SUBROUTINE-FILM-DFLUX01-pavement-r

分享一个外国人编写的FDTD程序,可以用来计算微带线和微带贴片天线,程序中采用的是均匀网格划分,但也可以在容易地在它基础上改写成非均匀网格.其边界条件与Sheen的程序不同,这里采用二阶技术.(Prepared to share a foreigner FDTD procedures, can be used to calculate the microstrip lines and microstrip patch antenna, the procedure used is uniform mesh, but can also easily rewrite it into the basis of non-uniform grid. its boundary conditions with different processes and Sheen, where second-order technology.)

Generic templates of algorithms for sparse matrixs

一种新的计算马氏距离的算法，算法采用二次协方差矩阵操作，进而使距离考加入相对性因素。(a new Mahalanobis distance calculation algorithm, the algorithm using quadratic covariance matrix operations, thereby enabling the relative distance to take factors.)

幂律分布的数据案例，这个案例数据有助于理解幂律分布的计算公式。(The case of power-law distribution of data, case data will help to understand the power-law distribution formula.)

滑动轴承接触滑块的计算方法，给定雷诺方程和膜厚方程，然后用迭代方法计算压力分布和膜厚分布，以及承载能力(The calculation method of the sliding bearing contact with the slider, a given Reynolds equation and the film thickness of the equation, and then calculated using iterative methods pressure distribution and film thickness distribution, as well as carrying capacity)

是一个基于Fortran语言计算 第一主应力 和 第三主应力 结构数值计算方便的代码(Fortran language is a calculation based on the first principal stress and the third principal stress code structure to facilitate numerical calculation)

五点差分法(matlab)解椭圆型偏微分方程方程,分法,偏分,五点差分,椭圆型,偏微分方程(Five-point difference method (matlab) solutions of elliptic partial differential equations, sub-law, partial points, five-point difference, elliptic partial differential equations)

根据传热理论, 建立了大功率发光二极管的有限元模型. 选择了4 种键合材料( 高导热导电 银胶、纳米银焊膏, 大功率芯片键合胶、Sn70Pb30) , 4 种基板材料( Al2O3、A lN、A-l SiC、铜钼合金) . 采用ANSYS 有限元热分析软件进行了温度场仿真, 得到了大功率发光二极管封装材料的最优选 择. 研究了基板厚度、芯片输出功率及外接热沉时对发光二极管结温的影响.(Heat transfer theory, the finite element model of the high-power light-emitting diode. Choose four kinds of bonding material (high thermal conductive silver glue, nano-silver paste, high-power chip bonding glue Sn70Pb30) substrate material ( Al2O3, A lN, Al SiC, copper molybdenum alloy). temperature field simulation using ANSYS finite element thermal analysis software, the optimal choice of high-power light-emitting diode packaging materials. substrate thickness, chip output power and external heat Shen light-emitting diode junction temperature.)

C#写的两个简单的小程序，分别用牛顿插值法和三次样条插值法来进行插值。(A program written by C#. It uses Newton Interpolation Method and Spline Interpolation Method )

将txt数据转换为LMS test.lab软件所能接受的格式(Change the txt format file to Unv file which can be read into the famous vibration test software LMS test.lab)