徕卡Geocom使用手册

matlab编的一个用于对统计数据进行威布尔分布的估计，并对其进行三参数的评估与计算。

非常好用的float和hex 互相转换工具 值得下载

目 录摘要 ………………………………………………………………………………………1关词 ………………………………………………………………………………………1Abstract …………………………………………………………………………………1Keywords …………………………………………………………………………………1绪 论 　 ……………………………………………………………………………………21 网站可行性研究 31.1 技术的可行性 31.2 经济可行性 31.3 操作的可行性 32 需求分析 42.1 网站系统运行环境 42.2 网站系统现状与实现

两种降低OFDM峰均比的优化算法研究以及MATLAB仿真

PCI 3.0 规范,英文原版。PCI Local Bus Specification Revision 3.0PCI LOCAL BUS SPECIFICATION, REV.3.0ContentsPREFACESPECIFICATION.……13INCORPORATION OF ENGINEERING CHANGE NOTICES (ECNS)1查音音鲁垂音音13DOCUMENT CONVENTIONS.………14l. INTRODUCTION…151.1. SPECIFICATION CONTENTS······151.2. MOTIVATION……151.3. PCI LOCAL BUS APPLICATIONS1. 4. PCI LOCAL BUS OVERVIEW171.5. PCI LOCAL BUS FEATURES AND BENEFITS……181. 6. ADMINISTRATION…………………202. SIGNAL DEFINITION m...mn.. 212.1 SIGNAL TYPE DEFINITION222.2. PIN FUNCTIONAL GROUPS..…………222.2.1. System Pins……,…,…,,…,…232.2.2. Address and data pins242.2.3. Interface Control Pins........................252.2.4. Arbitration Pins(Bus Masters Only)272.2.5. Error Reporting Pins....垂看d。普音看鲁D指音着音,。音音自。音音音。音自垂272.2.6. Interrupt Pins( Optional)……282.2.7. Additional signals312.2.8.64- Bit bus extension pins( Optiona)…,,……………………………332.2.9. TAG/Boundary scan Pins(Optional).......342. 10. System Management Bus Interface Pins(Optional)352. 3. SIDEBAND SIGNALS362. 4. CENTRAL RESOURCE FUNCTIONS.····:·····.·············363. BUS OPERATION373.1 BUS COMMANDS373.1. Command definition373. 1.2. Command Usage rules393.2. PCI PROTOCOL FUNDAMENTALS423.2.1. Basic Transfer Control····:············.················433.2.2. Addressing.............143.2.3. Byle lane and Byte enable usage……563.2.4. Bus Driving and Turnaround非音垂垂·非573.2.5. Transaction Ordering and posting….583. 2.6. Combining Merging, and Collapsing。。音垂。音62PCI LOCAL BUS SPECIFICATION, REV.3.03.3. BUS TRANSACTIONS……643.3.1. Read transaction……………653.3.2. Write transaction3.3.3. Transaction termination.………….673.4. ARBItRAtION音垂3.4.1. Arbitration Signaling protoco1..…………………893.4.2. Fast Back-to-Back Transactions. .........................................................93.4.3. Arbitration Parking………………………………………93.5 LATENCY953.5.1. Target Latency…….953.5.2. Master Data latency……….….…….,….….…..……..….,983.5.3. Memory Write Maximum Completion Time limit3.5.4. Arbitration Latency3.6. OTHER BUS OPERATIONS……·。垂,音着垂。着音D。。着。D音着音垂。音着D音非非音垂音非·非1103.6.1. Device selection…....…,103.6.2. Special cycle...........3.6.3. IDSEL Stepping…………,,…,…,,…,,…,,,,,………,…1133.6.4. Interrupt acknowledg3.7. ERROR FUNCTIONS春音·。音垂1153.7.. Parity ger1153.7.2. Parity Checking...........………,163.7.3. Address parity errors…...…,…163.7.4.Error Reporting…17173.7.5. Delayed Transactions and Data Parity Errors.......... 203.7.6. Error Recovery.............,213. 8. 64-BIT BUS EXTENSION1233.8.1. Determining bus Width during System initialization.…….…,1263.9.64- BIT ADDRESSING…..…………………………………………1273.10SPECIAL DESIGN CONSIDERATIONS.1304. ELECTRICAL SPECIFICATION.. m.m.9.1374.1. OVERVIEW…1374.1.1. Transition Road Map……1374.1.2. Dynamic vs Static Drive specificalion…1384.2. COMPONENT SPECIFICATION.……,………………,1…………………1394.2.1. 5V Signaling environment1404.2.2. 