PM-DOAandL-2-DOA

两种SQR迭代法:将x^K与上次计算的结果做加权平均作为最后结果(Two kinds SQR iterative method:the x ^ K and the results of the last calculated as a weighted average of the final results do)

基于Laguerre多项式的拟合程序，可以控制多项式的结束，以及变量alpha。(Based on Laguerre polynomial fitting procedure, you can control the end of polynomials, and variable alpha.)

三维FDTD近远场变换程序,为时域近远场变换(three dimension FDTD near to far program)

fluent模拟焊接，熔滴过渡的质量源项(Welding Simulation， mass source)

sar图像去噪的几种新的方法，数学方法是部分子空间法，实现典型相关分析。( Several new methods sar image denoising, Mathematics is part of the subspace, Achieve canonical correlation analysis.)

用C语言实现解决约瑟夫问题的一种方法，也许会对他人有启示。(C language implementation with a way to solve the problem, Joseph, and perhaps others, would be revealing.)

计算半方差，如果按克里金法计算插值要求计算半方差，用此程序可实现。(Calculation of semi-variance, if the Kriging interpolation method call for the calculation of semi-variance, using this procedure can be realized.)

一个对Fluent中k-e湍流模型的修正udf程序，c语言(One pair ke turbulence model in Fluent udf amendment procedures)

说明：  基2基4基8以及分裂基的fft算法，代码效率很高。是难得一见的好代码。应用范围很广。(Radix-2-4-based 8 and split fft-based algorithm, a high code efficiency. Is a rare good code. Application of a very wide scope.)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)