STM32 SHT30温湿度检测

内含STM32F103C8T6电路原理图及PCB图

C# DLL　进程注入示例。C# DLL　进程注入示例。C# DLL　进程注入示例。

猪场供料自动控制系统，由根据猪舍内单元塞链的启动条数自动控制下料电机的频率控制下料多少。

利用Matlab识别和生成简单的二维码程序，带有GUI界面，主要调用zxing.jar，下载下来即可运行使用，同时也可了解GUI的相关知识

计算机辅助几何造型技术，莫蓉等编写，各大高校相关专业推荐书目。21世纪高等院校教材计算机辅助几何造型技术莫蓉吴英常智勇编著学实撤社北京内容简介计算机辅助几何造型技术是复杂曲面设计射基本技术,它所依赖的数学基础是微分几何。4书较全面介绍了计算机辅助几何造型玻术的基础知识,包括:曲线曲面论的基本知识烊条曲线与曲面、贝齐尔曲线与曲画、B样条曲线与曲面均匀有理B样条(NRRS曲线与曲画曲线曲面求交算法线曲光顺等本书是面向高等学校非数学类专业的本科生教材如机械T程及泊动化航空宇航设计与制造等也叮供高等学校师生及有关工程技术人员自学参考图书在版编目C)费据计算机辅助几何造犁技术莫蓉,昊英,常勇编著.一北京:科学出版社,2004.2(2世纪高等院校教材IsBN7030119266·计…Ⅱ.①奠…型吳…③常…Ⅲ.计箅机雜助设计Ⅳ.TP391.72中国版本图书馆CIP数据核字(20)第072140号责任編辋:钟谊段博原/文棄編軿:璐贾瑞娜仼校对:朱光光!贲任印制;安春生/封面设计:陈敬學桌訟出版北京乐域城恨北街6号邮哎:l0?17hitP/www.sciencep.com肀剩厂印刷科学击版社发行各地新华书经销2004乍2月第版开4:B5(720×100〕24年2月第次印印张:103印堂:12500字最20000定价:18.00元〔如有印装质量问题,我社负责调换〈新欣前&计箅机辅助几何造型技术》是计算机辅助设计与计算机辋助制造的基础课程,在机被、航空、航夭、船舶、汽车、家电制造等行业均有广泛的用途。计算机铺助几何造型技术是用数学理论描述自由曲线和出面的一种有效方法,它是计算机设计复杂曲面的算法基础,也是三维数字化技术的基础之一。目前國内、国际流行的著名大型 CAD CAM集成软件都使用了先进的几何造型曲面方法。本书主耍内容分为7章。第-章介绍曲线曲面论的基本知识,读者可以从中了解矢量代数基础,曲线曲面的基础,直纹面和可展曲面。第二章重点讲述样条龉线与ns曲面,包括三次样条函数、参数样条曲线、 rergusoll曲线和孔斯曲面,并且給出应用例子第三章讲述最常用的贝齐尔曲线与曲面,主要包括:贝齐尔曲线的定义与性质、贝齐尔曲线的儿何作图泫、贝齐尔曲线的合成、贝齐尔曲线的升阶和降阶、贝齐尔曲愿、贝齐尔曲面的合战、贝齐尔曲线曲的应用。第四章讲述B样条曲线和曲面基础,包括B样条曲线的定义与性质、三次均匀B样条曲线、三次均匀B祥条曲线的插值、双三次B样条曲面B样条曲面的应用。第五章讲述非均勻有理B样条由线与出面,介經非均匀B样条曲线与曲面的定义、性质和配套技术。笫六章介终由面求交的常用算法,包括曲面求交的分类与基本方法,分割算法、迭代法、追踪法。第七章介绍曲线面光顺,包括曲线出面光为的基本概念、曲线光顺方法和曲酉光顺方法,主要是各种算法的原理和步骤。每一章均附有习题可供读者练习时使用。作为非数学类本科生教材,本书省略了大量的数学推导和证明,考患到目前曲线和曲面技术的广泛应用,以讲解基木理论和基本概念为主,希望学生在使用本教树后,熊够对计算机辅助几何造型技术有一个较为深入地了解,对当前流行的CAD软件中曲线曲面造型的功能不仅知其然而豆知其所以然。《计算机助几何造型技术》课程学时约为5~颀0学时,其中有“*"的章节可作为选修内容本书由莫蓉三編兵中第一章、第二章、第四章由吴英编写,第三章由莫蓉编写,第五章、第六章、第十章常智男编写本书承蒙孙文焕教授主审,孙教投在审阅过程中为本节提出了许多宝贵意见;另外本教村能得以较快正式出版与科学出版社及西北工业大学教务处、数材科的大力支持是分不开的:在此一并向他们表示衷心的感谢。由于作者水平有限,书中的错误不妥之处在所难免,敬请读者不吝指正,作者将不陛慼激编者2004年1月目录前言第一章曲线曲面的基本知识…1.1矢量代数基硝1.1.1矢量b·■平q『即■甲曾即·甲曾■血中■『自■qq『·中鲁暂_普·自中·番平血·1.1,2直线的矢量方程■·冒■卜T■■p口q1.⊥3平面的矢量方程d口■■■直■■■■啁■幽1.2曲线论I2.1曲线的矢量力程和参数方41.2.2矢函数的导矢及其应用山41.3曲线的自然参数方程1.3,1自然参数方程………1.3,2出线论的基本公式………1.4率和挠率14.田率■■L晶■■142挠率…………141.5曲面………1.5,1曲面矢量方程和参数方程1.5.2曲画上的曲线及其切矢和曲面上法矢181.5.3曲面的等距面方程…中■■血■血■2016直纹面和可展曲面…………21b.1直纹面冒曾■12162可展曲网「-·F·-r4-幽4"ts.Hv:P44423习题血日t·自日q·1日甲·4日4·4A4·h由44■·鄂h·〓"=即·甲画24第二章样条曲线与Cons曲面…日血平亠·甲甲■■甲『4量晋P1■■山……·251基本概念■■■山山■252.t.1插值与通近……■中■■b■…………2522多项式基…2522三次样条函数及其力学背景……………………………262.3三次样条函数272.3.1定义……………………………………………………2723.2用型值点处的一阶导数表示插值三次样条曲线——m关系式272.3.3用型值点处的阶导数表示播值三次样条曲线M关系式23.4求解插值三次样条曲线的步骤235三次样条曲线局限性■■會會會■冒鲁鲁■個■口鲁■■…3524参数样条曲线噜■甲擊■擊甲P普甲冒241参数样条曲线24.2累加弦长参数样条解决“大挠度”的问题d“卜Bd血卜‘申372.4.3端点条件的换算■bψψ司ψ1ψ甲自■嚼■■■卡■普■■■↓4普昌b■4▲▲山▲244参数样条曲线的计算步骤…………■看hhd_4晶hd画鼻号·t甲平Pqv冒ppP冒q4ppb■自4392.5 fergus∞n曲线T"會會■會■血■會『血■『■甲m甲···日日日4·日日··日·血‘争甲甲甲日P蚤平号B蚤■425.1 Fergus参数曲线表达形式2.5.2 