Riemann-problems

说明：  Dijkstra算法与Floyd算法的matlab实现，以求解最短路问题(Dijkstra algorithm and Floyd algorithm matlab realize in order to solve the shortest path problem)

TDMA solver for tridiagonal matrix

编制了theta映射法的ansys蠕变子程序(a creep subroutine of ansys that considered the theta-projection method)

说明：  线性判别分析（LDA，全称Fisher Linear Discriminant Analysis）算法的C#实现源码，根据stprtool box for matlab中的LDA.m编写。用到MathNet库做相关的矩阵运算，使用zedgraph控制绘图。有简单的测试数据。( C# source code of linear discriminant analysis (LDA, full name of the Fisher Linear Discriminant Analysis) algorithm , according to LDA.m of stprtool box for matlab . Use MathNet library to do matrix operations,and use zedgraph control for drawing. Thers has a simple test data.)

利用abaqus软件建模，然后将inp文件导入flac软件中。(ABAQUS software is used to model, and then the InP file is imported into the FLAC software.)

说明：  在学习数字信号处理算法程序中用VC编写的几个通用算法程序。 卷积计算/DFT与FFT实现/(In the learning process of digital signal processing algorithms using VC General Algorithm for the preparation of several procedures. Convolution calculation/DFT and FFT realization /)

多导体传输线之间的串扰问题，通过BLT方程求解。(Crosstalk between the multi-conductor transmission line problem solving BLT equation.)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

脂润滑滑块接触滑块的计算方法，给定雷诺方程和膜厚方程，然后用迭代方法计算压力分布和膜厚分布，以及承载能力(Greased slide contact with the calculation method of the slider, a given Reynolds equation and the film thickness of the equation, and pressure distribution and film thickness distribution, as well as carrying capacity is then calculated by using iterative methods)

针对随机结构随机激励下的动力响应概率分布求解，基于广义概率密度方法(the calculation of the generalized probability density function)