lagrange插值

3D流场计算，程序简单非常容易看懂。适合初学者学习(3D flow field)

这是一本关于大型有限元模拟软件ABAQUS的英语书籍，从入门介绍到应用实例，还可以学习英文。如果你需要你一定会喜欢的。(English contents: 1. Introduction 2.Bar Element 3.Beam Element 4.Rigid Jointed Frames 5.Stress and Strain Analysis 6.Weighted Residual Methods 7.Finite Element Approximation 8.Numerical Integration 9.Plane Problems 10.Axisymmetric Problems 11.Thin and Thick Plates )

北京航空航天大学数值分析大作业第二题，有难度，这可是历年北航研究生转载最多的代码了(Beijing University of Aeronautics and Astronautics numerical analysis of large operating the second question, there is difficulty, this is the most over the years Beihang University Graduate reproduced the code)

工程领域，PR方程代码.用于计算混合工质性质。(PR equation code)

一款很好用的卫星重力异常布格校正Fortran90程序。(A very useful bouguer correction Fortran 90 program。)

最优潮流计算程序（使用电力系统专业，属于非线性规划问题）．(optimal power flow calculation procedure (using power systems professional, is Nonlinear Programming).)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

matlab程序—用burg方法计算太阳黑子爆发的周期(the matlab program-the frequency of the sunspot by the method of burg)

计算机常用数值算法与程序(C++版) (Commonly used numerical algorithm of computer and program )

数学中的通径分析问题，主要用于数学实验方面，计算数学中的数据分析(Path analysis of mathematical problems in)