leachvsdeec

ARM 指令集， 翻译：寒蝉退士， 译者声明：译者对文档的内容做了订正和改动，译者对文档不做任何形式的担保并且不承担任何责任，译者对文档不拥有任何权利并且不负担任何义务。-ARM instruction set, translation: chilling back with disabilities, translator statement: translator for the content of the document and make the revised changes, the translator of the document to make any form of guarantee and does not assume any responsibility, the translator of the document does not possess any rights and do not bear any obligation.

C-vrptw-sol C-vrptw-sol

数据结构中树的遍历，包括递归和非递归遍历 结构很完整-data structure traversal of the tree, including recursive and non- recursive structure is complete traversal

可以进行压缩感知的图形处理，是一部分进行压缩感知处理的图形实例和去噪处理，是现在的一部公开课的编程部分资料，可以实现简单的压缩感知图形采样的应用(Graphics processing with compressed sensing can be used as a Graphics instance and denoising part of compressed sensing processing. Now it is a programming part of an open class, which can realize simple compressed sensing graphics sampling application.)

此文件为液晶驱动芯片 为三星的KS0093 主要用在COG上-this document for LCD driver chips for Samsung KS0093 spent mainly on the COG

三相PFCmatlab仿真，双环控制，对于初学者有很好的参考价值(Three-phase PFCmatlab simulation, double loop control, for beginners have a good reference value)

说明：  将模糊系统与神经网络相结合采用模糊神经网络的方法预测水质(Fuzzy neural network to predict water quality)

说明：  压缩感知中的一些基础重构算法，适合新手入门。(Some basic reconstruction algorithms in compressed sensing are suitable for beginners)

一个短线交易的EA，高频率开单，可快速翻仓(A short line trading EA)

说明：  】《微电子制造科学原理与工程技术》（第二版），作者：（美）Stephen A.Campbell。本书系统地介绍了微电子制造科学原理与工程技术，覆盖了集成电路制造所涉及的所有基本单项工艺，包括光刻、等离子体和反应离子刻蚀、离子注入、扩散、氧化、蒸发、气相外延生长、溅射和化学气相淀积等。对每一种单项工艺，不仅介绍了它的物理和化学原理，还描述了用于集成电路制造的工艺设备(】 &quot Microelectronics manufacturing science and engineering principles&quot (second edition), on: (United States) Stephen A. Campbell. This book introduces the principles of microelectronics manufacturing science and engineering technology, IC manufacturing involves covering all the basic individual techniques, including photolithography, plasma and reactive ion etching, ion implantation, diffusion, oxidation, evaporation, gas epitaxial growth, sputtering and chemical vapor deposition, etc.. For each individual process, not only describes its physical and chemical principles, but also describes the process used in integrated circuit manufacturing equipment)