33V Signaling environment鲁鲁·垂垂1464.2.3. Timing specification1504.2.4.1determinate Inputs and metastable作,…………1554.2.5. Vendor provided specification..,..…,.…………….………17564.2.6. Pinout recommendation157PCI LOCAL BUS SPECIFICATION. REV.3.04.3. SYSTEM BOARD SPECIFICATION.………1584.3.1. Clock skew,…………………1584.3.2.R··1584.3.3. Pull-ups:····.················:·····…1614.3.4Power1634.3.5. System Timing Budget. ...........1644.3.6. Physical requirements............………674.3.7. Connector Pin assignments……/6844. ADD-IN CARD SPECIFICATION1714.4.1.Add- in Card Pin Assignment..,.,.,………………,1714.4.2. Power Requirements….,.,.,.,.,.,.,,.….,764.4.3. Physical requirements.........1785. MECHANICAL SPECIFICATION1815.1. OVERVIEW1812. ADD-IN CARD PHYSICAL DIMENSIONS AND TOLERANCES...........1825.3. CONNECTOR PHYSICAL DESCRIPTION…………………1954. CONNECTOR PHYSICAL REQUIREMENTS. ...............................2055. CONNECTOR PERFORMANCE SPECIFICATION……………,…2066. SYSTEM BOARD IMPLEMENTATION……………2076. CONFIGURATION SPACEb●看●鲁D鲁0e●2136. 1. CONFIGURATION SPACE ORGANIZATION音垂垂D·垂看垂…2136.2. CONFIGURATION SPACE FUNCTIONS .......................2166.2.1. Device ldentification鲁垂垂2166.2.2. Device Control鲁着鲁D垂2176.2.3. Device status2196. 2.4. Miscellaneous registers·······:········:···:·:··:·:······:··············4······:····2216.2.5. Base addresses……………………….22463. PCI EXPANSION ROMS2286.4. VITAL PRODUCT DATA.2296.5. DEVICE DRIVERS2296.6. SYSTEM RESET.…………………………2306.7. CAPABILITIES LIST2308. MESSAGE SIGNALED INTERRUPTS ...................................................................2316.8.1. MSI Capability Structure..............2326.8.2. MSl-X Capability and Table structures……………….……..2386.8.3. MSI and Msi-X Operation2467. 66 MHZ PCI SPECIFICATION2557. 1. INTRODUCTION2557.2. SCOPE7. 3. DEVICE IMPI TION CONSIDERATIONS7.3.1. Configuration space.......2557. 4. AGENT ARCHITECTURE256PCI LOCAL BUS SPECIFICATION, REV.3.07.5. PROTOCOL.……2567.5.1.66 MHZ ENABLE(M66EN) Pin definition.…………,………,,2567.52Latency..-..-.-2577.6. ELECTRICAL SPECIFICATION……………2577.6.. Overview·.·······.··2577.6.2. Transition roadmap to 66 MHz PCI··········.2577.6.3. Signaling Environment.......... 2587.6.4. Timing specification.……2597.6.5. Vendor provided specification. 26.57.6.6. Recommendations·.·························:············:······:········.:··········2657.7. SYSTEM BOARD SPECIFICATION.………,…,……………2667.7.1. Clock Uncertainty ......2667.7.2. Reset2677.7.3. Pullups..2677.7.4. Power..······.·.·::·····布鲁····音D鲁番。是。音垂看····非D∴2677.7.5. System Timing Budget7.7.6. Physical requirements2687.7.7. Connector Pin assi! nments…..,.,.,..,.,.,..,.,.,2697.8. ADD-IN CARD SPECIFICATIONS春音·。音垂2698. SYSTEM SUPPORT FOR SMBUSn2718. 1. SMBUS SYSTEM REQUIREMENTS2718.1.1. Power………278. 2. Physical and Logical sMBi27l8.1.3. Bus connectivit2728.1.4. Master and slave support....….….…..…..…..,2738.1.5. Addressing and Configuration2738.1.6.Ele2748.1.7. SMBus behavior on Pcl reset.........................2748.2.ADD- IN CARD SMBUS REQUIREMENTS…………2758.2.7Connection2758.2.2. Master and Slave Support...,.…..…….…,...….,2758.2.3. Addressing and Configuration……,…,…,……,…,…,…,….….…..….,2758. 2. 4. Power2758. 2.5. Electrical.········.····························275A. SPECIAL CYCLE MESSAGES●鲁●e鲁277A 1. MESSAGE ENCODINGS277A,2. USE OF SPECIFIC ENCODINGS ................................................277B. STATE MACHINES279B. 1. TARGET LOCK MACHINE·;.