CZM_for_instability

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

说明：  单悬索采用多次迭代计算的方法 找形-计算 可用于输电线建模分析。(Single suspension method using multiple iterations to find form- can be used to calculate the transmission line modeling)

说明：  利用该方程组求解一般的线性方程组，别且符合数学求解原理(Using the equations of linear equations in general, do not and in accordance with principles of mathematics to solve)

arithemetic code on visual c++

脉冲响应的相关分析算法并检验，计算一维光子晶体的透射特性和反射特性，有较好的参考价值。( Related impulse response analysis algorithm and inspection, Calculated transmission characteristics and reflection characteristics of the one-dimensional photonic crystals, There are good reference value.)

计算改进型SVSLMS算法，在初始收敛速度，时变系统分析能力等方面优于传统的LMS算法(Improved SVSLMS calculation algorithm, the initial convergence rate, time-varying systems analysis capability is superior to the traditional LMS algorithm)

给定求解区间，用最小二乘法给出函数的零点，并给出迭代次数(Given the solution interval, the zeros of the function are given by the least square method, and the number of iterations is given.)

说明：  求解黎曼问题格式Roe格式FORTRAN编程(Solution of Riemannian problem format roe format FORTRAN programming)

abaqus中的三微裂纹扩展，一起学习下(the abaqus of three micro-crack propagation, with learning under)

说明：  使用fortran编写的无网格（光滑质点流体动力学）SPH算法(using FORTRAN prepared by the non-grid (smooth particle hydrodynamics) SPH algorithm)