EPSO

西安电子科技大学葛德彪教授书后所附fortran程序(Xidian University, Professor Ge Debiao book accompanying fortran program)

由Music算法估计线阵波达方向，搜索频谱波峰。(Estimation of linear array DOA by Music algorithm, searching spectral peak.)

用于矩阵的一种cholesky分解方法，第一次上传请多关照(cholesky method for matrix decomposition)

电力系统继电保护中经常应用的滤波算法，基于电力系统电流信号的傅里叶变换。程序给出了算法的仿真实现。(Power system, Filtering Algorithm, Fourier Transform, Simulation in matlab)

利用下载的goce原始数据，计算得出含有时间/经纬度/重力梯度格式的程序(Use downloaded goce raw data, calculated with the time/latitude/gravity gradient program formats)

说明：  A numerical method for analysis of Korres2003

录音程序，音频录音fft程序，并加界面显示(radio record code)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

一篇关于qkf文献, 量测方程四元素线性推导过程。 (A Novel Quaternion Kalman Filter)

克立格插值工具箱介绍，用于计算克里金插值计算问题(Kriging Toolbox introduced Kriging interpolation calculation is used to calculate)