GOCEPARSER

利用龙格库塔法（等步长，变步长）计算椭圆方程，双曲线方程，抛物线方程等。对各类微分方程进行数值计算。(The use of Runge-Kutta method (such as step, variable step size) calculated elliptic equations, hyperbolic equations, such as parabolic equation. Various types of differential equations for numerical calculation.)

用于多学科设计优化中代理模型技术，移动最小二乘法是代理模型方法的一种(For multidisciplinary design optimization in the agent model, the moving least squares method is a kind of agent model)

kaerman 滤波MATLAB工具 以及程序(kaerman MATLAB TOOL)

多孔介质流动程序，基于Shan-Chen模型，使用格子玻尔兹曼理论(Multi-component fluid, using a LB method,based on the Shan-Chen model)

主要是交通行业的时空矩阵的3维热力图表达方式，不同检测器与不同时间段的流量作为颜色的第三位导入，热力图调整颜色表达更清晰(mianly used for transportation engineering. It can plot the three dimension of the real traffic situation, including different temporal and spatial. the code also can modify the parameter of the colorbar.)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

分数傅里叶变换和分数余弦变换，动态展示实部，虚部和模值(Computation of the Fractional Fourier Transform)

该程序利用最小二乘法进行拟合多元非线性方程。是我做毕设的时候写的。希望对大家有用。(This code can fit multivariable nonlinear equation by using least squares.)

通过完整ansys命令流，模拟分析悬索桥变形。希望对学习ansys有限元及桥梁工程的技术人员有所帮助。(无)

说明：  朴素贝叶斯算法，以函数形式实现，花了一个上午的时间(Naive Bayes algorithm, in order to function the form of implementation, a morning flower time)