AF-Damage-HLCF_7075_7451

手机平台上使用的计算器源码,QT编码，简易计算器(Calculator for moilephone，base in QT)

一个可以计算二维散射问题的矩量法程序(a calculation of the two-dimensional scattering Moment Method procedures!)

解线性代数方程组的顺序高斯消去法。使用c++标准库的vector实现。(Solution of linear algebraic equations order Gaussian elimination. Use c++ standard library vector implementation.)

二维情况的chan定位算法，1994年原版论文代码实现，可以支持远近和linear nonlinear四种模式(2 dimension chan algorithm, TDOA localization. Including near, far field and linear nonlinear sensor array)

求概率分布函数的参数方法 采用迭代法估计Beta分布的分布参数，(Estimation of distribution parameters of Beta distribution by iterative method)

说明：  Dijkstra算法与Floyd算法的matlab实现，以求解最短路问题(Dijkstra algorithm and Floyd algorithm matlab realize in order to solve the shortest path problem)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

计算流体力学软件Fluent中所有的曳力模型UDF程序(Fluent CFD software, all of the drag model for UDF)

nelder-mead algorithm for unconstrained optimization simulation in c programming language

说明：  这是数值分析的一些作业实验，文件中有详细的文档对理论，实验和算法的说明，用于病态方程组求解的源代码(This is the numerical analysis of the experimental operation, the paper detailed documentation of theory, experiment and the algorithm shows that morbid equation for solving the source code)