SparseMatrix.tar

这是一个对时间序列进行短时傅立叶变换的源程序,测试过,好用的.(This is a program for STFT,which had tested.)

可以进行简单的数学运算：加、减、乘、除,sin(),cos(),tan()等，还可以对数字进行取余和开方的运算。但仅限于十进制下，还可以进行数的正、负之间的相互转换，exit表示退出, clear表示初始化，有一个 TextField用于显示传来的计算结果；Server端用于监听连接请求、计算发送过来的两数的和、送回数据结果。(Can perform simple arithmetic: add, subtract, multiply, divide, sin (), cos (), tan (), etc. can also figure to take over and prescribing arithmetic. But only under the metric system can also be used for a number of positive and negative between the conversion, exit, said exit, clear that the initialization, there is a TextField to display the results from the calculation Server client connection requests for eavesdropping, calculated sent the two and the number of returned data.)

最小二乘拟合的matlab程序，用于数据处理。简单，易懂(The least squares fitting matlab program for data processing.Simple, easy to understand)

输出三维数据可供tecplot软件读取的二进制文件(Output data for three-dimensional software to read the binary file tecplot)

说明：  大名鼎鼎的burges 方程的Fortran语言程序。Burges方程式源项为零的NS方程，在某些情况下市很有用的。(Famous burges equation Fortran language program. Burges equation source term to zero NS equations, in some cases, city, very useful.)

同时正交匹配追踪算法的MATLAB程序，一些文献中也被翻译成同步正交匹配追踪。(Simultaneous Orthogonal Matching Pursuit(SOMP))

to judge points in a polygon

使用matlab进行 有限元计算，内含多种方式方法，欢迎交流讨论(Finite element calculation using matlab)

详细全面的蒙特卡洛PPT讲解以及MATLAB算例，帮助大家0基础快速掌握MC的精华所在。(Detailed and comprehensive Monte Carlo PPT to explain and MATLAB example, to help you basically grasp the essence of MC.)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)