Ferguson曲线妄的拼接甲甲甲即日4-郾412.6Cxns曲面r會鲁■■個幽■幽『■■■4看■■■■↓卜■■■阝}画4226.1曲面表示法与记号……………432.6.2具有给定边界的 Coons曲面……4426.3真有给定边界和跨昇切矢的Cs曲面片…4864具有给定边其跨界切矢、跨界快率的Cxm曲面…50265双二次CUns曲面2.7三种定义曲面的基本方法532.7.l笛卡儿乘积法……幽血■■■■■L画晶』晶532.7.2母线法…5327.3布尔和法……………54习题甲甲q■上鲁■凸“■■■聊啁第三章贝齐尔曲縱与曲面…563.1贝齐尔曲线的定义与性质…备备+■■■■■■血幽■幽即聊聊↓着着昌昌晶……·56311贝齐尔曲线的定义暑■■1『h■D·■p血56312贝齐尔曲线的几何性质583.2贝齐尔曲线的几何作图法T冒■■■■■■623.2,1贝齐尔曲线的几何作图法322厌齐尔曲线的递归分割算法…633.3贝齐尔线的合成……··+--71.44即q443.31连线条件号拼接曲线的光滑度33.2贝齐尔曲线的合成及连续条件……65贝齐水曲线拼接的应用举例673,1贝齐尔曲线的升阶与降阶■bd幽■■号甲q■db4.贝齐尔曲线的不足…6834.2齐尔曲线的升阶与降阶……………!"683.5贝齐尔面■d■■■b■■■■國■703.5.1双三次贝齐尔曲面…·…s……"…s""!"703.5.2贝齐尔曲面的性质7236贝齐尔曲面的合成…LvP■平73361位置连续…甲日4日·即·日4···日4·日·日4··4‘P···日‘·‘·即47336.2界斜率连续………743.6.3只齐尔曲线曲应用………T6习题■甲P甲q77第四章B样条曲线和曲面■『T?冒■■冒■··『『+ TPTPTYP1■794.1B样条基函数的递推定义及其性质…794.1.1B样条基的递推定义4.1.2B样条基的推导过程804.13B样条基的性质4.2H样条曲线…■■矗画凸d………"…"…………834.2.1B样条曲线的定义…,……4.2.2B样条曲线性质………………844.2.3B样条曲线的分类p+·4-rb-T·"·"hr·血·÷4*"4t844.3均匀B样条曲线…r甲『■4■■■I·中·日+·口4日日■44卜A亠854.3.1三次均匀B样条画线表达形式…854.3,2二三次均每B样条曲线的几何性质…874.33特征顶点对曲线形状的影响4.3.4三次均匀B咩条曲线的算法…………………94.3,5二次均匀B样条曲线上qP■■kb山■■▲d“pp43.6三次参数曲线段的比较…924.4非均匀B样条曲线934.4.lB样条曲线的定义域……………934.2重节点对B样条基的影响44.3重节点对B样条由线的影响……954.5B样条曲面……T會會自■■■1_■■I■『■聊■;pp4.51双三次B样条出面片4.5.2双三次B样条曲面的方程…………………1014.53B样条曲面及其性质4.5,4三次均匀H样条曲面的算法…102习题甲■郾·■■■d■4■画甲b▲q"甲即·““4·画…………104第五章非均匀有理样条曲线与曲面·1065.1NRRS曲线的定义和性质……1075.1.]曲线方程的三种等价表示……1071.2NUR曲线三种去示方式的特点……5.1.3NJR曲线的儿何性质甲q4■4=q■唱司甲d■中即甲■■唱看■甲5.t4杈囚子对NRHS曲线形状的影响■郾■■■■dbdbd平qPFb【鲁5.1.5圆锥曲线泊表示■_曾甲晶_L■昌甲…………∷…………11252NURs曲面的定义和性质……5.2.1 NURBS曲面方程的三种表示方法■■·晶b晶郾d■山b■522NRHS曲面的性质………q;甲中}P■1175.2.3曲而权因子的几何意义冒TP口『■冒………117524常用曲面的NURB表示……鱼■中p口■■唱山■中52.5 NURES曲面的形状修收…………………………………………1205.3 NURBS曲线曲面的配套技术………………………1205.3.1 NURES曲线曲面求值、求导1甲■司司bb11205.32NRBS出线曲面拟合………125冒口』■■■……∵……132第六章曲面求交算法1336.1曲面求交的分类与基本方法国P■曾冒甲冒■■冒會■■罪■■■■■1336.1.1曲面求交的分类……………1336.12出面求交的基本力法………1336.2分割算法1356.2.1分割算法的本原理………1356.2.2分割算法的注意问题…1356.3迭代法…h■■m■■■·南Dp■d·13763,1迭代法的基本原理b甲。聊略甲4▲dL13763.2鑫数迭代法a日日·自甲『是4■普晋画■4■138633四参数迭代法4需意的间题…■■日■■■■平■『■TT曾■T■■■■……1406、4追踪法6.4.l追踪法基木过程…··日.甲·卜B山如如L当";a4-st上416.4.2 Lattice网格求交法…·"自■■■『■着■■■▲h■■■44←pp·4426.4.3迫踪法中的其他内容….…!143习题144第七章曲线曲面光顺1457.曲线曲面光顺的基本概念甲■■卩■1457.1}光顺的基木概念…■■↓■bdb|v甲甲nP■145?.1.2光顺性准划146

安卓 小日历 带日程 可发邮件，短信，这是自己学习安卓写的第一个小程序

STM32F103VE+TFT屏生成二维码并显示，利用串口1 输入数据(以回车换行结尾)，STM32用串口收到的数据生成二维码，并显示在TFT屏上，二维码大小自动调整。详细描述地址：https://blog.csdn.net/raven2008/article/details/80176100

