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同时正交匹配追踪算法的MATLAB程序，一些文献中也被翻译成同步正交匹配追踪。(Simultaneous Orthogonal Matching Pursuit(SOMP))

以随机的中弱大气湍流为背景，可用于计算大气湍流下准直高斯光束的光强分布，光束扩展以及光束角漂移(The random weak atmospheric turbulence as the background can be used to calculate atmospheric turbulence of collimated Gaussian beam intensity distribution and beam propagation and beam angle drift)

说明：  该程序适用于GPS接收机定位精度因子DOP值计算(GPS DOP value)

一维欧拉方程计算，集合了Lax-Friedrichs，Richtmyer，MacCormack，Steger-Warming，Van Leer，AUSM，Zha-Bilgen，Godunov，Osher，Roe，Rusanov，HLL(HLLE)，HLLL，AUFS方法(One dimensional Euler equation, including Lax-Friedrichs, Richtmyer, MacCormack, Steger-Warming, Van Leer, AUSM, Zha-Bilgen, Godunov, Osher, Ro, Rusanov, HLL(HLLE), HLLL, AUFS)

西安交大陶老师经典SIMPLER算法程序，Fortran编写，对学习CFD很有帮助！(Tao, Xi' an Jiaotong University Teachers classic SIMPLER algorithm program, Fortran write, to learn CFD helpful!)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

此程序用最小二乘法拟合椭圆图像，模拟地球的形状(This program fit ellipse images using the least squares method to simulate the Earth' s shape)

它是一个计算热通量的c++程序，用udf导入fluent，既可以求解，非常好用的一个，可以作为入门的一个例子学习。(it is a calculated heat flux of c++ program, with udf into fluent, not only can solve, very easy to use one, can be used as a case study entry.)

book on markov models and techniques

1维等离子体FDTD的Matlab的两种方法(One-dimensional FDTD plasma of the two methods of Matlab)