QT 开启线程接收串口数据并由主线程界面实时显示心电波形图

希姆通公司sim868芯片的资料,下载后可以自己解压看.基本的详细资料

自己用simulink做的QPSK调制解调，含有成型滤波，接收匹配滤波，误码率统计等功能。需要在2010版本以上的matlab才能运行，需要的同志可以互相交流。

【实例简介】S-57格式海图测试数据，航海保证部IHO生产，内容包括C1100103.000、C1313100.000、C1513179.000、C1515591.000、C1613182.000，地图为渤海、黄海、东海、长江口，用于格式分析学习、软件解析测试，请勿用于商业用途。

此文档介绍了K60单片机的一些结构功能，纯中文。K60P144M1OOSF2RM. pdfK60 Sub-Family Reference Manual, Rev. 6. Nov 201夲部分讲解如何配置芯片上的嵌套向量中断控制器。完整信息清参阅htp/www.arm.com。InterruptsModulePPBNested VectoredModuleInterrupt Controller(NVIC)Module图32嵌套向量中断控制器题日相关模块参考链接套问量中断控制器http://www.arm.com系统内存映System memory map时钟Clock distribution电源管理Power management专用外设总线ARM Cortex-M4核心 ARM Cortex-M43.22.1中断优先级器件支持16级中断优先级,因此在嵌套向量中断控制器中,每一个中断源在优先级控制寄存器IP中都有4个位。例如IPRO中3302928a7262524232221a019181716|151413121110976543210R0000006000600000W3.22.2非可屏蔽中断非可屏蔽中断的中断源来自于外部的NM引脚。此引脚是多路复用引脚,必须要配置他的功能,使其成为外部不可屏蔽中断功能引脚。322.3中断分配中断默认按照下表分配向量号:当中断使用时,此值储存在栈中。IRQ号:非核心中断源,对应的编号为终端号减16。IRQ号在ARM的NVC文档中有描述表34中断号分配址址中断编号IRQ号非优先级编中断伏先溟模块描述(1)号(2)级编号(3)ARM核心中析源0x00000000ARM内核切始牟栈指针0x00000004ARM内核初始程序计数器Editbylie:soonli@qq.comK60P144M100SF2RM. pdfK60 Sub-Family Reference Manual, Rev. 6 NoV 2010x00000082AHM内核非可屏蔽中断x00000c3ARM内核哽件故障0x000000101ARM内核存储控制器故障0x0000145ARM内核总线故障0x000000186ARM内核用故障0x000001C70x00002080x0000219x00028100x000002C11ARM内核管理程序调入0x000003012ARM内核周试监控0x000034130x0000003814ARM内核0x0000315ARM内核系统往拍定时器非核心中新源0x00000040160DMADA通道0发送完成0x000000141DMADMA通道⊥发送完成0×00004818DMAD)MA通道2发送完成000401DMA通道3发送完成0x0000020DA通道4发送完成0300052DMA通道5发送完成0x00000582DMADMA通道6发送完成0x000_005C2sDMADMA通道7发送完成0x0000006021DMA通道8发送完成0x0000006425DMADMA通道9发送完成0x0000006826⊥0DMADMA通道10发送完成0x000006C27DMADMA通道11发送完成0x00007028DMA通道12发送完成0x000007429DMA通道13发送完成0x0000087314DMA通道1发送完成0x00007C3IMA通道15发送完成0x00000803216DMADMA通道0-15故障0x00000081MCM0x00000883184闪存命令执行完成0x000008C35闪存读取冲突0x0000009036模式控制掉电中断,电检测低澌喚醒单兀注意:在需要使用低漏检测0x00000094370低漏唤醒|的时候不要禁止这个中断0x000009838看门狗看门狗中断0x0000009c39230x00000A441IICIEditbylie:soonli@qq.com4K60P144M100SF2RM. pdfK60 Sub-Family Reference Manual, Rev. 6 NoV 2010x0000A84SPD所有中断源使用一个向量x0000AC4SPI1所有中断源使用一个向量0x000000B014SPI2所有中断源使用一个向量CR’ ed Message bufi0x000000B44529CANO(0-15)0x00000846CAND总线关闭0x0000BC47错误0x000000C048CANO发送报警x00000C449CANO接收报整0x000000C850CAND唤帼0x00000CC50x0000000520x000000D1537CAN⊥5)0x000000D8CANI总线关闭0x00000DC5CAN⊥错误0x000000E05610发送报警0x0000C457接收报警0x0000E858唤醒0x0000EC59100x0000F06011l⊥0000F461JJARTO串口0状态中新源0x00000F862UARTO串口0错误中新源0y000000FC11UARTI串口1状态中断源0x00010064UARTI串口1错昃中源x0000010465UART2串口2状态中新源000001085650UART2串口2错昃中粉溴0x000067UaRT串口3状态中新源0x000011068UART串口3错误中析源0x0001146gUART4串口4状态中析源00011870UART串口4错误中析源0x0000011C715513UART串口5状态中新源0x0000120721111111UART5串5错误中析源0x00001247370x000128740x00012c75CMPO0x00003076CMPI0x000013476115CMP20x000001387815FTM0所有中断源使一个向量0x000013C7963FTM1所有中断源使用一个向量0x00001408064FTM2所有中断源使用一个向量000014481160x0000014816报警中断Editbylie:soonli@qq.comK60P144M100SF2RM. pdfK60 