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摘要：本系统以直流电流源为核心，AT89S52单片机为主控制器，通过键盘来设置直流电源的输出电流，设置步进等级可达1mA，并可由数码管显示实际输出电流值和电流设定值。本系统由单片机程控输出数字信号，经过D/A转换器（AD7543）输出模拟量，再经过运算放大器隔离放大，控制输出功率管的基极，随着功率管基极电压的变化而输出不同的电流。单片机系统还兼顾对恒流源进行实时监控，输出电流经过电流/电压转变后，通过A/D转换芯片，实时把模拟量转化为数据量，再经单片机分析处理， 通过数据形式的反馈环节，使电流更加稳定，这样构成稳定的压控电流源。实际测试结果表明，本系统输出电流稳定，不随负载和环境温度变化，并具

ToF sensor 导出的数据进行三维重建，根据激光从出发到经过散射之后到目标物再被探测器接收到这个时间信息来求解目标物的位置和立体形状扫描足够多的点的时候，就能够得到目标物上的做够多的点的距离值，只有可以恢复出目标物的3维形状。

恒生电子笔试题 Java。历年恒生电子招聘笔试题，全套题型，包括选择题（Java、c++）两部分笔试题 Java 恒生电子

做论文 小设计 没有问题 用FPGA 简单的实现一个小开发

PCI 3.0 规范,英文原版。PCI Local Bus Specification Revision 3.0PCI LOCAL BUS SPECIFICATION, REV.3.0ContentsPREFACESPECIFICATION.……13INCORPORATION OF ENGINEERING CHANGE NOTICES (ECNS)1查音音鲁垂音音13DOCUMENT CONVENTIONS.………14l. INTRODUCTION…151.1. SPECIFICATION CONTENTS······151.2. MOTIVATION……151.3. PCI LOCAL BUS APPLICATIONS1. 4. PCI LOCAL BUS OVERVIEW171.5. PCI LOCAL BUS FEATURES AND BENEFITS……181. 6. ADMINISTRATION…………………202. SIGNAL DEFINITION m...mn.. 212.1 SIGNAL TYPE DEFINITION222.2. PIN FUNCTIONAL GROUPS..…………222.2.1. System Pins……,…,…,,…,…232.2.2. Address and data pins242.2.3. Interface Control Pins........................252.2.4. Arbitration Pins(Bus Masters Only)272.2.5. Error Reporting Pins....垂看d。普音看鲁D指音着音,。音音自。音音音。音自垂272.2.6. Interrupt Pins( Optional)……282.2.7. Additional signals312.2.8.64- Bit bus extension pins( Optiona)…,,……………………………332.2.9. TAG/Boundary scan Pins(Optional).......342. 10. System Management Bus Interface Pins(Optional)352. 3. SIDEBAND SIGNALS362. 4. CENTRAL RESOURCE FUNCTIONS.····:·····.·············363. BUS OPERATION373.1 BUS COMMANDS373.1. Command definition373. 1.2. Command Usage rules393.2. PCI PROTOCOL FUNDAMENTALS423.2.1. Basic Transfer Control····:············.················433.2.2. Addressing.............143.2.3. Byle lane and Byte enable usage……563.2.4. Bus Driving and Turnaround非音垂垂·非573.2.5. Transaction Ordering and posting….583. 2.6. Combining Merging, and Collapsing。。音垂。音62PCI LOCAL BUS SPECIFICATION, REV.3.03.3. BUS TRANSACTIONS……643.3.1. Read transaction……………653.3.2. Write transaction3.3.3. Transaction termination.………….673.4. ARBItRAtION音垂3.4.1. Arbitration Signaling protoco1..…………………893.4.2. Fast Back-to-Back Transactions. .........................................................93.4.3. Arbitration Parking………………………………………93.5 LATENCY953.5.1. Target Latency…….953.5.2. Master Data latency……….….…….,….….…..……..….,983.5.3. Memory Write Maximum Completion Time limit3.5.4. Arbitration Latency3.6. OTHER BUS OPERATIONS……·。垂,音着垂。着音D。。着。D音着音垂。音着D音非非音垂音非·非1103.6.1. Device selection…....