PICMG microTCA.0 Specification RC1.0ContentsIntroduction and objectives1.1 Overview1.2 Introduction1.2.1S1.2.2 MicroTCa implementation options1画1-21.2.3 Design goals1-21.2.4 Elements of microtca1-312.5 Theory of operation……着1国面1面日正1-81.3 Micro TCA enclosure types191.3.1 Single Shelf implementation191.3.2 TWo Tier mⅸ ed Width Shelf implementation.…….….….….….….….…....1-101.3.3 Two-Tier fixed Single Width Shelf implementation ....................1-101.3.4 Back-to-Back Shelf implementation.1-101.3.5 Cube Shelf implementation..1-101.3.6 Pico Shelf implementations1111.3.7 Other implementation options1111.4 Application examples1-1114.1 Base station…1-111.42 Router1-121.4.3∨ olP node.….1-121.4.4 Other Telecom Network applicationsE画1-121.4.5 Enterprise applications1-131.4.6 Other applications.....1-131.4.7 Consumer applications1-131.5 Special word usage1-131.6 Conformance1-141.7 Dimensions1-141.8 Regulatory guidelines1-141.9 Reference specifications1.10 MicroTCA0 Specification contributor……1-151-161.11 Name and logo usage1-161.12 Intellectual property……1-171.12.1 Necessary claims1,,面,国国,,国面正∴1-181.12.2 Unnecessary claims11181.12. 3 Third party disclosures1-181.13 Glossary1-192Mechanical2-12.1 Mechanical overview∴………….2-12.1.1 Terminology…2-22.1.2 Typical arrangement examples2-22.2 Dimensions, tolerances, drawing symbols, and nomenclature2-62.3 Mechanical concept2-82.4 AdvancedMC Module orientation, location, and positioning2-1624.1 Module orientation.2-162.4.2 Module positioning, horizontal--mandatory2-172.4.3 Module positioning, vertical-mandatoryU.882-192. 4. 4 Module positioning, depth--mandatory,.42-21PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification2.5 Slot detail dimensions2-222.5.1S|ot..2-222.5.2 Slot configurations, subdividing Slots2-222.5.3 Card guide, Strut, and Card Guide Support Plate(CGSP)…………2232.5.4 Optional Subrack attachment plane2-322.5.5 AdvancedMC Module--optional locking………………………2-342.6 Backplane2-3627 Subrack dimensions2-412.7.1 Mandatory Subrack2-422.8 Shelf2-472.8. 1 Shelf types.2-482.8.2 Shelf width and height…...…2-492.8.3 Shelf depth2-492.8.4 Air filter provision2-502.8.5 ESD wrist strap interface2-502.8.6 Shelf alarm LEDs2-512.9 Cable management2-522. 10 Power entry /Power Module2-562.10.1 Power Module pcb dimensions2-582.10.2 Power Module component height1·面2-632.10.3 Power module face plate2-642.10. 4 Power Module handle/Latch mechanism.2672.10.5 Power module lEDs2-672. 10.6 Power Module EMc gasketing2-672.10.7 Power Module satety covers2-672.10 8 Power module labels2-682.10. 9 Power Module Backplane Connector2-682.11 MCH Module2-692.11.1 Module types2-692.11.2 MCH PCB dimensions.2-702.11.3 MCH Subrack slot details2-772.11. 4 Plug Connector.2-792.11.5 Sequencing and contact area2-812.11.6 MCH positioning2-812. 12 Air flow management面2-822.13 Auxiliary Connector(Zone 2 and zone 3)keying2-832.13.1 Component keep- in height2-842.13.2 Connector keep-in height2-842.133 Keying block…2-852.13.5 AMC0 electrically compatible keying block2.13. 