···.:..···:...···:··.·:····281B.2. MASTER SEQUENCER MACHINE283B 3. MASTER6PCI LOCAL BUS SPECIFICATION. REV.3.0C. OPERATING RULES289C 1. WHEN SIGNALS ARE STABLE..·····.:·.·.::···:·;289C.2. MASTER SIGNALS…音·。·看290C.3. TARGET SIGNALS…291C.4. DATA PHASES…292C.5. ARBITRATION.……………………………………292C.6. LATeNCY······:“·······293C.7. DEVICE SELECTION……………,……………………………293C 8. PARITY垂垂垂D·垂294D. CLASS CODESD 1. BASE CLASS OOH...w.w...296D 2. BASE CLASS OlH296D. 3. BASE CLASS O2H··297D 4. BASE CLASS O3H297D.5. BASE CLASS04H.………………………298D. 6. BASE CLASS OSH298D.7. BASE CLASS06H...………….…………………299D 8. BASE CLASS OZH,300D 9. BASE CLASS OSH.301D.10. BASE CLASS C9H.……………………………………………….301D.11. BASE CLASS OAH.…………………302D 12. BASE CLASS OBH302D. 13. BASE CLASS OCH303D.14. BASE CLASS ODH….…304D. 15. BASE CLASS OEH304D. 16. BASE CLASS OFH·····.····;····:·;:·······304D.17. BASE CLASS JOH.……………………………………………1305D, 18. BASE CLASS 11H305E. SYSTEM TRANSACTION ORDERINGE.I. PRODUCER- CONSUMER ORDERING MODEL308E. 2. SUMMARY OF PCI ORDERING REQUIREMENTS310E.3. ORDERING OF REQUESTS........................................311E.4. ORDERING OF DELAYED TRANSACTIONS…………312E.5. DELAYED TRANSACTIONS AND LOCK#.317E.6. ERROR CONDⅠ TIONS……318. EXCLUSIVE ACCESSES..m.msn0..319F.1. EXCLUSIVE ACCESSES ON PCIF 2. STARTING AN EXCLUSIVE ACCESS321F.3. CONTINUING AN EXCLUSIVE ACCESS323F 4. ACCESSING A LOCKED AGENT324F 5. COMPLETING AN EXCLUSIVE ACCESS325F. 6. COMPLETE BUS LOCK ......................................................................325IO SPACE ADDRESS DECODING FOR LEGACY DEVICES..9.... 327PCI LOCAL BUS SPECIFICATION, REV.3.0CAPABILITY IDS。,0329I. VITAL PRODUCT DATA331VPD FORMAT3I.2COMPATIBILITY……………………………334L.3. VPD DEFINITIONS3341.3.1. VPD Large and small resource Data Tags......·D垂看3341.3.2. VPD Example…3378PCI LOCAL BUS SPECIFICATION. REV.3.0FiquresFIGURE -I: PCI LOCAL BUS APPLICATIONS春DFIGURE 1-2: PCI SYSTEM BLOCK DIAGRAM17FIGURE2-1: PCI PIN LIST.…………..…………21figure 3-1: ADDRESS PHASE FORMATS OF CONFIGURATION TRANSACTIONS...... 48Figure 3-2: LAYOUT OF CONFIG ADDRESS REGISTER, ..............................................50Figure 3-3: HOST BRIDGE TRANSLATION FOR TYPE O CONFIGURATION TRANSACTIONSADDRESS PHASE51FIGURE3-4: CONFIGURATION READ…………156FIGURE3-5: BASIC READ OPERATION………………………65FIGURE 3-6: BASIC WRITE OPERATION66FIGure 3-7: MASTER INITIATED TERMINATION........................ 68FIGURE3-8: MASTER- ABORT TERMINATION…………69Figure 3-9: RETRY. ..........................................................................................................73FiGure 3-10: DISCONNECT WITH DATA. ........................74FiGure 3-11: MASTER COMPLETION TERMINATION:·:····:··.·4····.···…75FiGURE 3-12: DISCONNECT-1 WITHOUT DATA TERMINATION·····76Figure 3-13: DISCONNECT-2 WITHOUT DATA TERMINATION76FiGure 3-14: TARGET-ABORT…177figure 3-15: BASIC ARBITRATIONFIGuRE 3-16: ARBITRATION FOR BACK-TO-BACK ACCESS…94FiGurE 3-17: DEVSEL# AsSERTION·····:···.