…,103.6.2. Special cycle...........3.6.3. IDSEL Stepping…………,,…,…,,…,,…,,,,,………,…1133.6.4. Interrupt acknowledg3.7. ERROR FUNCTIONS春音·。音垂1153.7.. Parity ger1153.7.2. Parity Checking...........………,163.7.3. Address parity errors…...…,…163.7.4.Error Reporting…17173.7.5. Delayed Transactions and Data Parity Errors.......... 203.7.6. Error Recovery.............,213. 8. 64-BIT BUS EXTENSION1233.8.1. Determining bus Width during System initialization.…….…,1263.9.64- BIT ADDRESSING…..…………………………………………1273.10SPECIAL DESIGN CONSIDERATIONS.1304. ELECTRICAL SPECIFICATION.. m.m.9.1374.1. OVERVIEW…1374.1.1. Transition Road Map……1374.1.2. Dynamic vs Static Drive specificalion…1384.2. COMPONENT SPECIFICATION.……,………………,1…………………1394.2.1. 5V Signaling environment1404.2.2. 33V Signaling environment鲁鲁·垂垂1464.2.3. Timing specification1504.2.4.1determinate Inputs and metastable作,…………1554.2.5. Vendor provided specification..,..…,.…………….………17564.2.6. Pinout recommendation157PCI LOCAL BUS SPECIFICATION. REV.3.04.3. SYSTEM BOARD SPECIFICATION.………1584.3.1. Clock skew,…………………1584.3.2.R··1584.3.3. Pull-ups:····.················:·····…1614.3.4Power1634.3.5. System Timing Budget. ...........1644.3.6. Physical requirements............………674.3.7. Connector Pin assignments……/6844. ADD-IN CARD SPECIFICATION1714.4.1.Add- in Card Pin Assignment..,.,.,………………,1714.4.2. Power Requirements….,.,.,.,.,.,.,,.….,764.4.3. Physical requirements.........1785. MECHANICAL SPECIFICATION1815.1. OVERVIEW1812. ADD-IN CARD PHYSICAL DIMENSIONS AND TOLERANCES...........1825.3. CONNECTOR PHYSICAL DESCRIPTION…………………1954. CONNECTOR PHYSICAL REQUIREMENTS. ...............................2055. CONNECTOR PERFORMANCE SPECIFICATION……………,…2066. SYSTEM BOARD IMPLEMENTATION……………2076. CONFIGURATION SPACEb●看●鲁D鲁0e●2136. 1. CONFIGURATION SPACE ORGANIZATION音垂垂D·垂看垂…2136.2. CONFIGURATION SPACE FUNCTIONS .......................2166.2.1. Device ldentification鲁垂垂2166.2.2. Device Control鲁着鲁D垂2176.2.3. Device status2196. 2.4. Miscellaneous registers·······:········:···:·:··:·:······:··············4······:····2216.2.5. Base addresses……………………….22463. PCI EXPANSION ROMS2286.4. VITAL PRODUCT DATA.2296.5. DEVICE DRIVERS2296.6. SYSTEM RESET.…………………………2306.7. CAPABILITIES LIST2308. MESSAGE SIGNALED INTERRUPTS ...................................................................2316.8.1. MSI Capability Structure..............2326.8.2. MSl-X Capability and Table structures……………….……..2386.8.3. MSI and Msi-X Operation2467. 66 MHZ PCI SPECIFICATION2557. 1. INTRODUCTION2557.2. SCOPE7. 3. DEVICE IMPI TION CONSIDERATIONS7.3.1. Configuration space.......2557. 4. AGENT ARCHITECTURE256PCI LOCAL BUS SPECIFICATION, REV.3.07.5. PROTOCOL.