4 Keying block with electrical connections2-86.2-872.14 MicroTCa cube2892.15 MicroTCA Pico2.16 Microtca filler pane的∵面1面面,面2-902-902.17 Cooling Units(CUs)2-912.18 Subrack/Shelf/Cube/Pico performance.2922. 18.1 Load carrying2-922.18.2 Insertion cycles2922.18.3ESD2-922.18.4EMC2-93PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification2. 18.5 Safety2-932.18.6 Physical Slot and Tier numbering2932.19 Subrack/Shelf environmental2-962.19. 1 Subrack shock and vibration2-962.19.2 Earthquake.........2-962.19.3 Flammability2-962.19.4 Atmospheric2-962. 19.5 Thermal2-972.19.6 Acoustic∴…………………2972.19.7 Surface temperatures2-972.20 References2-973 Hardware platform management3-13.1 Overview3.1.1 Micro Tca Carrier model3-13.1.3 Relationship with IPMI, AdvancedMC, and AdvancedTCA.3.1.2 MicroTCA management architecture3-23-73.1.4 Key differences from PICMG 3.0 and AMC.0 specifications..........3-73.1.5 PICMG properties and FRU Device ID assignments3-93.2 Management-related interconnects3-113.2.1 AdvancedMc interconnects3-113.2.2 Power Module and Cooling Unit interconnects3.2.3 Guidelines for OEM Module interconnects and management3-133-143.2.4 Carrier FRU Information device requirements.3-153.25 Microtca carrier interconnects3-193.3 Carrier Manager.…….…..…...…3-203.3.1 MCH Face Plate indicators3-223.3.2 Payload Interface3-223.3.3 Carrier Manager IP address3-223.3.4 IPM event support∴3-243.3.5 Redundant MCH operation3-253.3.6 Addressing3-263.3.7 Carrier number3-293.3.8 Location information34 Shelf Manager…3-383. 4.1 Shelf Manager configuration options383.4.2 Differences from the AdvancedTca shelf Manager3-403.4.3 Shelf-Carrier Manager Interface翻套国画1面,国面,1面D国画面国3-423.4.4 Shelf Manager IP addre3-433.5 MCMC requirements3453.6 EMMC requirements3-463.7 Operational state management3-483.7.1 Carrier Manager start up……….….….….………..……3483.7.2 Shelf Manager actions on Carrier detection3-483.7.3 Normal Shelf operation1B面面国B3-483.7.4 Abnormal situation handling3-4938 Power management.……3-493.8.1 Power clapping国面3-503.8.2 Micro T CA Carrier Power Management records.3-513.8.3 Early power management356PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification3.8.4 Normal power management.3-573.8.5 Power management commands and sensors3-593.8.6 Abnormal power condition handling3-673.9 Cooling management3-693.9.1 Fan geography.…3-703.9.2 Cooling control…3-713.9.3 Normal cooling operation3-723.9.4 Abnormal cooling operation3-733.9.5 Fan tachometer sensors3-733.9.6 Temperature sensors翻画1国翻B1B…3-733.10 Electronic Keying3-743.10.1 Micro TCA Carrier point-to-point connectivity information3-753.10.2 Module point-to-point connectivity information.3-773.10.3 AMC Port state commands3-783.10.4 Clock b- Keying……3-783.11 Telco alarm management3-73. 