Sub-Family Reference Manual, Rev. 6 NoV 2010x00014C8x0001508PITPIT通道00x000001518517PITPIT通道10x0000015886017PITPIT通道20x0000015C81PITPIT通道30x0000160882180x000016489USB OTx001689074充电检测0x0000016C|91Ethernet macIEEE1588定时器中断0x000017092Ethernet mac发送中断0x0000017497719Ethernet mac接收中断0x00001789EtherneL mac错误和其他中断0x00017C950x00000180|96SDH0x00184978120DACO0x000001889DACI0x0001899TsT所有中断源使用一个向量0x0000901008120x0000194101低功耗定时器00001981020x000019c10321引因控制模块PORTA引脚中断000001A0104引却控制模块PORTB引脚中断00004105引脚控制模块PORTC引脚中断0x0001AB106引閎控制模块PORTD引脚中断0x00000⊥AC10791引脚控制模块P0RTE引脚中断0×001B01080x000011090×00010701094软中断软件中断(4)(1)表示嵌套向量中断控制器的中断源号(2)表示嵌套向量中断控制器对于响应中断的ISER,ⅠCER,ISPR,ICPR和IABR寄存器的值,计算方法是IRQ的值除以32。(3〕表示嵌套向量中断控制器对于响应中断的IPR寄存器的值,计算方法是IRQ的值狳以4(4)此中断只能被NVC寄存器置位或者清零。3.2.2.3.1确定位域和寄存器的位置,来配置一个特定的中断如果你需要配置低功耗寄存器中断,下面的表格自“中断号分配”地址中断编号1RQ号非优先级编中断优先源模块描述号(2)级编号(3)0x0000019410」2⊥低功耗定时器译者注:下面角标的注解没有被列出,请看上表末尾。1)在NⅥC寄存器中,你需要配置关于中断的信息Editbylie:soonli@qq.comK60P144M100SF2RM. pdfK60 Sub-Family Reference Manual, Rev. 6 NoV 201· NVICISER2NVICICER2· NVICISPR2· NVICICPE2NVICIABR2NVICIPR212)确定特定中淅在相对应的寄存器中的特定位域(汗,这句话怎么这么别扭)。NVICISER2, NVICICER2, NVICISPR2, NVICICPR2, NVICIABR2 7位置=IRQ/32=21NⅥCIPR21位域的起始地址=8*(IRQ/4)+4=12因为 NVICIPR的位域的4位宽,所以 NVICIPR21的范围是12-15。因此,下列的位域的位是用来配置低功耗定时器的中断的。NVICISER2[21]NVICICER2[21NVICISPR2(21NVICICPR2[21NVICIABR2[211NVICIPR21[15: 123.2.3异步唤醒中断的配置夲节概述如何配置芯片中的相应模垬。在AM的文档中有更加完整的描述信息www.armcomClock logicWake-upquesynchronousModuleWake-up InterruptController(AWIC)Module图3-3异步唤醒单元主题相关模块参考链接系统存储映射System memory mat时钟Clock distribution电源管理Powcr managcmcnt嵌套向量中断控制器NVIC唤醒请求AWIC wake-up sources3.2.3.1唤醒源器件使用一下的内部或者外部异步唤醒输入模块Editbylie:soonli@qq.comK60P144M100SF2RM. pdfK60 Sub-Family Reference Manual, Rev. 6 NoV 201唤醒源描述可用的系统复位复位引脚和看门狗(当使用LPO时钟源吋),JTAG接口低电压检测模块控制器低电压警告模块控制器引脚中断引脚控制模块,任何一个中断使能的引胭都可以吹醒系统ADC「当使用内部时钟源的时候可是实现这个功能CMP由于没有系统时钟可以使用,所以此时是无效的LIC地址匹配唤醒接收眺变唤醒USB唤醒功能唤醒低功耗定时器在Stop/ⅥPS模式下有效实时时钟在Stop/ⅦLPS模式卜有效以太网魔法包唤醒SDIIC唤陧功能唤醒IIS唤醒功能唤醒1588时钟唤醒功能唤醒TSICAN3.2.3JTAG控制器配置本节概述如何配置芯片中的相应模块。在后面专门的章节中有更全面的介绍。JTAG controller图3-4JTAG控制器表38相关信息的参考链接题相关模块参考链接仝面介绍JT△GCJTAGC信号传输设置引脚控制Signal multiplexing3.3系统模块3.3.1系统集成控制模块(SIM)配置Editbylie:soonli@qq.comK6OP144M100SF2RM. pdf K60 Sub-Family Reference Manual, Rev. 6 Nov 201本节概述如何配置芯片中的相应模块。在后面专门的章节中有更全面的介绍PeripheralbridgeegisteracceSSResetsMode controller图35系统集成控制模块表39相关信息的参考链接主题相关模块参考链接全面介绍系统集成控制模块系统存储映射Systcm memory maj时钟Clock distribution电源管理Power management3.3.2模式控制器模块本节概述如何配置芯片中的相应模块。在后面专门的章节中有更全面的介绍。PeripheralbridgeRegistResetsMode controller图3-6模式控制模块表3-10相关信息的参考链接题相关模块参考链接全面介绍模式控制模块Mode controllerEditbylie:soonli@qq.comK60P144M100SF2RM. pdfK60 Sub-Family Reference Manual, Rev. 6 NoV 201系统存储映射System memory map电源管理Power management电源管理控制器PMO3.3.3电源管理控制模块本节概述如何配置芯片中的相应模块。在后面专门的章节中有更仝面的介绍PeriphebridgeRegisteraccessPower managementcontroller(PMC)图37电源管理控制模块表3-11相关信息的参考链接主题相关模块参考链接全面介绍PMCPMC系统存储映射System memory map电源管理Powcr managcmcnt面介绍Mode controller低漏唤醒单元LLWU3.3.4低漏唤醒单元节概述如何配置芯片中的相应模块。在后面专门的章节中有更全面的介绍。Editbylie:soonli@qq.com