……2567.5.1.66 MHZ ENABLE(M66EN) Pin definition.…………,………,,2567.52Latency..-..-.-2577.6. ELECTRICAL SPECIFICATION……………2577.6.. Overview·.·······.··2577.6.2. Transition roadmap to 66 MHz PCI··········.2577.6.3. Signaling Environment.......... 2587.6.4. Timing specification.……2597.6.5. Vendor provided specification. 26.57.6.6. Recommendations·.·························:············:······:········.:··········2657.7. SYSTEM BOARD SPECIFICATION.………,…,……………2667.7.1. Clock Uncertainty ......2667.7.2. Reset2677.7.3. Pullups..2677.7.4. Power..······.·.·::·····布鲁····音D鲁番。是。音垂看····非D∴2677.7.5. System Timing Budget7.7.6. Physical requirements2687.7.7. Connector Pin assi! nments…..,.,.,..,.,.,..,.,.,2697.8. ADD-IN CARD SPECIFICATIONS春音·。音垂2698. SYSTEM SUPPORT FOR SMBUSn2718. 1. SMBUS SYSTEM REQUIREMENTS2718.1.1. Power………278. 2. Physical and Logical sMBi27l8.1.3. Bus connectivit2728.1.4. Master and slave support....….….…..…..…..,2738.1.5. Addressing and Configuration2738.1.6.Ele2748.1.7. SMBus behavior on Pcl reset.........................2748.2.ADD- IN CARD SMBUS REQUIREMENTS…………2758.2.7Connection2758.2.2. Master and Slave Support...,.…..…….…,...….,2758.2.3. Addressing and Configuration……,…,…,……,…,…,…,….….…..….,2758. 2. 4. Power2758. 2.5. Electrical.········.····························275A. SPECIAL CYCLE MESSAGES●鲁●e鲁277A 1. MESSAGE ENCODINGS277A,2. USE OF SPECIFIC ENCODINGS ................................................277B. STATE MACHINES279B. 1. TARGET LOCK MACHINE·;.···.:..···:...···:··.·:····281B.2. MASTER SEQUENCER MACHINE283B 3. MASTER6PCI LOCAL BUS SPECIFICATION. REV.3.0C. OPERATING RULES289C 1. WHEN SIGNALS ARE STABLE..·····.:·.·.::···:·;289C.2. MASTER SIGNALS…音·。·看290C.3. TARGET SIGNALS…291C.4. DATA PHASES…292C.5. ARBITRATION.……………………………………292C.6. LATeNCY······:“·······293C.7. DEVICE SELECTION……………,……………………………293C 8. PARITY垂垂垂D·垂294D. CLASS CODESD 1. BASE CLASS OOH...w.w...296D 2. BASE CLASS OlH296D. 3. BASE CLASS O2H··297D 4. BASE CLASS O3H297D.5. BASE CLASS04H.………………………298D. 6. BASE CLASS OSH298D.7. BASE CLASS06H...………….…………………299D 8. BASE CLASS OZH,300D 9. BASE CLASS OSH.301D.10. BASE CLASS C9H.……………………………………………….301D.11. BASE CLASS OAH.…………………302D 12. BASE CLASS OBH302D. 13. BASE CLASS OCH303D.14. BASE CLASS ODH….…304D. 15. BASE CLASS OEH304D. 16. BASE CLASS OFH·····.····;····:·;:·······304D.17. BASE CLASS JOH.