12 System Event log…………3-863.13 Sensor management3-863.13.1 Guidelines and requirements for fru sensor events3-863.13.2 MCMC SDR requirements.3-873.13.3 EMMC SDR requirements3-883.13.4 Carrier Manager SDR requirements3-883.14 fru Information.3-913. 14.1 EMMC FRU Information3-913. 14.2 MCMC FRU Information3-913.143 Carrier FRu Information3-923. 14.4 Shelf fru information面国面国面3-923.15 PMI message bridging……….3-933.15.1 Message bridging process3-933.16 PMI functions and command3-943. 16.1 Required IPMI functions..3-953.16.2 Command assignments3-973.17 FRU records, sensors and entity Ids∴3-1084 Power…4-14.1 Overview4-14.2 Loads on the Power Subsystem4-24.2.1 Microtca carrier hub(MCH),………,………………………24-24.2.2 Cooling Units4-74.2.3 Advanced mezzanine cards4-104.3 Power architecture4-134.3.1 Basic functionality4-134.3.2 Partitioning of the Power Subsystem:.::a:.4-154.3.3 Power sources4-154.3. 4 Power Subsystem redundancy4-164.3.5 System Grounding considerations4-214.3.6 Power distribution and backplane considerations4-234.4 Control and monitoring of the Power Subsystem4-2444.1 PM-EMMCs4-244.4.2 Geographic Address4-24PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification4.4.3|PMB-04-2444.4Ps1[S|o#4-254.4.5EN[Slof]#,…4-2544.6 PWRON_[Sot]…4-254.4.7PSPM#4-2644.8 PM-EMMC watchdog timer……4264.4.9 Power Module oK4-2744.10 Power module reset4-274.4.11 System power-up4-274.4.12 Input voltage sensors1国面面量面1国面4-294.4.13 Temperature sensors4-294414 Power module extraction switch4-304,415 Blue lED4-304.4.16LED14-314 4.17 Other leds4-314.5 Connectors4-314.5. 1 Power Module Output Connector4-324.5.2 Power Module Input Connectors81国面面4-324.6 Single-Width,Fu‖- Height Power Module…∴4-334.6.1 Inputs4-344.6.2 Outputs4-354.6.3 Bulk supply current limit4-384.6.4 Control and monitoring………………………4-384.6.5 Redundancy4-384.6.6 Mechanical4-4546.7 Thermals.8...8.88.84-45画·面4.6.8 Regulatory.4-4547 Other mechanical considerations…4-464.7.1 Double-Width form factor4-464.7.2 Form factors other than Full-Height4-464.8 Power source considerations.4-464.8.1 DC power feeds4-474.8.2 AC power feeds4-554.9 References4-605 Thermal5.1 Overview5-15.2 AMC. 0 Modules and microtCa国着画5-15.3 AMC.0 Carriers and microtca5.4 Subrack slot5-25.5 Airflow path5.6 AMC.0 Modules and power dissipation.5-35-35.7 MicroTCA system cooling configuration……….….….…....545. 8 Air distribution in a slot5-45.9 Air inlet and exhaust5-55. 10 Slot cooling capability5-55. 11 Module cooling requirements●5.12 Standard air.5-75.12.1 Derivatie5.122 Barometric changes due to weather....…...