压缩包里有一个内含1000个24位十六进制数的txt文件，假定这1000个数据为当前的RFID标签，本程序实现了从文件读取数据，转换格式后进行识别，并转换为原格式后按识别顺序输出到txt文档中，附带了记录程序运行时间的功能。注释略多，看不惯可以自己删，不过我也是出于让大家看懂的目的写的。如果明年有也写这个作业的学弟学妹，请不要照抄我的代码，希望大家能独立思考，我的这个只是一个参考，编程遇到问题可以联系我bhuhyq@foxmail.com，我很乐于提供帮助。

ofdm中的迭代注水，从而实现功率的最小化或速率的最大化。

使用镜头结构，可用于光学设计初始结构，可直接用zemax打开，包括9张图片格式目录。

可以用于逆变交流电的产生，也可以用于三相电的产生。

使用c语言编写各种管理系统，主要包括学生成绩管理、图书管理、学生信息管理以及二叉树的各种遍历，其中学生管理系统分别有堆栈和链表等方式实现。所有代码已经本人编译运行，绝对无错，下载后可立即使用！

imx274 datesheet，可以对接Hi3519V101，4K，分享一下SONYIMX274LQC-CAbsolute Maximum RatingsItemSymbolRatingsUnitSupply voltage(Analog)1ADD0.3to+3.3VSupply voltage(Digital 1)-0.5to+2.0Supply voltage(Digital 2)DDD20.5to+3.3VInput voltage(Digital)0.3toV。Dp+0.3VOutput voltage(Digital)-0.3toVD2+0.3Guaranteed operating temperature TOPR-30to+75°CStorage guarantee temperatureTSTG30to+80CPerformance guarantee temperature TsPEC10to+60Recommended Operating ConditionsItemSymbolRatingSupply voltage(Analog)VADD2.8±0.1Supply voltage(Digital 1)1.2±0.1VSupply voltage(Digital 2)1.8±0.1Input voltage(Digital)-0.1 to Vopp2+0.11 VADD: VDDSUB, VoDHCM, VoDHPX, VDDHDA, VDDHCP (2.8V power supplyVDDD1: VDDLCN, VDDLSC1 to 2, VDDLPA, VDDLPL1, VoDLPL2 to 3. VDDLIF (1.2V power supply)VDDD2: VDDMIO, VDDMIF (1.8V power supply)SONYIMX274LQC-CUSE RESTRICTION NOTICEThis USE RESTRIC TION NOTICE (Notice )is for customers who are considering or currently using theimage sensor products("Products")set forth in this specifications book. Sony Corporation Sony")mayat any time, modify this Notice which will be available to you in the latest specifications book for theProducts. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has itsown use restriction notice on the Products, such a use restriction notice will additionally apply betweerou and the subsidiary or distributor. You should consult a sales representative of the subsidiary ordistributor of sony on such a use restriction notice when you consider using the ProductsUse restrictionsThe Products are intended for incorporation into such general electronic equipment as office productscommunication products, measurement products, and home electronics products in accordance withthe terms and conditions set forth in this specifications book and otherwise notified by sony from timeYou should not use the Products for critical applications which may pose a life-or injury-threateningrisk or are highly likely to cause significant property damage in the event of failure of the products. Youshould consult your sales representative beforehand when you consider using the products for suchcritical applications. In addition, you should not