……………………………………………1305D, 18. BASE CLASS 11H305E. SYSTEM TRANSACTION ORDERINGE.I. PRODUCER- CONSUMER ORDERING MODEL308E. 2. SUMMARY OF PCI ORDERING REQUIREMENTS310E.3. ORDERING OF REQUESTS........................................311E.4. ORDERING OF DELAYED TRANSACTIONS…………312E.5. DELAYED TRANSACTIONS AND LOCK#.317E.6. ERROR CONDⅠ TIONS……318. EXCLUSIVE ACCESSES..m.msn0..319F.1. EXCLUSIVE ACCESSES ON PCIF 2. STARTING AN EXCLUSIVE ACCESS321F.3. CONTINUING AN EXCLUSIVE ACCESS323F 4. ACCESSING A LOCKED AGENT324F 5. COMPLETING AN EXCLUSIVE ACCESS325F. 6. COMPLETE BUS LOCK ......................................................................325IO SPACE ADDRESS DECODING FOR LEGACY DEVICES..9.... 327PCI LOCAL BUS SPECIFICATION, REV.3.0CAPABILITY IDS。,0329I. VITAL PRODUCT DATA331VPD FORMAT3I.2COMPATIBILITY……………………………334L.3. VPD DEFINITIONS3341.3.1. VPD Large and small resource Data Tags......·D垂看3341.3.2. VPD Example…3378PCI LOCAL BUS SPECIFICATION. REV.3.0FiquresFIGURE -I: PCI LOCAL BUS APPLICATIONS春DFIGURE 1-2: PCI SYSTEM BLOCK DIAGRAM17FIGURE2-1: PCI PIN LIST.…………..…………21figure 3-1: ADDRESS PHASE FORMATS OF CONFIGURATION TRANSACTIONS...... 48Figure 3-2: LAYOUT OF CONFIG ADDRESS REGISTER, ..............................................50Figure 3-3: HOST BRIDGE TRANSLATION FOR TYPE O CONFIGURATION TRANSACTIONSADDRESS PHASE51FIGURE3-4: CONFIGURATION READ…………156FIGURE3-5: BASIC READ OPERATION………………………65FIGURE 3-6: BASIC WRITE OPERATION66FIGure 3-7: MASTER INITIATED TERMINATION........................ 68FIGURE3-8: MASTER- ABORT TERMINATION…………69Figure 3-9: RETRY. ..........................................................................................................73FiGure 3-10: DISCONNECT WITH DATA. ........................74FiGure 3-11: MASTER COMPLETION TERMINATION:·:····:··.·4····.···…75FiGURE 3-12: DISCONNECT-1 WITHOUT DATA TERMINATION·····76Figure 3-13: DISCONNECT-2 WITHOUT DATA TERMINATION76FiGure 3-14: TARGET-ABORT…177figure 3-15: BASIC ARBITRATIONFIGuRE 3-16: ARBITRATION FOR BACK-TO-BACK ACCESS…94FiGurE 3-17: DEVSEL# AsSERTION·····:···.·:··110Figure 3-1 8: IDSEL STEPPING114FiGure 3-19: INTERRUPT ACKNOWLEDGE CYCLE. ...................................................114FIGURE3-20: PARITY OPERATION………116FIGuRE 3-21: 64-BIT READ REQUEST WITH 64-BIT TRANSFER125FIGURE 3-22: 64-BIT WRITE REQUEST WITH 32-BIT TRANSFER..........126FIGURE 3-23 64-BIT DUAL ADDRESS READ CYCLE129FIGURE 4-1: ADD-IN CARD CONNECTORS...........................138FIGURE4-2:V/ICURⅤ ES FOR5 V SIGNALING.…………………143FIGURE 4-3: MAXIMUM AC WAVEFORMS FOR 5V SiGnaling145FIGURE 4-4: V/I CURVES FOR 3.3V SIGNALING148FIGURE4-5:MAⅹ IMUM AC WAⅤ EFORMS FOR3.3ⅴ SIGNALING………150FIGURE 4-6: CLOCK WAVEFORMS151FIGURE 4-7: OUTPUT TIMING MEASUREMENT CONDITIONS.··4·:······.·154FIGURE4-8: INPUT TIMING MEASUREMENT CONDITIONS…………154FIGURE 4-9: SUGGESTED PINOUT FOR POFP PCI COMPONENT···“···:.···.