基于维纳后滤波算法的单声道语音增强程序

网络摄像机组件属性和接口

基于LabVIEW的多功能信号发生器设计，可产生多种波形，幅度和相位可调。

【实例简介】·1.内容简介： --------------------------------------------------------------- 基于VHDL三层电梯控制器的设计.pdf pdf 设计论文 --------------------------------------------------------------- ·2.资源使用方法说明 无 --------------------------------------------------------------- ·3. wogeguaiguai的附言： 1.我的其他数学建模比赛和全国电子设计竞赛精华资源也欢迎您下载，大学生基本上都听过这个比赛吧，这个比赛比较有意思，而且获奖比例高。我的资料都是非常好的准备比赛要用的资料。我比赛结束之后，这些资料就不用啦，分享给大家！俺一年的搜索资源，同学们一朝即可获得！ 2.下载本文件后，您可以获得所有信息，不必再零散下载，给您带来很大的方便。 3.1个资源分，绝对物超所值。评论后，您就可以获得2个资源分，欢迎您评论！ --------------------------------------------------------------- ·4.如有问题，请在此留言，谢谢。 --------------------------------------------------------------- ·65.上传时间 2010-2-26-afternoon

基于matlab的mie散射计算程序，主要针对球体

stm32f4 驱动 w5300 固件库例程 接口使用8/16位数据总线 以太网

Bagging的策略： 从样本集中用Bootstrap采样选出n个样本 在所有属性上 对这n个样本建立分类器（CART or SVM or ） 重复以上两步m次 i e build m个分类器（CART or SVM or ） 将数据放在这m个分类器上跑 最后vote看到底分到哪一类

1.硬件﹑软件方案的设计说明。2.用PROTEL工具软件画出系统电路原理图，系统元件布局﹑布线图。3.系统的元器件清单。4.提供程序流程图。5.提供源程序清单（带中文注释）。6.提供系统的使用和操作说明。7.对创新设计和功能，请特别加以陈述。有闹钟 按键有无声转换 整点提示 闹钟状态查看日期 时间可调及转换显示

Lumped Elements for RF and Microwave Circuits英文版，射频微波电路入门Lumped Elements for RFand microwave circuitsFor a listing of recent titles in the Artech House Microwave library,turn to the back of this bookLumped Elements for RFand microwave circuitsInder bahlArtech houseBoston londonwww.artechhouse.comLibrary of Congress Cataloging-in-Publication DataBahl, I.J.Lumped elements for RF and microwave circuits /Inder Bahlp cm.--(Artech House microwave libraryncludes bibliographical references and indexISBN 1-58053-309-4(alk. paper1. Lumped elements(Electronics) 2. Microwave integrated circuits. 3. Radiofrequency integrated circuits. 4. Passive components. I. Title. II. SeriesTK7874.54B342003621.38132-dc212003048102British Library Cataloguing in Publication DataBahl, I. J. Inder jit)Lumped elements for RF and microwave circuits.-(Artech House microwave library1. Radio circuits 2. Microwave circuits I. Title621.38412ISBN1-58053-3094Cover design by Igor Valdmar2003 ARTECH HOUSE, INC.685 Canton StreetNorwood Ma 02062All rights reserved Printed and bound in the United States of America. no part of this bookmay be reproduced or utilized in any form or by any means, electronic or mechanical, includingphotocopying, recording, or by any information storage and retrieval system, without permissionn writing from the publisherall terms mentioned in this book that are known to be trademarks or service marks have beenappropriately capitalized. Artech House cannot attest to the accuracy of this information. Useof a term in this book should not be regarded as affecting the validity of any trademark or servicemarkInternational Standard Book Number: 1-58053-309-4Library of Congress Catalog Card Number: 200304810210987654321To my adorable grandsons, Karan and Rohan Kaushal, with whom I play, cry,and laugh, and who have provided me with the idea and inspiration towrite this bookContentsPrefaceXVAcknowledgmentsXXIntroduction1.1 History of Lumped Elcements)Why Use Lumped Elements for rF andMicrowave circuits1.3 L, C, R Circuit Elements1.4 Basic Design of Lumped Elements4.1 Capacitor1.4.2 Inductor4.3 Resistorumped-Element Modelin1. 6 Fabrication1.7 ApplicationsReferencesInductors2.1 IntroductionLumped Elements for RF and Microwave Circuits2.2 Basic Definitions2.2.1 Inductance2.2.2 Magnetic Energy182.2.3 Mutual Inductance202. 2. 4 Effective Inductance202.2.5Imedang2.2.6 Time Constant2.2.7 Quality Factor222.2.8 Self-Resonant Frequency232.2.9aximum Current Ratin2.2.10 Maximum Power Rating2.2.11 Other Parameters232.3 Inductor Configurations242.4 Inductor models2. 4. 1 Analytical Models252.4.2 Coupled-Line Appiroach282.4.3 Mutual Induse arppi342.4.4 Numerical Approach362.4.5 Measurement-Based model382.5 Coupling Between Inductors452.5. 1 Low-Resistivity Substrates2.5.2 High-Resistivity Substrates462.6 Electrical Representations2.6. 1 Series and Parallel representations2.6.2 Network Representations51References52Printed Inductors573.1 Inductors on Si Substrate583.1.1 Conductor Loss3.1.2 Substrate Loss3. 1.3 Layout Considerations3.1.4 Inductor Model3. 1.5 Q-Enhancement Techniques3.1.6 Stacked-Coil Inductor803.1.7 Temperature Dependence84

can总线协议，里面详细说明了can通信的协议规范。英文版的，原汁原味的。开发CAN接口的可以看看。

UCOSIII系统下按键外部中断和串口2中断管理，按键按下改变LED灯状态，串口2将接收到的数据发送出去。