N76E885_SC_Rev1.02

说明：  三星8G KLM8G1GEME emmc5.1 数据手册(Samsung 8G KLM8G1GEME emmc5.1 Data Manual)

说明：  Allwinner_A40i_User_Manual_V1.1 全志 a40i 用户手册(Allwinner_A40i_User_Manual)

说明：  一些经常遇到的AD元器件封装，希望能够有帮助。(Some Component Packaging)

说明：  适用于2023L芯片的液晶驱动板各种分辨率的驱动固件，适用于多种分辨率及各种尺寸的屏幕。(These files are used for chip 2023L with all kinds of sizes and PPI screen.)

W6100 WizNet MAC+PHY SPI接口网络芯片(W6100 WizNet MAC+PHY SPI Interface Network Chip)

说明：  fdc2214是电容检测传感器芯片 精度可达nf(Fdc2214 is a capacitance detection sensor chip with an accuracy up to NF)

三星8G KLM8G1GEME emmc5.1 数据手册(Samsung 8G KLM8G1GEME emmc5.1 Data Manual)

说明：  sony摄像头芯片sensor imx214硬件 规格说明48页，寄存器说明xls表，配置文件2个。硬件接口、引脚介绍。寄存器包扩所有寄存器说明，配置、默认值，还有OTP；数据格式、功能、状态、CSI Capability Registers ，Data Format Description ，Image Scaling Registers ，Image Scaling Parameter Limit Registers ，Static AF Camera Parameters(Sony camera chip sensor imx214 hardware specification 48 pages, register description XLS table, 2 configuration files. Hardware interface, pin introduction. Register package expands all register descriptions, configuration, default values, and OTP; data format, function, status, CSI capability registers, data format description ,Image Scaling Registers,Image Scaling Parameter Limit Registers ,Static AF Camera Parameters)

基于C8051F120的多芯片编程程序，包括TLV5618，TLV5630，HMC703，AD9953等(C8051F120 based multi chip programming procedures, including TLV5618, TLV5630, HMC703, AD9953 and so on)

hmc830锁相环设计原理图，可以参考一下(Hmc830 phase-locked loop design schematic diagram, you can refer to)