可以实现求解微分方程组的数值解 func

采用凸优化的理论解决优化问题，使用python语言，采用pip安装即可(The convex optimization theory is used to solve the optimization problem. Python language is used and pip is installed)

包括牛顿法，阻尼牛顿法，变尺度算法，最速下降法的优化算法程序。(Newton' s method, damped Newton method, variable metric algorithm, the steepest descent method optimization algorithm.)

插值、拟合与规划问题 插值、拟合与规划问题(Interpolation, fitting with the planning of interpolation, fitting and planning issues)

通径分析算法实现，没有gui的小程序，用于数学实验方面的联系，一般计算数学的课程设计(Path analysis algorithm, there is no gui applets, links to mathematical experiments, the general computational mathematics curriculum design)

数字信号处理FFT算法rfft.c，简单易懂。。(Digital signal processing FFT algorithm rfft,Straightforward..)

测绘程序，计算测边网各点坐标的评查程序，值得借鉴(Mapping program to calculate the coordinates of each point measured the side-netting of assessment investigative procedures, worth learning)

判断城市电话区号是否合法的算法,对于理解算法有参考意义(Urban telephone area code to determine the legality of the algorithm, algorithm reference value for understanding the)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

说明：  C++ SGP4 Satellite Library

偏最小二乘回归在matlap中的实现，源代码，有交叉效应(The implementation of partial least squares regression in matlap, source code, cross effect)