use the products in weapon or military equipmentSony disclaims and does not assume any liability and damages arising out of misuse improper usemodification, use of the Products for the above-mentioned critical applications, weapon and militaryequipment, or any deviation from the requirements set forth in this specifications booklesign for SafetySony is making continuous efforts to further improve the quality and reliability of the products howeverfailure of a certain percentage of the products is inevitable. Therefore, you should take sufficient careto ensure the sate design of your products such as component redundancy, anti-contlagration featuresand features to prevent mIs-operation in order to avoid accidents resulting in injury or death fire orother social damage as a result of such failureExport ControlIf the Products are controlled items under the export control laws or regulations of various countriesapproval may be required for the export of the products under the said laws or regulationsYou should be responsible for compliance with the said laws or regulationsNo License Impliedo The technical information shown in this specifications book is for your reference purposes only. theavailability of this specifications book shall not be construed as giving any indication that sony and itscensors will license any intellectual property rights in such information by any implication or otherwiseSony will not assume responsibility for any problems in connection with your use of such information orfor any infringement of third-party rights due to the same. It is therefore your sole legal and financialresponsibility to resolve any such problems and infringementGoverning lawThis notice shall be governed by and construed in accordance with the laws of Japan, without referenceto principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relatingto this Notice shall be submitted to the exclusive jurisdiction of the Tokyo district Court in Japan as thecourt of first instanceOther Applicable Terms and ConditionsThe terms and conditions in the Sony additional specifications, which will be made available to you whenyou order the Products, shall also be applicable to your use of the Products as well as to thisspecifications book. You should review those terms and conditions when you consider purchasingand/or using the ProductsGeneral-0.0. 8SONYIMX274LQC-CContentsDescription---FeaturesDevice structureOptical Black Array and Readout Scan Direction---Absolute Maximum Ratings2233Recommended Operating Conditions---------------USE RESTRICTION NOTICEContentsOptical CePin Configuration------------------Pin description-------------------------458899hen using csl-2When using Sub-LVDS1210 Equivalent Circuit Diagram15Peripheral Circuit19System OutlineWhen using CSl-2When using Sub-LVDSElectrical