bispecd-and--bispeci

nsolgm 算法 是求解非线性方程组的一种非常有效而且又快捷的方法(nsolgm algorithm for solving nonlinear equations is a very effective and efficient way and)

数据挖掘讲义第六章聚类分析,PDF文件大小约520K(Data mining handout Chapter 6 clustering analysis, PDF file size is about 520K)

c++运算符程序编写运用，包括+，-，*，/，>>,<<(c++ operator programming use, including+,-,*, /, > > , < < )

使用Fortran编程，有限差分法计算雷诺方程(Reynolds equation calculated using Fortran programming, finite difference method)

最高用水量时，给水管网平差程序，c语言开发，含实例演示(When the maximum water consumption, water distribution network adjustment program, c language development, with examples demonstrate)

计算流体力学;高精度7阶二维weno格式;矢通量分裂方法(Vector flux splitting in 7 order two dimensional WENO scheme)

给出变量的上下边界、初值和代价函数，能够搜索代价函数最小值时的变量取值。属于带约束的优化算法，可以用来求算非线性方程组。(STRSCNE is a Matlab code for constrained nonlinear systems of equations F(x)=0 l<=x<=u where F: R^n--> R^n, l and u are vectors of dimension n. Non-existent lower and upper bounds, i.e. entries of l and u equal to minus o plus infinity, are allowed. The algorithm is a globally convergent procedure that combines Newton method and an elliptical trust-region approach. The elliptical trust-region is defined employing a scaling diagonal matrix D and the trust-region subproblem is approximately solved by the dogleg method. Only strictly feasible iterates are generated. Various input/output options are provided, and we refer to the code itself for further documentation. )

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

自适应网格生成的文章，广泛的应用到有限元和无网格方法中(a nice paper of adaptive mesh generation)

QR分解法是目前求一般矩阵全部特征值的最有效并广泛应用的方法，一般矩阵先经过正交相似变化成为Hessenberg矩阵，然后再应用QR方法求特征值和特征向量。它是将矩阵分解成一个正规正交矩阵Q与上三角形矩阵R，所以称为QR分解法,(QR decomposition )