蒙特塔罗

利用for语言精确模拟混凝土的全过程弹性本构(Accurate simulation of the whole process of elastic constitutive of concrete by for language)

最小二乘拟合的matlab程序，用于数据处理。简单，易懂(The least squares fitting matlab program for data processing.Simple, easy to understand)

to judge points in a polygon

截断奇异值分解技术是一种正则化方法，用于不适定问题的数值计算(Truncated Singular Value Decomposition is a regularizaiton method for ill-conditioned problem computation.)

线弹性模型，可以对一般的弹性体通过abaqus进行验证使用(Linear elastic model)

实现构建矩阵，矩阵的相加，相减，清零，以及转置，还有相乘的功能。(To build matrix, the matrix addition, subtraction, reset, and transposed, and the function of the multiplication. )

插值法： （1）拉格朗日插值 （2）牛顿插值 （3）分段线性插值 （4）Hermite 插值 （5）样条插值(Interpolation method: (1) Lagrange Interpolation (2) Newton interpolation (3) piecewise linear interpolation (4) Hermite interpolation (5) spline interpolation)

用于弹塑性本构的切线刚度计算，基于塑性本构的增量理论编写(flow theory coupled with damage failure criteria of the program for the vumat ABAQUS program, functional simulation load to failure of the process of destruction)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

说明：  siPLS和biPLS是两种用于近红外光谱特征波段筛选的变量选择方法，可筛选出与兴关注指标密切相关的特征波段，并去除无关和干扰变量，提高模型稳健性(Bipls and sipls are two variable selection methods for screening the characteristic intervals of near-infrared spectra, which are closely related to performance indicators, to improve the robustness of models.)