····:·········157FIGURE4-10: CLOCK SKEW DIAGRAM………158FIGURE 4-1: RESET TIMING16lFIGURE4-12: MEASUREMENT OF TPROP,3.3 VOLT SIGNALING……………166FIGURE 5-1: PCI RAW ADD-IN CARD(3.3V, 32-BIT).183FIGURE 5-2: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 32-BIT)..........184FIGURE 5-3: PCI RAW VARIABLE HEIGHT SHORT ADD-IN CARD(3.3V, 64-BIT)....185FIGURE 5-4: PCI RAW LOW PROFILE ADD-IN CARD(3.3V, 32-BIT)..........186PCI LOCAL BUS SPECIFICATION, REV.3.0FIGURE5-5: PCI ADD-Ⅰ N CARD EDGE CONNECTOR BEⅤEL……187FIGURE56: PCI ADD-IN CARD ASSEMBLY(3.3V)……………………………88FIGURE 5-7: LOW PROFILE PCI ADD-IN CARD ASSEMBLY 3.3V)189FIGURE 5-8: PCI STANDARD BRACKET………190FIGuRE 5-9: PCI LOW PROFILE BRACKET191FIGURE 5-10: PCI STANDARD RETAINER···192FIGURE5-11: IO WINDOW HEIGHT∴………………193FIGURE 5-12: ADD-IN CARD INSTALLATION WITH LARGE IO CONNECTOR.......194FIGURE 5-13: 32-BIT CONNECTOR196FIGURE 5-14: 3.3V/32-BIT CONNECTOR LAYOUT RECOMMENDATION. ........................197FIGURE5-15:3.3V/64-BIT CONNECTOR198FIGURE 5-16: 3.3V/64-BIT CONNECTOR LAYOUT RECOMMENDATION 199FIGURE 5-17: 3.3V/32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES2(垂D·。垂,音着垂。着音D。。着。D音着音垂。音着音FIGURE 5-18: 3.3V/64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES….201FIGURE5-19: UNIVERSAL 32-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES………………………………202FIGURE 5-20: UNIVERSAL 64-BIT ADD-IN CARD EDGE CONNECTOR DIMENSIONS ANDTOLERANCES203FIGURE5-21:PCⅠADD- IN CARD EDGE CONNECTOR CONTACTS……204FIGURE5-22: CONNECTOR CONTACT DETAIL………………205FIGURE 5-23: PCI CONNECTOR LOCATION ON SYSTEM BOARD208FIGURE5-24:32- BIT PCI RISER CONNECTOR……209FIGURE 5-25: 32-BIT/3.3V PCI RISER CONNECTOR FOOTPRINT210FIGURE 5-26: 64-BIT/3.3V PCI RISER CONNECTOR211FIGuRE5-27:64-BI/3.3ⅴ PCI RISER CONNECTOR FOOTPRINT∴………212FIGURE 6-1: TYPE OOH CONFIGURATION SPACE HEADER215FIGURE 6-2: COMMAND REGISTER LAYOUT217FIGURE6-3: STATUS REGISTER LAYOUT……………………………219FIGURE 6-4: BIST REGISTER LAYOUT222FIGURE 6-5: BASE ADDRESS REGISTER FOR MEMORY........... 225FIGURE 6-6: BASE ADDRESS REGISTER FOR L/O225鲁着D音看FIGURE 6-7: EXPANSION ROM BASE ADDRESS REGISTER LAYOUT.....,..... 228FIGURE6-8: EXAMPLE CAPABILITIES LIST…….231FIGURE6-9: MSI CAPABILITY STRUCTURES…..……233FIGURE 6-10: MSI-X CAPABILITY STRUCTURE238FIGurE 6-11: MSI-X TABLE STRUCTURE翻音。音239FIGurE 6-12: MSI-X PBA STRUCTURE…239FIGURE 7-1: 33 MHZ PCI VS 66 MHZ PCI TIMING······:··················257FIGURE7-2:3.3 V CLOCK WAVEFORM.…………259FIGURE 7-3: OUTPUT TIMING MEASUREMENT CONDITIONS263FIGURE -4: INPUT TIMING MEASUREMENT CONDITIONS263FIGURE75:TvAL(MAX) RISING EDGE…………264FIGURE 7-6: TVAL(MAX) FALLING EDGE·265FIGURE77:TVAL(MIN) AND SLEW RATE……26510

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直流微网模型，电容电压和电感解耦控制，三相逆变，详细simulink model