STM32f1xx ADC+TIMER+DMA控制采样率

本人采集的心电信号、脑电信号数据，特别适合用来做数字信号处理……

基于相关系数影像匹配实习报告,基于相关系数影像匹配实习报告

超快速的三边定位算法，在本机实测1千万次，耗时8秒多，平均每称可以计算一百多万次。需要4个基站的数据。

用matlab实现的分水岭算法，能对粘连的东西进行分割，效果不错。。

晶圆缺陷检测与分类的卷积神经网络；针对晶圆检验时扫描电镜图像的缺陷检测和缺陷分类两问题，采用了“ ZFNet”的卷积神经网络来分类晶圆缺陷，并基于该分类器实现了一种“基于块的卷积神经网络”缺陷检测算法。为了提高准确率和加快速度，又改动“更快的区域卷积神经网络”实现了另一种检测算法。第卷第期邡鑫,史峥:晶圆缺陌检测与分类的卷积神经网络ZENet classifierDarker ImIn.ril” HumpBitel检测算法示意图在训练检测器时,数据集是检测器原始尺寸的图像,且包含标记好的缺陷区域和类型。我们结构通过·系列数据扩张操作,得到组数据,随机选取相比于检测算法主作为训练集,作为测试集。要从以下三方面进行了针对性的改进算法中需要优化的参数有滑动窗口尺寸滑()针对重复计算卷积的缺点,采用先动步幅、概率阙值、面积阙值,由于无法求出统一计算特征图,再按)进行映射各参数与检测结果的明确关系式,所以采用遍历法优化参截取的办法。如图,先通过卷积网络(数。因为检测到的缺陷尽量正确和尽量检测到所有缺陷是)对输入图像计算得到其特征图,因为在输入图像矛盾的,故以精确率和召回率的调和平均值作为优上的都能映射到特征图上,所以从输入图像上按化目标,也可根据实际需要调整两者权重满足不同侧重。割取图像进行卷积运算可以替代为直接从特征图上按测试结果映射后的范围割取,从而避免多次重复计算卷积。由于用训练好的检测模型对测试集检的大小形状不·,而全连接层的神经元连接数是固定的,测,计算模式下每张图大概耗时如果检测到的缺所以对割取得到的子特征图,通过层次采样到统陷与标准答案的且类型相同,则判为正确,否尺寸以连接到全连接层。则判为错误。得到结果如表,计算得:laut Image精确率Feature Map召回率ROI其屮正确缺陷的平均表检测器测试结果数量正确错误network有缺陷(正类)图映射示意图从检测结果来看该算法基本实现∫对图像上晶圆()针对滑动窗口尺寸单·的缺点,增缺陷的检测和分类,但是值较低,缺陷检测位置不加了滑动窗口的尺寸类型,并且增加由一个全卷积网络准确,检测耗时较长,分析其原囚如下)组成的()检测出错的数据中,缺陷较大的类型易判断错,)来预判断是否有缺陷。本文采用面积缺陷较小的容易被漏掉,说明只使用一种尺寸的滑动框很分别为,长宽比分别为、共难适应尺寸变化范围较大的缺陷种尺寸的滑动窗口,依次计算其中有缺陷的概率,再从中)滑动框步幅减小则算法耗时平方倍增加,而步幅筛选出一定数量最有可能有缺陷的区域,进行非极大值抑过长造成缺陷概率分布图分辨率较差,从而检测到缺陷位制(),最后得到一定数置准确度较差量的候选区域。()相邻滑动框都有大量重叠,所以每个区域都被多()针对缺陷检测位置准确度差的缺点,次重复送入计算卷积,导致算法耗吋较长。在全连接层后连接一个边界回归层在与上述检测算法相似的图像目标检测领域,近来出用来修正缺陷位置,该回归层与分类层并列。现的很好的克服了以上缺点并取得了很好的针对本文的缺陷检测问题,直接套用标准效果,所以下面介绍如何通过改动实现品圆并不能解决问题。因为判断晶圆的缺陷类型通常需缺陷的检测与分类。要结合缺陷区域周围的图形信息,而在预判断是否有C1994-2017ChinaAcademicJournalElcctronicPublishinghOusc.Allrightsrescrved.http://www.cnki.nct计算机工程年月日缺陷吋还进行了边界回归。虽然更加准确的给出缺陷的位()将原尺寸为的图像调整为置,但送入检测网络的特征儿乎不包含缺陷周围图肜信息,使得滑动窗口尺寸能够适应缺陷大小的变化范围,也可以导致缺陷分类不准。故木文对标准徹了一些根据实际情况来具体调整。改动:得到缺陷检测算法如图,卷积网络(()将改为只判断滑动窗口内是否有缺陷,而,)将输入图僚转换成多种特征图;根据不进行边界回归,也就是只计算所有滑动窗口有缺陷的概特征图从滑动窗口中选出最有可能存在缺陷的率,选取可能性最大的个,做非极大值抑制,再选出层根据特征图中抽取出对应特征组成特可能性最大的个进行检测。征向量;检测网络()根据特征向()将卷积层的尺寸加大为,加大感受野量判断缺陷类型,并进行边界回归;最后通过和概率),从而在判断滑动框內是否有缺陷吋能参阈值对候选缺陷进行过滤即可得到最终缺陷。考更多的周围信息。Detection NetworkonFolutionnl actorSoftmaxRuI Puling liver,e Prop卟 edMS+PrubilitessionInput Image 1024*1024Fully 10 dyercrectCcrvchrionalLaver size 747图检测算法示意图模型训练和平均值作为优化目标,并且使用相同的训练集和图中的检测算法也是基于架构实现,因为卷测试集积网络提取的特征类型对相似普遍有效,故其卷积网络的测试结果参数是直接迁移第章分类器的卷积层参数。但是用训练好的检测模型对测试集检测,和的参数则需要通过方法进行训练,标准计算模式下每张图大概耗时,采用相同判定标准,提供了分开和联合两种训练方式。为了节约得到检测结果如表(其中负类总数与表中总数不同是因时间,本文采用联合训练方式,并结合缺陷检测问题的实为同一张图屮可能检测到多个缺陷),计算得际情况调整超参数精确率在训练时,对每张输入图像,要计算的滑动窗口召回率数量庞大(种尺寸的滑动窗口,滑动步幅)。所以从中随机抽取个作为训练集,其中正例其中正确缺陷的平均负例,且正例占比不超过。分类器采用表检测器测试结果损失函数数量正确错误在训练时,设置提供个,从中随有缺陷(正类)机选取个作为训练集,其屮正例无缺陷(负类)负例,且正例占比不超过。另外设置学从结果来看该算法各方面都优于检测算习率分类器采用损失函数,而边界回法和值更高说明检测检测缺陷类型正确归采用函数。