·:··110Figure 3-1 8: IDSEL STEPPING114FiGure 3-19: INTERRUPT ACKNOWLEDGE CYCLE. ...................................................114FIGURE3-20: PARITY OPERATION………116FIGuRE 3-21: 64-BIT READ REQUEST WITH 64-BIT TRANSFER125FIGURE 3-22: 64-BIT WRITE REQUEST WITH 32-BIT TRANSFER..........126FIGURE 3-23 64-BIT DUAL ADDRESS READ CYCLE129FIGURE 4-1: ADD-IN CARD CONNECTORS...........................138FIGURE4-2:V/ICURⅤ ES FOR5 V SIGNALING.…………………143FIGURE 4-3: MAXIMUM AC WAVEFORMS FOR 5V SiGnaling145FIGURE 4-4: V/I CURVES FOR 3.3V SIGNALING148FIGURE4-5:MAⅹ IMUM AC WAⅤ EFORMS FOR3.3ⅴ SIGNALING………150FIGURE 4-6: CLOCK WAVEFORMS151FIGURE 4-7: OUTPUT TIMING MEASUREMENT CONDITIONS.··4·:······.·154FIGURE4-8: INPUT TIMING MEASUREMENT CONDITIONS…………154FIGURE 4-9: SUGGESTED PINOUT FOR POFP PCI COMPONENT···“···:.···.····:·········157FIGURE4-10: CLOCK SKEW DIAGRAM………158FIGURE 4-1: RESET TIMING16lFIGURE4-12: MEASUREMENT OF TPROP,3.3 VOLT SIGNALING……………166FIGURE 5-1: PCI RAW ADD-IN CARD(3.3V, 32-BIT).183FIGURE 5-2: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 32-BIT)..........184FIGURE 5-3: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 64-BIT)....185FIGURE 5-4: PCI RAW LOW PROFILE ADD-IN CARD(3.3V, 32-BIT)..........186PCI LOCAL BUS SPECIFICATION, REV.3.0FIGURE5-5: PCI ADD-Ⅰ N CARD EDGE CONNECTOR BEⅤEL……187FIGURE56: PCI ADD-IN CARD ASSEMBLY(3.3V)……………………………88FIGURE 5-7: LOW PROFILE PCI ADD-IN CARD ASSEMBLY 3.3V)189FIGURE 5-8: PCI STANDARD BRACKET………190FIGuRE 5-9: PCI LOW PROFILE BRACKET191FIGURE 5-10: PCI STANDARD RETAINER···192FIGURE5-11: IO WINDOW HEIGHT∴………………193FIGURE 5-12: ADD-IN CARD INSTALLATION WITH LARGE IO CONNECTOR.......194FIGURE 5-13: 32-BIT CONNECTOR196FIGURE 5-14: 3.3V/32-BIT CONNECTOR LAYOUT RECOMMENDATION. ........................197FIGURE5-15:3.3V/64-BIT CONNECTOR198FIGURE 5-16: 3.3V/64-BIT CONNECTOR LAYOUT RECOMMENDATION 199FIGURE 5-17: 3.3V/32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES2(垂D·。垂,音着垂。着音D。。着。D音着音垂。音着音FIGURE 5-18: 3.3V/64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES….201FIGURE5-19: UNIVERSAL 32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES………………………………202FIGURE 5-20: UNIVERSAL 64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES203FIGURE5-21:PCⅠADD- IN CARD EDGE CONNECTOR CONTACTS……204FIGURE5-22: CONNECTOR CONTACT DETAIL………………205FIGURE 5-23: PCI CONNECTOR LOCATION ON SYSTEM BOARD208FIGURE5-24:32- BIT PCI RISER CONNECTOR……209FIGURE 5-25: 32-BIT/3.3V PCI RISER CONNECTOR FOOTPRINT210FIGURE 5-26: 64-BIT/3.3V PCI RISER CONNECTOR211FIGuRE5-27:64-BI/3.3ⅴ PCI RISER CONNECTOR FOOTPRINT∴………212FIGURE 6-1: TYPE OOH CONFIGURATION SPACE HEADER215FIGURE 6-2: COMMAND REGISTER LAYOUT217FIGURE6-3: STATUS REGISTER LAYOUT……………………………219FIGURE 6-4: BIST REGISTER LAYOUT222FIGURE 6-5: BASE ADDRESS REGISTER FOR MEMORY........... 225FIGURE 6-6: BASE ADDRESS REGISTER FOR L/O225鲁着D音看FIGURE 6-7: EXPANSION ROM BASE ADDRESS REGISTER LAYOUT.....,..... 228FIGURE6-8: EXAMPLE CAPABILITIES LIST…….231FIGURE6-9: MSI CAPABILITY STRUCTURES…..……233FIGURE 6-10: MSI-X CAPABILITY STRUCTURE238FIGurE 6-11: MSI-X TABLE STRUCTURE翻音。音239FIGurE 6-12: MSI-X PBA STRUCTURE…239FIGURE 7-1: 33 MHZ PCI VS 66 MHZ PCI TIMING······:··················257FIGURE7-2:3.3 V CLOCK WAVEFORM.…………259FIGURE 7-3: OUTPUT TIMING MEASUREMENT CONDITIONS263FIGURE -4: INPUT TIMING MEASUREMENT CONDITIONS263FIGURE75:TvAL(MAX) RISING EDGE…………264FIGURE 7-6: TVAL(MAX) FALLING EDGE·265FIGURE77:TVAL(MIN) AND SLEW RATE……26510

