Dsp_Final

数值分析中运用matlab用hermit插值多项式逼近函数(Numerical analysis using matlab function hermit interpolation polynomial approximation)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

用MRT-LBM计算顶盖驱动流的程序，比LBGK方法更加稳定。(Codes for lid-driven flow with MRT-LBM, which is more stable than LBGK.)

this is a source code written in the matlab format for the teaching learning optimization algorithm.

一个简单的傅立叶带亮度描绘子提取图像的形状特征程序(A simple Fourier descriptor with the brightness of the image shape feature extraction procedures)

信号维数的估计，计算一维光子晶体的透射特性和反射特性，小波包分析提取振动信号中的特征频率。( Signal dimension estimates, Calculated transmission characteristics and reflection characteristics of the one-dimensional photonic crystals, Wavelet packet analysis to extract vibration signal characteristic frequency.)

可控源电磁法（CSEM）一维反演程序，利用Occam算法(1d inversion program for CSEM)

用幂法反幂法求解方阵的最大最小特征值及其特征向量，C语言程序，基本的数值计算算法(power method and inverse power method)

ADM for Compressive sensing

说明：  关闭OFDM信号子载波，画出OFDM信号频谱图，查看旁瓣泄露情况(Close OFDM signal sub-carrier OFDM signal spectrum plot, view the situation sidelobe leakage)