crackprop_modeI_lefm_xfem_cpe4

气泡根据内外压力差变化的动网格。。。。。。(bubble dynamic mesh )

burgers方程求解，采用fortran编写，有详细的说明，效果非常好(burgers equations, using fortran prepared a detailed description of the effect is very good)

说明：  重力异常正演代码，请好好使用它。帮助学习。。。。(Gravity anomaly forward code, please use it well. Help learn)

DFP法求优化问题的C++源代码，经测试，该程序运行正常，得到了预期的结果。(DFP method for the optimization of C++ source code, tested, the program works correctly to get the desired results.)

说明：  matlab程序，有约束最优化问题直接法--复合形法(matlab program, constrained optimization problems are the direct method- the complex method)

该程序用于瞬变电磁勘探近区场计算，只要输入不同参数便可以得到近区场的视电阻率(The procedure transient electromagnetic exploration for near field calculations, as long as the input parameters can be different near field apparent resistivity)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

计算流体力学软件Fluent中所有的曳力模型UDF程序(Fluent CFD software, all of the drag model for UDF)

车间调度问题主程序,需要进行自主参数设计(Shop scheduling problem the main program, the need for self-Parameter Design)

说明：  该蠕变子程序能够进行高温长时间应力下的应力应变分析以及松弛行为(The creep subroutine can be used for stress-strain analysis and relaxation behavior under high temperature and long time stress)