内含：Proteus实现 完整运行的篮球积分器和一份实验报告报告含：具体程序（汇编），程序流程图，实现原理，实验结果截图本设计可以实现：1、能记录整个赛程的比赛时间2、能随时刷新甲、乙两队在整个过程中的比分，输入错误时能够纠正比分3、中场交换比赛场地时，能交换甲、乙两队比分的位置

这是我用stm32和GPS模块做的无人驾驶小车，可以跑路线，设置一个目标经纬度后，那个小车就会自动向目标经纬度驾驶过去。核心是根据目标经纬度和当前经纬度解算出合适的方向角然后交由小车执行，，车上有陀螺仪，然后根据陀螺仪的反馈，用PID算法使得小车按照这个方向角去自行移动。

本文研究小波在语音信号去噪方面的应用，重点研究小波阈值语音去噪。目前已经提出的小波去噪方法主要有三种，模极大值去噪、空域相关滤波去噪以及小波阈值去噪法。阈值法具有计算量小、去噪效果好的特点，取得了广泛的应用。然而在阈值法中，阈值的选取直接关系到去噪效果的优劣。如果阈值选取过小，那么一部分噪声小波系数将不能被置零，从而在去噪后的信号中保留了部分噪声信息；如果阈值选的偏大，则会将一部分有用信号去掉，使得去噪后的信号丢失信息。

PSCAD 4.2下对MMC的建模仿真，有助于对MMC的理解

根据光伏电池数学模型所建立的simulink光伏电池仿真模块，可设定光照强度、短路电流、开路电压、最大功率点电流与电压等参数。光伏阵列的仿真模块，只需修改相应的短路电流、开路电压、最大功率点电流与电压数值即可。