learn_struct_K2

代码为偏最小二乘法计算过程的代码，主要部分都有中文解释(Code for the calculation process of partial least squares method)

使用C编写的复数矩阵求逆，使用高斯消去法，已经和matlab结果做过对比，无误(Written in C and the complex matrix inverse, using the Gaussian elimination method, has been done and matlab results contrast, correct)

关于常用的FORTRAN算法，该书有关于线性方程组的求解，矩阵特征值的计算，常微分方程组的求解等(FORTRAN on the commonly used algorithms, the book on the linear equations, eigenvalue calculation, solving ordinary differential equations, etc.)

针对多期随机规划问题，利用情景树方法来求解(For multi-period stochastic programming problems, the use of scenarios to solve Tree)

根据极限状态方程，计算结构的可靠度和敏感度程序(According to limit state equation, the calculation of structural reliability and sensitivity procedures)

计算流体力学软件Fluent中所有的曳力模型UDF程序(Fluent CFD software, all of the drag model for UDF)

用遗传算法求解主动悬架系统的例程，里面附有程序求解的数据以及图形！是个很好的例子(A Genetic Algorithm for Active Suspension System routines)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

该程序用fortran90编写，时域有限差分（FDTD)中的近远场变换方法。解决了电磁波后向散射中的RCS计算(FORTRAN90 prepared with the program, finite difference time domain (FDTD) in the near field to far field transformation method. Resolved backscattering of electromagnetic waves in the RCS calculation)

实现多项式相乘求模运算，并且模多项式是可以改变的，方便，简单(To achieve polynomial multiplication modulo operation, and polynomial model can be changed, convenient and simple)