理面判断管理阻标志录时f结束242用户订票的DFD图顶层图用户登杳阅积订1层图PLP2用广登输入要查查洵机处理订订票订票成询D1机票信2层图D2订票信息票信息票信息P用户信息用户登陆处理用户查询用户查询订票信D3机票已卖完节息信息用户信息用户证信检查机票是D4订票有误信D1用户信息否存在机票数冒已满信息错更新机票误信息书信信用户243退票的DFD图顶层图白票信息用户登陆退票退票成功1层图D订票记用户登处理订票取消机票退票成机票信退款处退票的原因D2退票的相关规244机票信息查询的DFD图顶层图用户登的机票铜查询机机票层图:P用户脊找机处理机票机.票信机单D票信息清D2机票信25外部接口需求在用户界面方面要求错误信息格式均以弹出提示框的形式出现,硬软件接∏方面没有特别的需求,一般用户都可以直接使用。25性能需求因为系统夲身较小,并不投入实际应用,因此响应时间、结果精度方面可能会比较差,数据量大小方面能够处理较大的数据量。26软件属性需求在数据检索、数据增删改方面必须做到丝亳不差,满足软件开发的正确性要求。必须考虑充足的异常处哩机制以及软件的复用性,以便增强软件的健壮性。在安仝保密性方面倣到不同身份所能处理的事务不同,避免保密数据泄漏:设置足够的触发器对不安全的数据修改进行回滚操作,进而保证了安全性要求。所廾发出来的软件必须是叮维护的,不能把一些东西做的太妣。27数据需求(ER图表示)管理员信息实体E-R图如图2-1所示。管理员信息实体管理员编号管理员电话管理员用户名管理员密码舱位等级信息实体E-R图如图22所小。船位感位等线号m>均日图2-3客机信息实体ER图航线信息实体ER图如图2-4所示信比号备思出发城市到达球市图2-4航线信息实体ER图客户类型信息实体ER图如图2-5所示癣型实斗鬥型端号客广型姓名折比例图25客户类型信息实体ER图客户信息实体ER图如图2-6所示。吞户信实售户号客姓名联票图2-6客户信息实休ER图订票信息实体ER图如图2-7所示订票信息实体订票倌息号客户共客户信恩航线信息图2-7订票信息实体ER图实体之间关系的ER图如图2-8所示。舱位等信息机信容户垄型信客户记线设置户信息航线信息顸订机票□订哪信图28实体之间关系的ER图三、概要设计3.1总体设计(系统总流程图)网上机票预订系統用理路录广|需共●验证登陆名密码,正确进入主菜单,根据登录时所选的脊录方式(客户、管理员)的不同分别对用户设定不同的访问权限(如果是输入的客户用户名和密码正确,选择以客户方式登陆则主界面里面的管理员界面不能用,如果输入的是管理员的相应用户密码正确,以管理员的方式登陆则管珥员界面可用)不正确则清空登录框,最多可以输入三次,三次不止确系统会自动关闭登陆界面FrmLoFan用户名:Wg=icha距码:客尸登阵地定●新用户注册,新用户可以注册,注册时输入用户名可以杏询用户可不π用,可用就可以注册,注册时可以判断用户输入的密码和验证密码是否相同,相同才给以注册,如果满意可以点注册,注册成功后用户可以选择不用在回到登陆界面,可以直接陆到用户主界面,以后就可以用这个用户登录了,如果不满意,点取消,所有信息清空,重新输入注册界面Farm⊥Teg1tcrx用户注册1个人信启垆写用户名: ansi chao校验是古有重名操示长用片名由家字和导母组前A已1q位密码确认:**两输入的密码应一瘿姓名:思超性别:黑身份证号:同502419809029313庭址;太原迎新街联方式:卩3468832247输入正确的于机号电子信箱:i≤i2203183.cm我是一个开的人个人奋注:据不内提亮
- 2020-12-01下载
- 积分：1
microTCA规范
PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification
- 2020-06-05下载
- 积分：1
