Quarter

大气参数计算，含密度、湿度、粘性、热导率等(-Air parameters, density, humidity, viscosity, thermal conductivity)

说明：  LMF方法解非线性方程组，有例子，可以直接运行！(LMF method to solve nonlinear equations, there are examples, can be directly run!)

ABAQUS 具有强大的非线性求解能力和便捷的子程序接口及二次开发功能(The commercial FEM software ABAQUS has both powerful capacity for numerically solving varied large-scale nonlinear problems in engineering practice and user-friendly possibility for extending material libraries to consider the given constitutive model of a specific material.)

说明：  用于在数值分析中，对于离散点进行拉格朗日差值拟合(Lagrangian difference fitting)

考虑了静态传递误差，齿轮几何偏心的影响建立3平行轴齿轮啮合动力学模型(Consider the impact of static geometry eccentric transmission error, the establishment of three parallel shaft gear gear dynamics model)

使用lasso方法，对特征矩阵进行优化特征选择（向量选择），使其达到最优。(Use lasso method, optimize the characteristic matrix feature selection (vector selection), to the optimal.)

说明：  ADI method for solving PDE equations

说明：  非常好的地形改正程序，只需要有点位的经纬度，重力值和高程，内附例子和说明。(Program to compute terrain effects on gravimetric quantities.various modes of terrain effects may be computed)

CFD数值计算中kw-sst两方程湍流模型的相关代码(kw-sst two equation turbulence model of CFD numerical calculation)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)