huxiangguan

求解一维Eluer方程，计算一维激波管问题，lax_wendroff(Solving one dimensional Eluer equation to calculate the one-dimensional shock tube problem, lax_wendroff)

说明：  这是一个处理脑电信号的程序，可以辅助脑电信号处理程序的使用(This is a process of eeg signal, can assist the use of eeg signal processing program)

考虑地球J2项摄动的轨道积分器，变步长，基于龙格库塔78阶，(orbital integrator considering the J2 pertubation, based on the Runge-Kutta 78 integrator, use automatic step control)

对加速度数据进行二次积分，最终得到位移数据。(Double integration of acceleration data and the final displacement data.)

说明：  求任意一点到任意点的距离的最小值！ 对于求解一些最短距离的问题可以提供一些帮助！(seek any point to any point of the minimum distance! For some of the shortest distance to solve the problem, it can provide some help!)

最小二乘法在二维平面测向交叉定位里的应用(The least squares method in the two-dimensional plane measured to cross positioning)

基于K均值的PSO聚类算法,matlab小波分析程序，小波包分析提取振动信号中的特征频率。( K-means clustering algorithm based on the PSO, matlab wavelet analysis program, Wavelet packet analysis to extract vibration signal characteristic frequency.)

程序是庄茁大神经典的Johnson-Cook模型隐式算法 另外包括一个 ABAQUS-Standard用户材料子程序实例的文档说明(The program is a classic Johnson-Cook model implicit algorithm and it includes documentation of an ABAQUS-Standard user material subroutine example)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

fluent软件UDF，用于焊接过程模拟，是高斯分布的面热源。(weld heart source)