……….57PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification5.13 Slot impedance curve.5-85.14 Slot fan flow curve5.15 Cooling Unit failure5-85.16 Filters5.17 System sensors….…….….……5-95.18 Thermal and operating environment5-105.19 Thermal and cabling5-105.20 Simulation and impedance testing5-105.20.1 AdvancedMC/MCH reference Module..5-115.20.2 Power Unit reference module∴5-125.21 Simulation environment5.22 Thermal dynamic modeling5-135.23 Fluid networking modeling5.24 Acoustic noise5-135.25 Surface temperature5-145.26 Design recommendations5-155.27 Cooling limitations and examples..5-175.28 References1面5-226 Interconnect6-16.1 Introduction.…6-16.2 Fabric interface6.2.1 Backplane fabric interface support requirements6-26.2.2 MCH fabric interface support requirements6.3 MCH Specific Interfaces6-46.3.1 MCH update Channel interface6-46.3.2 MCH cross-over Channel interface.6-56. 3. 3 MCH PWR ON interface6-66.3.4 Inter-MCH IPMB-L interface6.4 Synchronization clock interface6.4.1 Signal descriptions6-86. 4.2 Clock architectures6-96.4.3 Non-Telecom and Telecom clocks6-136.5 JTAG interface.…6-136.5.1 JSM Overview6-146.5.2 JSM Signaling Overview6-166.5.3 JSM Interface to mch16.54 JSM Interface to mch2.……6-186.5.5 JSM Interface to Advancedmcs.6-196.5.6 JSM Interface to Power modules.6-226.5.7 JSM Master mode selection6-236.5.8 JSM Interface to External tester..6-246.5.9 MCH JTAG6-266.5. 10 Power module jtAG6-276.6 MicroTCA Interface topologies1画6-276.6. 1 Topology models6-286.6.2 Correlation to AdvancedMc fabric regions6-296.7 MCH Connector pin allocation6-306.7.1 Pin naming conventions6-316.7.2 Fabric interface naming conventions6-31PICMG MicroTCA. 0 Specification Draft RC1.o, May 26, 2006Do not specify or claim compliance with this Draft Specification6.7.3 Synchronization clock interface naming convention6-316.7.4 MCH Connector pin list……………6-326.8 System examples.6-386.8. 1 Redundant MicroTCA system6-386.8.2 Variant redundant microtca interconnect6-416.8.3 Non-redundant MicroTCA system6-45Connectors7-17.1 General information7-17.2 AdvancedMC Backplane Connectors7-17.2.1 AdvancedMC Backplane Connector pin list7-27.2.2 AdvancedMC Backplane Connector dimensions7-27.2.3 Advancedmc backplane connector pcb layout∴7-67. 2. 4 AdvancedMC Backplane Connector electrical characteristics7-107.2.5 AdvancedMC Backplane Connector high-speed characteristics7-147.2.6 AdvancedMC Backplane Connector mechanical characteristics7-187.3 Micro TCa Carrier hub connectors7-197.3.1 Micro TCA Carrier Hub Connector pin list7-197.3.2 Micro TCA Carrier Hub mating interface design7-207.3.3 Micro TCA Carrier Hub backplane connector7-227.3. 4 Micro TCA Carrier Hub Connector Backplane PCB layout7-237. 