且位置准确,而且速度也大大提高(检测一张图像耗时从为了与检测算法对比,在最后通过遍历法缩小到)。如图为检测缺陷示例,共中标注了缺陷优化和概率阈值时,同样以精确率和召回率的调位置、类型和对应概率C1994-2017ChinaAcademicJournalElcctronicPublishinghOusc.Allrightsrescrved.http://www.cnki.nct邡鑫,史峥:晶圆缺陷检测与分类的卷积神经网络I I图检测结果示例图结束语而对图像上的缺陷检测和缺陷分类这两个问题,本文提出的改动后的检测算法能够精准、快速地从图像中检测出缺陷并同吋进行分类。得益于卷积神经网络良好的特征学习能力,该检测算法能够根据标记好缺陷位置和类型的数据自动学习特征,从而尽量避免人工千预,使算法具有较强的适应能力。参考文献徐姗姗刘应安徐昇基于卷积神经网络的木材缺陷识别山东大学学报工学版刘云杨建滨王传旭基于卷积神经网络的苹果缺陷检测算法电子测量技术江帆刘辉王彬等基于模型的图像识别计算机工程C1994-2017ChinaAcademicJournalElcctronicPublishinghOusc.Allrightsrescrved.http://www.cnki.nct

关于强化学习N-臂老虎机算法的理解，包括部分代码和算法流程图

PCI 3.0 规范,英文原版。PCI Local Bus Specification Revision 3.0PCI LOCAL BUS SPECIFICATION, REV.3.0ContentsPREFACESPECIFICATION.……13INCORPORATION OF ENGINEERING CHANGE NOTICES (ECNS)1查音音鲁垂音音13DOCUMENT CONVENTIONS.………14l. INTRODUCTION…151.1. SPECIFICATION CONTENTS······151.2. MOTIVATION……151.3. PCI LOCAL BUS APPLICATIONS1. 4. PCI LOCAL BUS OVERVIEW171.5. PCI LOCAL BUS FEATURES AND BENEFITS……181. 6. ADMINISTRATION…………………202. SIGNAL DEFINITION m...mn.. 212.1 SIGNAL TYPE DEFINITION222.2. PIN FUNCTIONAL GROUPS..…………222.2.1. System Pins……,…,…,,…,…232.2.2. Address and data pins242.2.3. Interface Control Pins........................252.2.4. Arbitration Pins(Bus Masters Only)272.2.5. Error Reporting Pins....垂看d。普音看鲁D指音着音,。音音自。音音音。音自垂272.2.6. Interrupt Pins( Optional)……282.2.7. Additional signals312.2.8.64- Bit bus extension pins( Optiona)…,,……………………………332.2.9. TAG/Boundary scan Pins(Optional).......342. 10. System Management Bus Interface Pins(Optional)352. 3. SIDEBAND SIGNALS362. 4. CENTRAL RESOURCE FUNCTIONS.····:·····.·············363. BUS OPERATION373.1 BUS COMMANDS373.1. Command definition373. 1.2. Command Usage rules393.2. PCI PROTOCOL FUNDAMENTALS423.2.1. Basic Transfer Control····:············.················433.2.2. Addressing.............143.2.3. Byle lane and Byte enable usage……563.2.4. Bus Driving and Turnaround非音垂垂·非573.2.5. Transaction Ordering and posting….583. 2.6. Combining Merging, and Collapsing。。音垂。音62PCI LOCAL BUS SPECIFICATION, REV.3.03.3. BUS TRANSACTIONS……643.3.1. Read transaction……………653.3.2. Write transaction3.3.3. Transaction termination.………….673.4. ARBItRAtION音垂3.4.1. Arbitration Signaling protoco1..…………………893.4.2. Fast Back-to-Back Transactions. .........................................................93.4.3. Arbitration Parking………………………………………93.5 LATENCY953.5.1. Target Latency…….953.5.2. Master Data latency……….….…….,….….…..……..….,983.5.3. Memory Write Maximum Completion Time limit3.5.4. Arbitration Latency3.6. OTHER BUS OPERATIONS……·。垂,音着垂。着音D。。着。D音着音垂。音着D音非非音垂音非·非1103.6.1. Device selection…....