Characteristics when using cs1-2--------------------------m---------------------------------21. DC Characteristics(CS1-2)a.8..4Current Consumption and Gain Variable Range(CSl-2Supply Voltage and l/O Voltage(CS1-2)2. AC Characteristics(CS1-222INCK, XCLR(CSl-2)22XHS, XVS(Output)(CSI-2)22IC Communication (CSI-2)23DMCKP/DMCKN, DMO(CSl-2Electrical Characteristics When Using Sub-LVDs-------------------m--------------------------1. DC Characteristics(Sub-LVDs)……Current Consumption and gain Variable Range sub-LVDS24Supply Voltage and l/o Voltage(Sub-LVDSLVDS Output DC Characteristics(Sub-LVDS2. AC Characteristics ( Sub-LVDS).........25INCK, XCLR, XVS(input), XHS (input)(Sub-LVDS25Serial Communication(Sub-LVDS)Sub-LVDS Output(Sub-LVDS)26Spectral Sensitivity Characteristics(CS1-2 and Sub-LVDS27Image Sensor Characteristics(CSl-2 and Sub-LVDS)-281. Zone Definition of Image Sensor Characteristics28mage Sensor Characteristics Measurement Method(CSl-2 and Sub-LVDS)1. Measurement conditions2. Color Coding of this Image Sensor and Readout..293. Definition of Standard Imaging Conditions29Setting Registers Using I"C Communication(When Using CSl-2Description of Setting Registers When Using I C communication31Pin Connection of Serial Communication Operation Specifications When Using I"C CommunicationRegister Communication Timing When Using I-C Communication12C Communication Protocol32Register Write and Read33Single Read from Random Location33Single read from current location; iidaiaii:;aaaa“Sequential Read Starting from Random LocationSequential Read Starting from Current Location34Single Write to Random Location35Sequential Write Starting from Random Location35Register Value Reflection Timing to Output Data(CSl-2)36SONYIMX274LQC-CSetting Registers Using Serial Communication (When Using Sub-LVDS)----------------37Setting Registers Using Serial Communication(Sub-LVDS).37Register Value Reflection Timing to Output Data( Sub-LVDS38Register Map…391. Description of Register2. Register Setting for Each Readout Drive Modeeadout Drive Modes( csl-2 and Sub-LVDS)---------------------551. Readout drive modes552. Relationship between Arithmetic Processing and the Number of Output bits in Each Readout Drive ModeImage Data Output Format When Using CSI-2--------------------------58Frame Format (CSI-2)58Frame Structure(CSl-258Embedded Data Line(CSl-2)59CSl-2 serial Output Setting(CSl-2)MIPI Transmitter(CSl-2)62Detailed Specification of Each Mode(CSl-2)---------------631. Horizontal/ Vertical Operation Period in Each Readout Drive Mode(CSl-22. Frame Rate Adjustment(CSl-23. Image Data Output Format CSl-265Vertical Arbitrary Cropping Function(CSl-2)-69Horizontal Arbitrary Cropping Function(CSl-272Electronic Shutter Timing When Using CSI-2------741. SHR, SVR, SMD Setting When Using CSl-2741-1. SHR, SVR