xixiaolifangzhen

说明：  包含了悉尼科技大学徐亦达老师的课程课件，有贝叶斯理论、EM算法、卡尔曼滤波、HMM、粒子滤波、概率论相关知识等(The file includes knowledge about EM, HMM, particle filter, kalman filter and so on.)

mumford source code........

三次样条插值的C语言算法,但是总是数据溢出(Cubic spline interpolation C language algorithm, but always data overflow)

贝叶斯统计推断相关资料和贝叶斯方法，学习贝叶斯不错的资料(Bayesian statistical inference related data and bayesian methods, learning bayesian good data)

FCT_VOF AND YOUNGS_PLIC fully functioning source codes Debugged and fully functioning source codes Both can be used to calculate by choosing the icase for (1) the Zalesak rotational flow problem (2) the shear flow problem This complete set includes both FCT_VOF and Youngs_plic source code in f90. Including a input data file. The codes have been debugged and tested using MS-FORTRAN. Results can be obtained directly from the output files and loaded to get results. (FCT_VOF AND YOUNGS_PLIC fully functioning source codes Debugged and fully functioning source codes Both can be used to calculate by choosing the icase for (1) the Zalesak rotational flow problem (2) the shear flow problem This complete set includes both FCT_VOF and Youngs_plic source code in f90. Including a input data file. The codes have been debugged and tested using MS-FORTRAN. Results can be obtained directly from the output files and loaded to get results. Ps: statement CALL WRITER needed to be removed and replaced with usual output statement fsuch as: Write(*,*) x(I,j),y(I,j),fi(I,j)…. Etc., for user’s requirement. )

学习用UMAT程序，用于abaqus隐式计算的Johnson-cook模型，有所修改(Learn UMAT program for abaqus Johnson-cook implicit calculation model, some modifications)

说明：  这个程序是关于轴承刚度方程的MATLAB程序(This program is about the bearing stiffness equation MATLAB program)

主要是基于mtlab的程序，在matlab环境中自动识别连通区域的大小,pwm整流器的建模仿真。( Mainly based on the mtlab procedures, Automatic identification in the matlab environment the size of the connected area, Modeling and simulation pwm rectifie.)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

利用FFT估计正弦信号的频率,要估计一个叠加了高斯白噪声的正弦信号 的频率 ，可以通过对x(n)做傅里叶变换，得到频谱图，找出幅度的最大值对应的频率值 ，进行多次变换，求出均方误差 。改变信噪比SNR，通过仿真可以得出随着信噪比增加，均方误差减小。(Sinusoidal signal using FFT frequency estimation, to estimate a Gaussian white noise superimposed on the frequency of sinusoidal signals, can be achieved by x (n) be the Fourier transform to get spectrum to identify the magnitude of the frequency value corresponding to the maximum , several transformations, find the mean square error. Change the signal to noise ratio SNR, the simulation can be drawn as the SNR increases, the mean square error decreases.)