…,103.6.2. Special cycle...........3.6.3. IDSEL Stepping…………,,…,…,,…,,…,,,,,………,…1133.6.4. Interrupt acknowledg3.7. ERROR FUNCTIONS春音·。音垂1153.7.. Parity ger1153.7.2. Parity Checking...........………,163.7.3. Address parity errors…...…,…163.7.4.Error Reporting…17173.7.5. Delayed Transactions and Data Parity Errors.......... 203.7.6. Error Recovery.............,213. 8. 64-BIT BUS EXTENSION1233.8.1. Determining bus Width during System initialization.…….…,1263.9.64- BIT ADDRESSING…..…………………………………………1273.10SPECIAL DESIGN CONSIDERATIONS.1304. ELECTRICAL SPECIFICATION.. m.m.9.1374.1. OVERVIEW…1374.1.1. Transition Road Map……1374.1.2. Dynamic vs Static Drive specificalion…1384.2. COMPONENT SPECIFICATION.……,………………,1…………………1394.2.1. 5V Signaling environment1404.2.2. 33V Signaling environment鲁鲁·垂垂1464.2.3. Timing specification1504.2.4.1determinate Inputs and metastable作,…………1554.2.5. Vendor provided specification..,..…,.…………….………17564.2.6. Pinout recommendation157PCI LOCAL BUS SPECIFICATION. REV.3.04.3. SYSTEM BOARD SPECIFICATION.………1584.3.1. Clock skew,…………………1584.3.2.R··1584.3.3. Pull-ups:····.················:·····…1614.3.4Power1634.3.5. System Timing Budget. ...........1644.3.6. Physical requirements............………674.3.7. Connector Pin assignments……/6844. ADD-IN CARD SPECIFICATION1714.4.1.Add- in Card Pin Assignment..,.,.,………………,1714.4.2. Power Requirements….,.,.,.,.,.,.,,.….,764.4.3. Physical requirements.........1785. MECHANICAL SPECIFICATION1815.1. OVERVIEW1812. ADD-IN CARD PHYSICAL DIMENSIONS AND TOLERANCES...........1825.3. CONNECTOR PHYSICAL DESCRIPTION…………………1954. CONNECTOR PHYSICAL REQUIREMENTS. ...............................2055. CONNECTOR PERFORMANCE SPECIFICATION……………,…2066. SYSTEM BOARD IMPLEMENTATION……………2076. CONFIGURATION SPACEb●看●鲁D鲁0e●2136. 1. CONFIGURATION SPACE ORGANIZATION音垂垂D·垂看垂…2136.2. CONFIGURATION SPACE FUNCTIONS .......................2166.2.1. Device ldentification鲁垂垂2166.2.2. Device Control鲁着鲁D垂2176.2.3. Device status2196. 2.4. Miscellaneous registers·······:········:···:·:··:·:······:··············4······:····2216.2.5. Base addresses……………………….22463. PCI EXPANSION ROMS2286.4. VITAL PRODUCT DATA.2296.5. DEVICE DRIVERS2296.6. SYSTEM RESET.…………………………2306.7. CAPABILITIES LIST2308. MESSAGE SIGNALED INTERRUPTS ...................................................................2316.8.1. MSI Capability Structure..............2326.8.2. MSl-X Capability and Table structures……………….……..2386.8.3. MSI and Msi-X Operation2467. 66 MHZ PCI SPECIFICATION2557. 1. INTRODUCTION2557.2. SCOPE7. 3. DEVICE IMPI TION CONSIDERATIONS7.3.1. Configuration space.......2557. 4. AGENT ARCHITECTURE256PCI LOCAL BUS SPECIFICATION, REV.3.07.5. PROTOCOL.……2567.5.1.66 MHZ ENABLE(M66EN) Pin definition.