Setting(CSl-2)741-2. Electronic Shutter Drive Mode(Csl-2)752. Integration Time in Each Readout Drive Mode and Mode Changes When Using CSl-2762-1. Integration Time in Each Readout Drive Mode(CSl-2762-2. Operation when Changing the Readout Drive Mode(CSl-2772-3. Low Power Consumption Drive in Integration Time When Using Roll ing Shutter Operation(CSl-2)78Image Data Output Format When Using Sub-LVDS--791. Sync Signals and Data Output Timing(Sub-LVDS)““792. Output Range of LVDS Output Data(Sub-LVDS)Detailed Specification of Each Mode(Sub-LVDS)删mHorizontal/Vertical Operation Period in Each Readout Drive Mode(sub-LVDs)..........2. Frame Rate Adjus咖ment(Sub-LVDS)……3. Image Data Output Format ( Sub-LVDS)Vertical Arbitrary Cropping(Sub-LVDS)Horizontal arbitrary cropping function(Sub-LVDS)----m94Electronic Shutter Timing When Using Sub-LVDS961. SHR, SVR Setting(Sub-LVDS)...962. SVR Operation (Sub-LVDS3. Electronic Shutter Drive Mode( Sub-LVDS)974. Integration Time in Each Readout Drive Mode and mode changes When Using Sub-LVDS984-1. Integration Time in Each Readout Drive Mode(Sub-LVDS984-2. Operation when Changing the Readout Drive Mode(Sub-LVDS994-3. Recommended Global Reset Shutter Operation Sequence(Sub-LVDS)1004-4. Interruptive Mode Change(Sub-LVDS4-5. Low Power Consumption Drive in Exposure Time (Sub-LVDS)…102Power-on/off Sequence when using CSI-2---1031. Power-on Sequence(CS2)……1032. Slew Rate Limitation of Power-on Sequence( CSI-21033. Power-off Sequence(CSl-2104Standby cancel sequence when using csl-2--------------------------105Power-on/off Sequence when using Sub-LVDS1161. Power-on Sequence(Sub-LVDS)1062. Slew Rate Limitation of Power-on Sequence(Sub-LVDS).........1063. Power-off Sequence(Sub-LVDS)107Standby Cancel Sequence(Sub-LVDs)------------108SONYIMX274LQC-CSpot Pixel specifications--109Spot Pixel Zone Definition109Notice on White Pixels SpecificationsMeasurement Method for Spot Pixels1111. Black or white pixels at high light1112. White pixels in the dark.3. Black pixels at signal saturated111Spot Pixel Pattern Specifications----------------m---------------------------------------------------112Stain Specifications---113Stain Zone definition113Stain Measurement method.113Relation between Image height and target Cra-----Marking---------mm---------------115Notes on Handling116Package outline ---118List of Trademark Logos and Definition Statements-------------119SONYIMX274LQC-COptical Center(Top View)Package outline10.70±0.1mmPKG lpinM1A1Optical centerM1010See page TBD Package Outl ine" for detailsOptical CenterPin ConfigurationBottom View)lpin index6666δ画δ尚画○●Bottom viewQ§③¤¤意○○○○○○○○10○o⑦A b CE F GMPin configurationSONYIMX274LQC-CPin DescriptionWhen using CS1-2Pin descriptionState inSymbolOADRemarks(CS|-2Standby modeLeave openA2TEST4ATest(No connectionA3VDDHDa