基于Gabor小波＋PCA＋LDA特征提取方法的人脸表情识别
基于Gabor小波＋PCA＋LDA特征提取方法的人脸表情识别20机电技术2011年12月=∑cm=∑mc×(-0509-n)U=(a-n(2×3.1415926)×vm第四步:初始模型确定下来以后,采用则将该待识别人脸表情判别为第讠类表情Baum- Welch算法对参数进行重估计,迭代调整模3人脸表情实验及分析型参数以达最优化。这样就完成了训练建模工作,获得了在粗分本文在JAFF( (Japanese Female Facial Expre类层次下代表7种人脸表情的HMM模型sso)表情数据库中进行实验。 JAFFE人脸表情库1=(A,B,n)(=1,2,…7)。由10个人,共213幅图像组成,每人都包含愤怒、23HMM人脸表情分类厌恶、恐惧、高兴、悲伤、惊讶和中性7种表情,每人每种表情2~4幅,每种表情共有27幅。对待识别的人脸表情图像,按本节22中模型本文实验与 Micael等的测试方法相似,把数训练步骤的第一步获得观察向量O,然后计算观据库中的210张图像分成3个部分,每个部分包含察向量O与已训练好的HMM模型1=(A,B,)10个人,且每个人包含7幅不同表情图像,每次使的似然概率P(O|λ)(=12,…,7)。通过用其中的一个部分训练各个表情的HMM模型,剩Forward -Backward算法来计算似然概率,如果下的两个部分用来测试。循环操作3次,然后对这P(O|4),ie(12…,7在P(O|4)(=1,2…,7)3次取平均值,得出表情识别率。本方法获取的表中最大,即情识别率见表1P(Oa )=max p(oa)表1人脸表情识别结果愤怒厌恶恐惧高兴中性悲伤惊讶识别率/%愤怒91.67厌恶5400009000恐惧559167高兴00095.00中性549000悲伤9333惊讶5693.33整体识别率92.14从表1中可以看出,本方法可以获得较好的表高的问题,提出了一种新的人脸表情识别方法。情识别率,但是,从实验中也可发现,不管是有本方法通过更加有效的 Gabor小波+PCA+LDA表没有减少分类类别数,实验中始终存在误识别。情特征提取方法,然后结合HMM模型建立7个对从实验数据库中发现,库中某些人的7种表情变化应基本表情+中性表情的模型,进行识别分类,并并不明显,即使人眼也无法确定其表情类别,以且取得了92.14%的整体识别率。同时,在实验中致算法在识别时出现错误。发现,由于人脸实验数据库中某些人的7种表情变4结论化并不明显,即使人眼也无法确定其表情类别,以致算法在识别时出现错误。本文针对目前人脸表情的整体识别率普遍不(下转第35页)第6期林彩丽等:磁流变阻尼器减振系统的分数阶微分方程研究[2] DROZDOVAD Mechanicsofviscoelasticsolids[M]. New York: John Wiley &Sons Ltd, 1998: 21-65[]LAKESR S. Viscoelastic solids[M]. London: CRC Press, 1998: 63-110[4] Stanway R, Sproston, J L, Stevens N G Non-liner modeling of an electrorheological vibration damper. J. Electrostatics,1987,20.[5]周强,瞿伟廉磁流变阻尼器的两种力学模型和试验验证地震工程与工程振动2002240).[6] Gamoto D R, Filisko F E Dynamic mechanical studies of electrorheological materials: moderate frequencies. I. Rheology,1991,35(3)[7]汪建晓孟光.磁流变阻尼器用于振动控制的理论及实验研究门]振动与冲击,2001,20(2)[8] Wen Y K Method of random vibration of hysteretic systems[]. Joumal of Engineering Mechanics Division, ASCE,102(EM2),1976[9]Spencer Jr. B F, Dyke S J, Sain M K, Carlson, J D Phenomenological model of a magnetorheological damper. J Engrg. MechASCE1997,123[10薛定宇陈阳泉高等应用数学问题的 MATLAB解DM清华大学出版社,2010[l]周云谭平.磁流变阻尼控制理论与技术DM科学出版社200712]王振滨曹广义分数微积分的两种系统建模方法系统仿真学报,2004,64):810812(上接第20页)参考文献[1] ZHAO Quan-you, PAN Bao-chang, PAN Jian- jia, et al. Facial expression recognition based on fusion of Gabor and LBPfeatures[A]. In: Proceedings of the 2008 International Conference on Wavelet Analysis and Pattern Recognition[C], HongKong,IEEE,2008(8):362-367[2]Tang Fang-qi, Deng Ben-zai. Facial Expression Recognition using AAM and Local Facial Features [A]. In: Proceedings ofthe Third Intcmational Conference on Natural Computation[C], Haikou, China, IEEE, 2007(8): 632-635[3]陈培俊基于静态图像的人脸表情识别研究成都西南交通大学,2007[4] Lades M, Vorbruggen J C, Buhmann J. Distortion invariant object recognition in the dynamic linkarchitecture[].IEEE Transactions on Computers, IEEE, 1993, 42(3): 300-311[5]彭辉张长水荣钢等基于KL变换的人脸自动识别方法清华大学学报自然科学版,2007,37(6:6770[6]DudaR O, Hart P E, Stork DG Pattern Classification(second edition). New York: Wiley, 2001[7李云霞李治柱吴亚栋基于HMM的关键词识别系统门计算机工程200,30(7:130-132谨致作者敬请本刊作者允诺:稿件中没有侵犯他人著作权或其它权利的内容并且文责自负;投寄给本刊的稿件(论文、图表、照片等)自发表之日起,其专有出版权和网络传播权即授于本刊,并许可本刊在本刊网站或本刊授权的网站上传播及中国核心期刊(遵选)数据库、中国学术期刊综合评价数据库、中文科技期刊数据库、中国台湾华艺数据库全文收录。对上述合作若有异议者,烦请来稿时向本刊申明,未作中明者,本刊将视为同意,谢谢合作。并致诚挚敬意。《机电技术》编辑部基于 Gabor小波十PCA+LDA征提取方法的人脸表情识别旧数据文接作者:李烈熊,苏两河作者单位李烈熊(福硅船政交通职№学院,福廷福州,350007),苏河(福建电力职技术学院,福建泉州刊名:机电技术英文刊名:MECHANICAL AND ELECTRICAL TECHNOLOGY年,卷(期)201,34(6)参考文献(7条)1. ZHAO Quan-you; PAN Bao-chang PAN Jian-jia Facial expression recognition based on fusion of Gabor and LBPfeatures 20082. Tang Fang-qi; Deng Ben-zai Facial Expression Recognition using AAM and Local Facial Features 20073.陈培俊基丁静态图像的人脸表情识别研究20074. Lades M: Vorbmggen J C; Buhmann J Distortion invariant object recognition in the dynamic link architecture1993(03)5.彭辉;张长水;荣钢基于K-变换的人脸自动识别方法2007(6)6. Duda R 0: Hart P E Stork D G Pattern Classificat ion(second edition) 20017.李云霞;李治柱:吴亚栋基于HM的关键词识别系统[期刊论文]计算机工程2004(07本文链接http://d.g.wanfangdata.comcn/periodiCaljdjs201106005.aspx
- 2020-12-01下载
- 积分：1
microTCA规范
PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification
- 2020-06-05下载
- 积分：1