3.5 Micro tca Carrier Hub connector electrical characteristics7-247.3.6 Micro TCA Carrier Hub Connector high-speed characteristics7-2573.7 Micro tCa Carrier hub connector mechanical characteristics7-297.4 Power Module Output Connector7.4.1 Power Module Output Connector pin list and mating sequence7-317.4.2 Power Module Output Connector dimensions7-327. 4.3 Power Module Output Connector Backplane PCb layout7-347.4.4 Electrical characteristics for power Module output connector.7-367.4.5 Power Module Output Connector mechanical characteristics7-397.5 Power Module Input Connector7.5.1 Power Module Input Connector pin list and mating sequence7-417.5.2 Power Module Input Connector dimensions7-427.5.3 Electrical characteristics for Power Module Input Connector7-477.5.4 Power Module Input Connector mechanical characteristics7-517.6 AdvancedMC Auxiliary Connector7-537.7 Test schedule7-547.7.1 Specimen measurement arrangements7-547.7.2 Test schedule tables.7-647. 8 References.7-798 Regulatory requirements and industry standard guidelines8-18.1 Regulatory……8-18.1.1 Safety8-18.1.2 Electromagnetic compatibility..……………8-28.1.3 Ecology standards.8-28.2 Telecommunications industry standards requirements8-38. 2. 1 EMC/safety requirements for the telecommunications industry.......8-38.2.2 Environmental requirements for the telecommunications industry ..............8-48.3 Reliability/MTBF standards8-7PICMG( Micro TCAO Specification Draft RC1. 0, May 26, 2006Do not specify or claim compliance with this Draft Specification8.4 Cross reference list8.5 FRU test guidelines∴8-78.5. 1 FRU safety test8-88.5.2 FRU EMC testing.8-88.5.3 FRU environmental testing8-9a Module mis-insertion considerationsA-1A 1 MCH Module mis-insertion combinationsA-2A 2 AdvancedMc module mis-insertion combinationsA-5A3 Power management implicationsA-8A 4 System management implicationsA-8A.4.1 Optional MMC instance on MCH ModuleA-9A.4.2 Using an AdvancedMC in an MCH SlotA-13A.4.3 Using an mch in an AdvancedMc SlotA-15A.4.4 Detecting mis-insertionsA-16A.5 Hardware implicationsA-1A. 5. 1 GNd pins at same locations........A-20A.5.2 PSO# and PS1# pins at same locationsA-23A.5.3 PWR and MP pins at same locationsA27A.5. 4 PWR ON pinA-29A.5.5 Ga[2: 0] pins at same locations道1面4…A-31A.5.6 ENABLE# pin at same locationA-35A.5.7 SDA L and SCL L pinsA-37A 5.8 JTAG pinsA-38A 5.9 Cross-over pinsA-39A.5. 10 TMREQ#, 12C SDA, and I2C SCL pins…A-39B Requirement list….B-1PICMG MicroTCA. 0 Specification Draft RC1.O, May 26, 2006Do not specify or claim compliance with this Draft Specification

这是一个matlab对梯度下降的实现，模拟的是x^2+y^2最小值的取得

直接序列扩频系统的调制与解调，直接序列扩频系统的matlab仿真实现，包括M,GOLD序列生成，信道建模，噪声，扩频，解扩等)