…………,………,,2567.52Latency..-..-.-2577.6. ELECTRICAL SPECIFICATION……………2577.6.. Overview·.·······.··2577.6.2. Transition roadmap to 66 MHz PCI··········.2577.6.3. Signaling Environment.......... 2587.6.4. Timing specification.……2597.6.5. Vendor provided specification. 26.57.6.6. Recommendations·.·························:············:······:········.:··········2657.7. SYSTEM BOARD SPECIFICATION.………,…,……………2667.7.1. Clock Uncertainty ......2667.7.2. Reset2677.7.3. Pullups..2677.7.4. Power..······.·.·::·····布鲁····音D鲁番。是。音垂看····非D∴2677.7.5. System Timing Budget7.7.6. Physical requirements2687.7.7. Connector Pin assi! nments…..,.,.,..,.,.,..,.,.,2697.8. ADD-IN CARD SPECIFICATIONS春音·。音垂2698. SYSTEM SUPPORT FOR SMBUSn2718. 1. SMBUS SYSTEM REQUIREMENTS2718.1.1. Power………278. 2. Physical and Logical sMBi27l8.1.3. Bus connectivit2728.1.4. Master and slave support....….….…..…..…..,2738.1.5. Addressing and Configuration2738.1.6.Ele2748.1.7. SMBus behavior on Pcl reset.........................2748.2.ADD- IN CARD SMBUS REQUIREMENTS…………2758.2.7Connection2758.2.2. Master and Slave Support...,.…..…….…,...….,2758.2.3. Addressing and Configuration……,…,…,……,…,…,…,….….…..….,2758. 2. 4. Power2758. 2.5. Electrical.········.····························275A. SPECIAL CYCLE MESSAGES●鲁●e鲁277A 1. MESSAGE ENCODINGS277A,2. USE OF SPECIFIC ENCODINGS ................................................277B. STATE MACHINES279B. 1. TARGET LOCK MACHINE·;.···.:..···:...···:··.·:····281B.2. MASTER SEQUENCER MACHINE283B 3. MASTER6PCI LOCAL BUS SPECIFICATION. REV.3.0C. OPERATING RULES289C 1. WHEN SIGNALS ARE STABLE..·····.:·.·.::···:·;289C.2. MASTER SIGNALS…音·。·看290C.3. TARGET SIGNALS…291C.4. DATA PHASES…292C.5. ARBITRATION.……………………………………292C.6. LATeNCY······:“·······293C.7. DEVICE SELECTION……………,……………………………293C 8. PARITY垂垂垂D·垂294D. CLASS CODESD 1. BASE CLASS OOH...w.w...296D 2. BASE CLASS OlH296D. 3. BASE CLASS O2H··297D 4. BASE CLASS O3H297D.5. BASE CLASS04H.………………………298D. 6. BASE CLASS OSH298D.7. BASE CLASS06H...………….…………………299D 8. BASE CLASS OZH,300D 9. BASE CLASS OSH.301D.10. BASE CLASS C9H.……………………………………………….301D.11. BASE CLASS OAH.…………………302D 12. BASE CLASS OBH302D. 13. BASE CLASS OCH303D.14. BASE CLASS ODH….…304D. 15. BASE CLASS OEH304D. 16. BASE CLASS OFH·····.····;····:·;:·······304D.17. BASE CLASS JOH.