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圆面上的点到圆心的距离 圆面上的点到圆心的距离 圆面上的点到圆心的距离 圆面上的点到圆心的距离(Round surface of the distance from point to circle center point of the surface of the distance to the center circle to the center point of the surface of the distance from the surface point to the center circle distance)

基于改进的广义S变换，能更好的对数据进行时频分析。(Modified S-transform and its application in data analysis)

说明：  四阶龙哥库塔方法求解一阶微分方程的数值解法，能自定义迭代步数和迭代精度，非常适合于计算方法的初学者。(Long Ge Kuta fourth-order methods for a numerical solution of differential equations can be customized and iterative iterations precision calculation method is suitable for beginners)

计算由样本矩阵X及其标签列向量label得到的csp投影矩阵 (calculate csp matrix )

说明：  算法知识讲解，是一本不错的算法入门级教材的pdf版本(This is a good introduction to algorithm)

瑞利分布的随机变量，标准高斯分布的随机变量，莱斯分布的随机变量(Random Variables of Rayleigh Distribution, Standard Gauss Distribution and Rice Distribution)

四犬相逐问题的计算机模拟 mathematica程序源代码 (Four dogs with the problem by computer simulation source code mathematica)

Maximum Flow Graph (Boykov Kolmogorov Algorithm)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

自己实现的一个简单的计算器，支持大数的加减乘除、开平方等操作，不适用库函数。(Themselves to achieve a simple calculator, to support the addition and subtraction, multiplication and division of large numbers, such as square root operations, library functions do not apply.)