Power a Analog power supply (2.8V)A4VDD SUB PowerAnalog power supply(2.8VA5VDDLSC1PowerD Digital power supply(1.2v)A6VssLSC1GNDDDigital GND(1.2V)A7VDDLPL3 Power D Digital power supply (1.2 V)A8VDDLIFowerDigital power supply(1.2v)Leave openB1TEST5ATest(No connectionB2ssHDA GND A Analog GND (2.8V)B3BIASRESResister connectionB4/BGRCapacitor connectionB5GNDD Digital GND (1B6XCLRReset pulse inputB7VssLPL3GNDDigital GND (1.2VB8 VsSLIF1 GND D Digital GND (1.2V)B9DMO4NDigital MiPl outputLow LevelData lane 4connectionB10DMO4P。DDigital MIPl outputLow LevelData lane 4connectionC1TESt3TestLeave open(No connectionC2XCECannect to 1.8 V power supplyLeave openC3TEST1D(No connectionC4TEST2estLeave open(No connectionC5VDDLPAPowerDDigital power supply(1.2v)C6 VDDLPL2 Power D Digital power supply (1.2V)C7 VssLPL2 GND D Digital GND(1.2V)c9DMO2NDigital MIPl outputLow LevelData lane 2connectionData lane 2C10DMO2PDigital MIPl outputLow LevelconnectionD1XHSDDDDHorizontal sync signal outputIf unused xHsleave openD2SDOlest outputLow Leve/ Leave openNo connectionVertical sync signal outpuf unusedⅩVSDleave openD9DMCKND Digital MIPl outputLow LevelClock laneconnectionD10DMCKPDigital MIPl outputLow levelClock LaneconnectionE1SCLDDDc communication clock inputC communication dataE2SDAOinput/outputSONYIMX274LQC-CPinPin descriptionSymbolADState inRemarksNoCS-2Stand by modeE3VSSLCBGNDDigital GND(1.2 V)E8VssLlF2GNDDigital GND(1.2 V)E9DMO1NE10DMO1POFVDDLSC2 PowerF2VssLSC3 PowerDDDDDDADData lane 1Digital MIPl outputLow LevelconnectionData lane 1Digital MIPI outputLow LevelconnectionDigital power supply (1.2 V)Digital power supply (1.2 v)F3VopHCMPowerAnalog power supply(2.8 V)F8INCKInput clockDMO3NDigital MIPl outputData lane 3Low LevelconnectionF10 DMO3PData lane 3Digital MIPI outputLow LevelconnectionG3VssHCPGNDAAnalog GND (2.8V)G8VssLSC2 GND D Digital GND(1.2V)G9VssMIF2 GNDD Digital GND (1.8VG10VoDMIFPowerDDigital power supply (1.8V)H1VDDLCN GND D Digital GND(1.2V)VsSLCNGNDDigital GND (1.2 VH3VopHCPPowerAnalog power supply(2.8VDLO2P( Pin for Sub-LVDS)Leave open(No connectionH9DLO2M000(Pin for Sub-LVDS)Leave open(No connectiH10DLOOP(Pin for Sub-LVDS)Leave open(No connection)VssHPX3 GND AAnalog GND(2.8 V)J3VoDHPXPowerDLO3PADDDAADDAnalog power supply(2.8 V)(Pin for Sub-LVDS)Leave open(No connectionDLO3MO00(Pin for Sub-LVDS)Leave open(No connection)J10DLOOMD(Pin for Sub-LVDS)eave open(No connection)K2VssLPL 1GNDDDigital GND(1.2V)K3 VDDLPL1 Power D Digital power supply(1.2V)K4VoDMIO Power D Digital power supply(1.8V)K5DLO1M(Pin for Sub-LVDS)Leave open(No connectionDLCKM0b「(Pin for Sub-LVDS)Leave open(No connection)Leave openK7DLCKPD(Pin for Sub-LVDS(No connectionLeave openK8DLO9PD(Pin for Sub-LVDS)(No connectionLeave openK9DLO9M(Pin for Sub-LVDS)(No connectionK10DLO5P(Pin for Sub-LVDS)Leave openNo connection