……………………………………………1305D, 18. BASE CLASS 11H305E. SYSTEM TRANSACTION ORDERINGE.I. PRODUCER- CONSUMER ORDERING MODEL308E. 2. SUMMARY OF PCI ORDERING REQUIREMENTS310E.3. ORDERING OF REQUESTS........................................311E.4. ORDERING OF DELAYED TRANSACTIONS…………312E.5. DELAYED TRANSACTIONS AND LOCK#.317E.6. ERROR CONDⅠ TIONS……318. EXCLUSIVE ACCESSES..m.msn0..319F.1. EXCLUSIVE ACCESSES ON PCIF 2. STARTING AN EXCLUSIVE ACCESS321F.3. CONTINUING AN EXCLUSIVE ACCESS323F 4. ACCESSING A LOCKED AGENT324F 5. COMPLETING AN EXCLUSIVE ACCESS325F. 6. COMPLETE BUS LOCK ......................................................................325IO SPACE ADDRESS DECODING FOR LEGACY DEVICES..9.... 327PCI LOCAL BUS SPECIFICATION, REV.3.0CAPABILITY IDS。,0329I. VITAL PRODUCT DATA331VPD FORMAT3I.2COMPATIBILITY……………………………334L.3. VPD DEFINITIONS3341.3.1. VPD Large and small resource Data Tags......·D垂看3341.3.2. VPD Example…3378PCI LOCAL BUS SPECIFICATION. REV.3.0FiquresFIGURE -I: PCI LOCAL BUS APPLICATIONS春DFIGURE 1-2: PCI SYSTEM BLOCK DIAGRAM17FIGURE2-1: PCI PIN LIST.…………..…………21figure 3-1: ADDRESS PHASE FORMATS OF CONFIGURATION TRANSACTIONS...... 48Figure 3-2: LAYOUT OF CONFIG ADDRESS REGISTER, ..............................................50Figure 3-3: HOST BRIDGE TRANSLATION FOR TYPE O CONFIGURATION TRANSACTIONSADDRESS PHASE51FIGURE3-4: CONFIGURATION READ…………156FIGURE3-5: BASIC READ OPERATION………………………65FIGURE 3-6: BASIC WRITE OPERATION66FIGure 3-7: MASTER INITIATED TERMINATION........................ 68FIGURE3-8: MASTER- ABORT TERMINATION…………69Figure 3-9: RETRY. ..........................................................................................................73FiGure 3-10: DISCONNECT WITH DATA. ........................74FiGure 3-11: MASTER COMPLETION TERMINATION:·:····:··.·4····.···…75FiGURE 3-12: DISCONNECT-1 WITHOUT DATA TERMINATION·····76Figure 3-13: DISCONNECT-2 WITHOUT DATA TERMINATION76FiGure 3-14: TARGET-ABORT…177figure 3-15: BASIC ARBITRATIONFIGuRE 3-16: ARBITRATION FOR BACK-TO-BACK ACCESS…94FiGurE 3-17: DEVSEL# AsSERTION·····:···.·:··110Figure 3-1 8: IDSEL STEPPING114FiGure 3-19: INTERRUPT ACKNOWLEDGE CYCLE. ...................................................114FIGURE3-20: PARITY OPERATION………116FIGuRE 3-21: 64-BIT READ REQUEST WITH 64-BIT TRANSFER125FIGURE 3-22: 64-BIT WRITE REQUEST WITH 32-BIT TRANSFER..........126FIGURE 3-23 64-BIT DUAL ADDRESS READ CYCLE129FIGURE 4-1: ADD-IN CARD CONNECTORS...........................138FIGURE4-2:V/ICURⅤ ES FOR5 V SIGNALING.…………………143FIGURE 4-3: MAXIMUM AC WAVEFORMS FOR 5V SiGnaling145FIGURE 4-4: V/I CURVES FOR 3.3V SIGNALING148FIGURE4-5:MAⅹ IMUM AC WAⅤ EFORMS FOR3.3ⅴ SIGNALING………150FIGURE 4-6: CLOCK WAVEFORMS151FIGURE 4-7: OUTPUT TIMING MEASUREMENT CONDITIONS.··4·:······.·154FIGURE4-8: INPUT TIMING MEASUREMENT CONDITIONS…………154FIGURE 4-9: SUGGESTED PINOUT FOR POFP PCI COMPONENT···“···:.···.