分散熵

PowerWorld GIC潮流计算和稳定性分析，GIC分布(PowerWorld Simulator case about GIC)

主要是对真彩色图像进行加密，分别对R,G,B三分量进行加密，实现对图像的加密(It mainly encrypts the true color image, encrypts the R, G, B three components respectively, realizes the encryption of the image.)

2018数模美赛A题海绵波浪简单性质的模拟。(Simulation of the simple properties of the sponge wave in the 2018 model A.)

帮助解决数学问题，同时内部包含诸多神经网络训练文件帮助参考(Test the simple function of the Mathmethetic.)

sine wave vhdl code that generates sine wave output using logibox in xilinx

说明：  2018年IEEE进化计算大会（CEC）提出的全局优化问题的新的启发式算法。 土狼优化算法（COA）是由Juliano Pierezan和Leandro dos Santos Coelho（2018）提出的用于全局优化的自然启发的元启发式算法，包含完整matlab代码。不同于灰狼算法，COA算法并没有等级制度。(In 2018, IEEE conference on evolutionary computation (CEC) puts forward a new heuristic algorithm of global optimization problems. Hyenas optimization algorithm (COA) is by Juliano Pierezan and Leandro DOS Santos Coelho, (2018) proposed a heuristic algorithm for global optimization of nature inspired, contains the complete matlab code. Of COA is different from the grey Wolf is not hierarchical)

企业库存管理系统，包括出库，入库，库存查询；单据打印；-enterprise inventory management systems, including warehousing, storage, inventory inquiry; Print documents;

算法优化非常好，几乎没有循环，有借鉴意义哦，毕设内容，高光谱图像基本处理。( Algorithm optimization is very good, almost no circulation, There are reference Oh, Complete set content, basic hyperspectral image processing.)

bellman-ford的模板，方便大家使用，可以直接粘贴使用-bellman-ford template to facilitate the use of paste can be directly used

说明：  】《微电子制造科学原理与工程技术》（第二版），作者：（美）Stephen A.Campbell。本书系统地介绍了微电子制造科学原理与工程技术，覆盖了集成电路制造所涉及的所有基本单项工艺，包括光刻、等离子体和反应离子刻蚀、离子注入、扩散、氧化、蒸发、气相外延生长、溅射和化学气相淀积等。对每一种单项工艺，不仅介绍了它的物理和化学原理，还描述了用于集成电路制造的工艺设备(】 &quot Microelectronics manufacturing science and engineering principles&quot (second edition), on: (United States) Stephen A. Campbell. This book introduces the principles of microelectronics manufacturing science and engineering technology, IC manufacturing involves covering all the basic individual techniques, including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, gas epitaxial growth, sputtering and chemical vapor deposition, etc.. For each individual process, not only describes its physical and chemical principles, but also describes the process used in integrated circuit manufacturing equipment)