····:·········157FIGURE4-10: CLOCK SKEW DIAGRAM………158FIGURE 4-1: RESET TIMING16lFIGURE4-12: MEASUREMENT OF TPROP,3.3 VOLT SIGNALING……………166FIGURE 5-1: PCI RAW ADD-IN CARD(3.3V, 32-BIT).183FIGURE 5-2: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 32-BIT)..........184FIGURE 5-3: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 64-BIT)....185FIGURE 5-4: PCI RAW LOW PROFILE ADD-IN CARD(3.3V, 32-BIT)..........186PCI LOCAL BUS SPECIFICATION, REV.3.0FIGURE5-5: PCI ADD-Ⅰ N CARD EDGE CONNECTOR BEⅤEL……187FIGURE56: PCI ADD-IN CARD ASSEMBLY(3.3V)……………………………88FIGURE 5-7: LOW PROFILE PCI ADD-IN CARD ASSEMBLY 3.3V)189FIGURE 5-8: PCI STANDARD BRACKET………190FIGuRE 5-9: PCI LOW PROFILE BRACKET191FIGURE 5-10: PCI STANDARD RETAINER···192FIGURE5-11: IO WINDOW HEIGHT∴………………193FIGURE 5-12: ADD-IN CARD INSTALLATION WITH LARGE IO CONNECTOR.......194FIGURE 5-13: 32-BIT CONNECTOR196FIGURE 5-14: 3.3V/32-BIT CONNECTOR LAYOUT RECOMMENDATION. ........................197FIGURE5-15:3.3V/64-BIT CONNECTOR198FIGURE 5-16: 3.3V/64-BIT CONNECTOR LAYOUT RECOMMENDATION 199FIGURE 5-17: 3.3V/32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES2(垂D·。垂,音着垂。着音D。。着。D音着音垂。音着音FIGURE 5-18: 3.3V/64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES….201FIGURE5-19: UNIVERSAL 32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES………………………………202FIGURE 5-20: UNIVERSAL 64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES203FIGURE5-21:PCⅠADD- IN CARD EDGE CONNECTOR CONTACTS……204FIGURE5-22: CONNECTOR CONTACT DETAIL………………205FIGURE 5-23: PCI CONNECTOR LOCATION ON SYSTEM BOARD208FIGURE5-24:32- BIT PCI RISER CONNECTOR……209FIGURE 5-25: 32-BIT/3.3V PCI RISER CONNECTOR FOOTPRINT210FIGURE 5-26: 64-BIT/3.3V PCI RISER CONNECTOR211FIGuRE5-27:64-BI/3.3ⅴ PCI RISER CONNECTOR FOOTPRINT∴………212FIGURE 6-1: TYPE OOH CONFIGURATION SPACE HEADER215FIGURE 6-2: COMMAND REGISTER LAYOUT217FIGURE6-3: STATUS REGISTER LAYOUT……………………………219FIGURE 6-4: BIST REGISTER LAYOUT222FIGURE 6-5: BASE ADDRESS REGISTER FOR MEMORY........... 225FIGURE 6-6: BASE ADDRESS REGISTER FOR L/O225鲁着D音看FIGURE 6-7: EXPANSION ROM BASE ADDRESS REGISTER LAYOUT.....,..... 228FIGURE6-8: EXAMPLE CAPABILITIES LIST…….231FIGURE6-9: MSI CAPABILITY STRUCTURES…..……233FIGURE 6-10: MSI-X CAPABILITY STRUCTURE238FIGurE 6-11: MSI-X TABLE STRUCTURE翻音。音239FIGurE 6-12: MSI-X PBA STRUCTURE…239FIGURE 7-1: 33 MHZ PCI VS 66 MHZ PCI TIMING······:··················257FIGURE7-2:3.3 V CLOCK WAVEFORM.…………259FIGURE 7-3: OUTPUT TIMING MEASUREMENT CONDITIONS263FIGURE -4: INPUT TIMING MEASUREMENT CONDITIONS263FIGURE75:TvAL(MAX) RISING EDGE…………264FIGURE 7-6: TVAL(MAX) FALLING EDGE·265FIGURE77:TVAL(MIN) AND SLEW RATE……26510

标准遗传算法优化支持向量机的参数，用matlab实现的，简单易学，适合初学matlab和GA算法的童鞋们。

采用Matlab编写的有限元方法，效果非常好

BLDC无感无刷电机电调设计 转自timegate 墨鸢 ，12Vsheji